SMT, PCB Electronic Industry News

News Releases from Nihon Superior Co., Ltd.

Read Nihon Superior Co., Ltd. company news


139 news releases added by Nihon Superior Co., Ltd.

Company Information:

Nihon Superior Co., Ltd.

Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.

Osaka, Japan

Manufacturer of Assembly Material, Soldering

  • Phone 81-(0)6-6380-1121
  • Fax 81-(0)6-6380-1262

Nihon Superior Co., Ltd. website

Company Postings:

(6) products in the catalog

(4) technical library articles

(139) news releases

Nihon Superior to Exhibit the New SN100CV Solder Alloy at NEPCON China

Apr 03, 2018 | Nihon Superior will exhibit in Stand 2L31 at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Rebrands SN100C Alloy with New Logo

Mar 27, 2018 | Nihon Superior Co.is pleased to introduce its new SN100C logo. The logo replaces the originally used SN100C logo and will be used worldwide to brand this important alloy. The announcement was made during the recent IPC APEX EXPO in San Diego.

Tetsuro Nishimura Earns IPC Distinguished Committee Service Award

Mar 22, 2018 | Nihon Superior today announced that its President Tetsuro Nishimura has received a Distinguished Committee Service Award in recognition and acknowledgement of his extraordinary contributions to IPC and the electronics industry. IPC – Association Connecting Electronics Industries® presented the award at the recent IPC APEX EXPO that took place at the San Diego Convention Center.

Nihon Superior to Introduce New SN100CV Solder Alloy at APEX

Jan 28, 2018 | Nihon Superior will exhibit in Booth #1019 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in California. The company will introduce the new SN100CVTM P608 D4 solder paste and NS-F851 rosin-based flux, and show the ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Solves Industry Challenges with New Solder Pastes – Visit Booth #532 at SMTAI

Aug 15, 2017 | Nihon Superior will exhibit in Booth #532 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Aug 10, 2017 | Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.

Nihon Superior Wins a 2017 NPI Award for the Latest SN100CVTM Lead-Free No-Clean Paste

Feb 16, 2017 | Nihon Superior announces that it has been awarded a 2017 NPI Award in the category of Soldering Materials for its SN100CV P506 D4 Lead-Free Solder Paste. The award was presented to the company’s President, Tetsuro Nishimura during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining

Jan 10, 2017 | Nihon Superior will exhibit in Booth #2610 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Aug 30, 2016 | Nihon Superior Co. will exhibit in Booth #418 at SMTA International, scheduled to take place September 27-28, 2016 at Donald Stephens Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments

Mar 09, 2016 | Nihon Superior is pleased to announce a great turnout for its 50-year anniversary celebration. The event took place at the Geihinkan Guest House of the Expo ’70 Commemorative Park. The celebration began with a sightseeing tour to Kyoto, followed by the anniversary celebration dinner with cask opening ceremony.

Anniversary celebration dinner with cask opening ceremony.

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

Feb 16, 2016 | Nihon Superior will exhibit in Booth #2610 at the IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

SN100CVTM P506 D4.

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

Dec 28, 2015 | Nihon Superior will exhibit in East Hall 1 E3-18 at NEPCON Japan, scheduled to take place Jan. 13-15, 2016 at the Tokyo Big Site in Japan. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

SN100CVTM P506 D4 is a lead-free, no-clean solder paste with its basic composition of (Sn-Cu-Ni+Ge+Bi).

Nihon Superior to Hold 50th Anniversary Celebration in Japan

Oct 21, 2015 | Nihon Superior Co. is pleased to announce that its 50-year anniversary celebration will take place Oct. 23, 2015 at the Geihinkan Guest House of the Expo ’70 Commemorative Park. The celebration will kick off on Oct. 22 with a sightseeing tour to Kyoto, followed by the anniversary ceremony on Oct. 23, and will conclude with a sightseeing tour to Hyogo prefecture (Kobe) on Oct. 24.

Tetsuro Nishimura, President of Nihon Superior Co.50th Anniversary Celebration in Japan.

Nihon Superior President Tetsuro Nishimura Recognized as Best Inventor during SMTAI

Oct 11, 2015 | Nihon Superior announces that Tetsuro Nishimura was awarded Best Inventor by SMT Today Magazine during the recent SMTA International Conference & Exhibition. The award was presented to Mr. Nishimura on Tuesday, Sept. 29, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Best Inventor Award recognizes an individual or team whose innovation/s have not only addressed a need and solved a problem but have also been used to drive improved efficiency, productivity and performance within the electronics manufacturing industry.

Tetsuro Nishimura, President of Nihon Superior.

Nihon Superior to Celebrate Its 50th Anniversary and Showcase New Developments at SMTAI

Aug 26, 2015 | Nihon Superior Co. will exhibit in Booth #419 at SMTA International, scheduled to take place Sep. 27 - Oct. 1, 2015 at the Donald Stephens Convention Center in Rosemont, IL. This year, Nihon Superior will celebrate its 50th anniversary since first introducing joining materials to the market. The most well-known solder; SN100C® has seen its 15th anniversary and its usage is still expanding. The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Acknowledged for 2015 SMTAI Sponsorship

Jun 21, 2015 | Nihon Superior Co. will sponsor the SMTA International Conference & Exhibition, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Nihon Superior is a Refreshment Break Sponsor.

Nihon Superior Announces Successful Product Launches at NEPCON Japan

Jan 27, 2015 | Nihon Superior recently exhibited at NEPCON Japan at the Tokyo Big Sight in Japan. The company had a successful show with high interest in its newly developed products and several new technologies.

Alconano Nano-Silver Paste.

Nihon Superior to Exhibit the Proven SN100C Alloy at the IPC APEX EXPO

Jan 19, 2015 | Nihon Superior Co. will exhibit in Booth #739 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste.

SN100C P506 D4 lead-free, no-clean solder paste.

Keith Sweatman Co-Authors Paper for SMTAI Technical Sessions

Aug 28, 2014 | Nihon Superior Co. Ltd. announces that Keith Sweatman will present the paper titled ”Enhancing the Impact Properties of Tin-Copper and Tin-Copper-Nickel Lead-Free Solders with Trace Additions of Zinc, Indium and Gold” at the upcoming SMTA International exhibition.

Keith Sweatman

Nihon Superior to Bring the Latest Developments in Solder Technology to SMTAI

Aug 26, 2014 | Nihon Superior Co. Ltd. will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

Nihon Superior Opens New Southeast Asia Headquarters

Jun 19, 2014 | Nihon Superior Co. Ltd. announces that it has opened a new regional headquarters – Nihon Superior Asia Sdn. Bhd. (NSA), in Petaling Jaya, Malaysia.

Nihon Superior Thanks SN100C Licensees and Partners

May 07, 2014 | Nihon Superior Co. Ltd. is pleased to announce its success from the recent IPC APEX EXPO in Las Vegas, Nevada.

Nihon Superior’s New General Purpose Solder Wire Wins a 2014 NPI Award

Mar 26, 2014 | Nihon Superior Co. Ltd. announces that it has been awarded a 2014 NPI Award in the category of Cored Wire for its SN100C (031) Lead-free Flux-Cored Solder Wire.

SN100C

Nihon Superior Brings Cutting-edge Pastes to the IPC APEX EXPO

Feb 19, 2014 | Nihon Superior Co. Ltd Nihon Superior will exhibit in Booth #2353 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

Nihon Superior to Launch New Advanced Pastes at INTERNEPCON Japan

Jan 07, 2014 | Nihon Superior Co. Ltd. announced that it will exhibit in EAST 3-27 at the upcoming INTERNEPCON 2014, scheduled to take place January 15-17, 2014 at the TOKYO BIG SITE in Tokyo, Japan.

Nihon Superior to Sponsor FIRST® Robotics Competition at SMTAI

Oct 09, 2013 | Nihon Superior Co. Ltd.will sponsor the FIRST Robotics competition at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

Nihon Superior to Showcase SN100C Lead-free Solder Alloy at Productronica

Oct 08, 2013 | Nihon Superior Co. Ltd. will exhibit in Hall A4, Stand 451 with Balver Zinn Josef Jost GmbH & Co. KG at the Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

 SN100C

Nihon Superior’s Keith Sweatman to Introduce Novel Lead-Free Alloy for Elevated Temperature Service at SMTA International

Sep 17, 2013 | Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place October 12-17 at the Fort Worth Convention Center in Texas.

 Keith Sweatman

Nihon Superior to Address Soldering Challenges at NEPCON South China

Jul 29, 2013 | Nihon Superior Co. Ltd will exhibit in Stand 2B20 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental protection, and process yields.

SMART Group Invites Keith Sweatman to Present at the SMART Group European Conference

Jun 20, 2013 | Nihon Superior Co., Ltd., announces that Keith Sweatman was invited to speak at the SMART Group European Conference on behalf of its UK distributor DKL Metals Ltd.

Nihon Superior Congratulates FCT Assembly and Krayden, Inc. on Milestone Anniversaries

Mar 13, 2013 | Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, congratulates its licensee FCT Assembly (www.fctassembly.com) on its 10-year milestone anniversary being celebrated this year.

From left to right: Mike Scimeca, President of FCT Assembly, Tom Scimeca, President of FCT Asia, Tetsuro Nishimura, President of Nihon Superior, and Wayne Wagner, President of Krayden, Inc.

Nihon Superior Collects an NPI Award for Its SN100C P604 D4 Solder Paste

Feb 20, 2013 | Nihon Superior Co., Ltd. announces that it was awarded a 2013 NPI Award in the category of Soldering Materials for its SN100C P604 D4 Lead-free and Completely Halogen-Free Solder Paste.

OK International has announced that its Metcal brand is the premier sponsor of the second annual IPC APEX EXPO® Hand Soldering Competition and IPC World Championship, scheduled to take place February

Jan 18, 2013 | Nihon Superior Co. Ltd., will present the paper titled “Grain Refinement for Improved Lead-Free Solder Joint Reliability” at the upcoming IPC APEX EXPO

Senior Technical Advisor Keith Sweatman

Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO

Jan 16, 2013 | Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.

Nihon Superior Scores Its 20th Industry Award with the SN100C P810 D4 Solder Paste

Oct 17, 2012 | Nihon Superior Co., Ltd. announces that it was awarded a 2012 Global Technology Award in the category of Materials – Solder Paste for its SN100C P810 D4 No-Clean Lead-Free Solder Paste.

SN100C P810 D4

Nihon Superior’s Keith Sweatman to Present at SMTA International

Sep 17, 2012 | Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012

 Keith Sweatman

Nihon Superior to Introduce Ultra Low Voiding Solder Paste at SMTA International 2012

Sep 12, 2012 | Nihon Superior Co. Ltdwill introduce newly developed solder paste for low voiding in soldering processes and materials

Nihon Superior Centre for Manufacture of Electronic Materials at University of Queensland

Aug 01, 2012 | Nihon Superior Co., Ltd. pleased to announce the establishment within the Faculty of Engineering, Architecture and Information Technology of the University of Queensland, Australia of the Nihon Superior Centre for Manufacture of Electronic Materials (NS CMEM).

Nihon Superior to Exhibit at IPCA INTERNATIONAL EXPO 2012

Jul 10, 2012 | Nihon Superior (Singapore) Pte. Ltd.,announces that it will showcase a new, expanded range of products in booth G2 at the upcoming IPCA INTERNATIONAL EXPO 2012, scheduled to take place July 25-27, 2012 in KTPO TRADE CENTRE, WHITEFIELD, in BANGALORE, INDIA.

SN100C (030)

Nihon Superior to Debut New Low-Voiding Lead-Free Solder Paste

Jun 25, 2012 | Nihon Superior, will introduce a new product, SN100C P810 D4 low-voiding lead-free solder paste, at the upcoming IPCA International Expo, scheduled to take place July 25-27, 2012 at the KTPO Trade Centre in Bangalore, India.

Implementing Lead-Free Soldering with Cost Reduction AND Reliability

May 30, 2012 | Nihon Superior to Offer Voiding Reduction and Aluminum Soldering at Jisso Protec 2012

Nihon Superior President to Participate in NEPCON China Reflow Optimization Roundtable

Apr 21, 2012 | Nihon Superior, a supplier of advanced soldering materials to the global market is proud to announce that its President Tetsuro Nishimura has been invited to participate in a Roundtable discussion, “Optimizing Reflow of Lead-Free Boards and BGAs,” hosted by EMSNow.

Nihon Superior PresidentTetsuro Nishimura

Nihon Superior Commemorates Long-Term Partnerships with Balver Zinn and DKL Metals

Apr 05, 2012 | Nihon Superior, a supplier of advanced soldering materials to the global market, recently celebrated milestone anniversaries in its partnerships with Balver Zinn Josef Jost GmbH & Co. KG and DKL Metals Ltd.

Colin Longworth, DKL Metals, Tetsuro Nishimura, Nihon Superior, and Josef Jost, Balver Zinn

Nihon Superior Shanghai to Exhibit at NEPCON China 2012 Implementing Lead-Free Soldering with Cost Reduction and Reliability

Mar 28, 2012 | Nihon Superior Shanghai Co. Ltd., a subsidiary of Nihon Superior Co. Ltd. will showcase a new and expanded range of products based on its SN100C® silver-free, lead-free solder at the upcoming NEPCON China 2012 exhibition in Shanghai.

Nihon Superior SN100C Bar

Nihon Superior Issues Reassurance of Product Radiation Levels Since the Japanese Earthquake

Mar 27, 2012 | Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it is able to report measurements of radiation levels to provide reassurance that products shipped from its distribution center in Toyanaka City, Osaka do not present any risk to its customers.

Measurements of radiation levels at Osaka Distribution Center

The Newest Addition to Nihon Superior's SN100C Lead-Free Solder Series Wins a 2012 NPI Award

Mar 05, 2012 | Nihon Superior has received a 2012 NPI Award in the category of Soldering Materials for its SN100C (551CT) Flux-Cored Solder Wire.

Nihon Superior to Introduce New Soldering Developments at the 2012 IPC APEX Expo

Feb 22, 2012 | Nihon Superior will introduce several new developments in soldering processes and materials in Booth #3044 at the upcoming IPC APEX Expo.

X-Ray images of voiding after N2 Reflows comparing with Vacuum and no-Vacuum

Nihon Superior's Keith Sweatman to Present at TMS Annual Conference

Feb 15, 2012 | Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present “The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders” at the upcoming TMS Annual Conference. The presentation will take place during the session, titled “Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies: Solder Alloy Design for Challenging Applications”.

Keith Sweatman, Nihon's Senior Technical Advisor

Nihon Superior's Mr. Keith Sweatman to Present at the 2012 IPC APEX EXPO Technical Conference

Feb 07, 2012 | Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present the paper titled “Effect of Cooling Rate on the Intermetallic Layer in Solder Joints” at the upcoming IPC APEX Expo.

Keith Sweatman, Nihon's Senior Technical Advisor

Nihon Superior to Exhibit at Electronics For You Expo 2012 (EFYEXPO2012)

Jan 24, 2012 | Nihon Superior (Singapore) Pte. Ltd. will showcase a new, expanded range of SN100C products in booth B-74B at the upcoming Electronics For You Expo 2012 , scheduled to take place February 16-18, 2012 in Hall No. 11 B, at the Pragati Maidan in New Delhi, India.

SN100C P500 is a high-reliability general purpose no-clean lead-free solder paste.

Pages: 1 2 3

x-ray inspection system

 Reflow System