Mar 13, 2012 
AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that it will highlight NC258, NC265LR, NC275LR & SN100C at the upcoming SMTA Indiana Expo & Trade Forum, scheduled to take place Tuesday, March 20, 2012 from 10 a.m.-3 p.m. at the Ritz Charles in Carmel, IN.
AIM’s most robust solder paste, NC258, has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 Solder Paste reduces defects such as voiding and head-in-pillow. The superior wetting ability of NC258 results in bright, smooth and shiny solder joints. Additionally, the paste offers very low post-process residues that remain crystal clear even at the elevated temperatures required for today’s lead-free alloys.
Also at the show will be two popular no-clean spray fluxes: NC265LR and NC275LR. AIM’s alcohol-based NC265LR and VOC-free NC275LR are halide-free, no-clean liquid fluxes formulated to offer a very wide process window allowing for extremely good wetting, even to difficult-to-wet materials. NC265LR and NC275LR offer low post-process residues and have proven to reduce preventative maintenance requirements for spray fluxing applications. These fluxes are compatible with a broad range of lead-free and tin-lead solder alloys.
Additionally, the company will highlight its tin-lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior Co. Ltd. in Japan that is comprised of tin-copper-nickel + germanium.
For more information about AIM, visit www.aimsolder.com.
