News Releases from Shenmao Technology Inc.
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120 news releases added by Shenmao Technology Inc.
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SHENMAO Low-Temperature Solder Paste PF735-PQ10-10 Is Designed for High-Speed Printing Processes
Mar 18, 2024 | SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.
SHENMAO to Showcase Advanced Automotive Electronic Solutions at 2024 IPC APEX EXPO
Mar 18, 2024 | SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.
New Low Residue No-Clean Flip Chip Flux SMF-D61 from SHENMAO
Feb 12, 2024 | SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.
SHENMAO Embarks on Expansion with a New Factory in Texas to Serve Automotive Applications
Jan 15, 2024 | SHENMAO Technology announces a strategic expansion initiative with the establishment of a new factory in Texas. The move reflects the company's commitment to meeting the growing demand for its high-quality solder products, particularly in the automotive sector. SHENMAO anticipates that the new facility will significantly enhance its production capacity, catering to the needs of key clients, including major players in the electric vehicle manufacturing sector.
SHENMAO Debuts High Thermal Impact Reliability No-Clean Solder Paste PF918-P250, Elevating Automotive Electronics Performance
Dec 18, 2023 | SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.
SHENMAO Holds Celebration for 50 Years of Quality Solder Innovation
Nov 20, 2023 | SHENMAO Technology is proud to commemorate its 50th anniversary. Founded in 1973, SHENMAO has witnessed the evolution of Taiwan's electronics industry, playing a pivotal role in shaping the landscape of solder materials and setting new industry standards.
SHENMAO Wins Mexico Technology Award for Innovative SMBF-08 Visible No-Clean BGA Flux
Oct 31, 2023 | SHENMAO America, Inc. is proud to announce that it received a 2023 Mexico Technology Award for its groundbreaking SMBF-08 Visible No-Clean BGA Flux. The award was announced at a ceremony on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo. This innovative flux has redefined surface mount technology (SMT) assembly and BGA ball mount processes, offering unparalleled visibility and performance.
SHENMAO Develops Innovative PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste
Oct 23, 2023 | SHENMAO America, Inc. is proud to introduce its latest breakthrough in soldering technology, the PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. With its exceptional performance, eco-friendly attributes, and adaptability to a wide range of applications, PF606-P276 boasts a series of remarkable features and benefits that set it apart from conventional solder pastes.
SHENMAO Introduces Low-Temperature Ball Attachment Process Solutions
Sep 14, 2023 | SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounced.
SHENMAO Introduces Cutting-Edge Low-Temperature Lead-Free Solder Wire PF735-LT201
Aug 14, 2023 | SHENMAO America, Inc. is pleased to announce the availability of its PF735-LT201 Low-Temperature Lead-Free No-Clean Solder Wire. This advanced solder wire is designed to meet the evolving needs of the electronics industry, offering exceptional solderability and reliability for low-temperature PCBA soldering and rework processes.
SHENMAO Offers Halogen-Free SM-862 Liquid Flux as a Replacement for SM-816
Jul 19, 2023 | SHENMAO America, Inc. is pleased to announce the availability of its halogen-free SM-862 Liquid Flux, designed to replace the widely used halogenated SM-816. The SM-862 Flux offers a range of benefits, including low solid content and smooth residue, making it an excellent choice for automatic wave soldering and manual dipping processes.
SHENMAO Debuts Visible No-Clean BGA Flux SMBF-08 for Enhanced SMT Assembly and BGA Ball Mount Process
May 22, 2023 | SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.
SHENMAO Offers Industry-Leading UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV
Apr 24, 2023 | SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.
New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues
Mar 16, 2023 | SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
SHENMAO Offers Low-Temperature Lead-Free Solder Paste PF735-PQ10-10L for High-Speed Printing
Feb 27, 2023 | SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO Wins 2023 NPI Award
Jan 30, 2023 | SHENMAO America, Inc. received a 2023 NPI Award in the category of Soldering Materials for its PF918-PW216 water-soluble high thermal impact reliability solder paste. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.
SHENMAO Celebrates 50 Years of Developing Solder Materials
Jan 09, 2023 | SHENMAO America, Inc. today announced the company's 50th anniversary as a leading solder material manufacturer. As an award-winning supplier of electronics assembly and semiconductor packaging materials, the company has a reputation for its quality service.
SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307
Nov 15, 2022 | SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO
Oct 11, 2022 | SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.
Shenmao Recycled Solder Materials to Be Certified to UL ECVP 2809
Sep 08, 2022 | Shenmao America, Inc. is pleased to announce that four of its solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) for Recycled Content Standard which now includes auditing of social responsibility procedures. Additionally, more of its recycled tin products will be UL certified in the near future.
SHENMAO Shows High-Rel Solder Paste at SMTA Guadalajara
Aug 26, 2022 | SHENMAO America, Inc. will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The company will showcase its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste can increase thermal reliability performance by a minimum of 30 percent.
SHENMAO Introduces PF606-P269J Lead-Free Paste Specially Designed for Jet Dispensing
Aug 14, 2022 | SHENMAO America, Inc. offers PF606-P269J Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
High Thermal Impact Reliability BGA Sphere from SHENMAO
Jul 16, 2022 | SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.
SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux
Jun 24, 2022 | SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
SHENMAO PF735-P267J Low Melting Point Paste Is Designed for Jet Dispensing
May 18, 2022 | SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
SHENMAO Offers Low-Temperature Lead-Free Solder Paste for Sensitive Components
Apr 13, 2022 | SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.
SHENMAO Develops Thermal Fatigue Resistant Solder Paste for High-Reliability Requirements
Mar 14, 2022 | SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
SHENMAO Offers Halogen-Free SM-862 Liquid Flux
Feb 25, 2022 | SHENMAO America, Inc. is pleased to offer its halogen-free SM-862 Liquid Flux that can replace the widely sold halogenated SM-816. The flux features low solid content and smooth flux residue, making it suitable for automatic wave soldering and manual dipping processes.
SHENMAO to Highlight High-Rel Solder Sphere and Thermal Fatigue Resistant Paste at APEX
Jan 10, 2022 | SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.
SHENMAO's New PF606-P245X Lead-Free Solder Paste Wins 2021 Mexico Technology Award
Nov 05, 2021 | SHENMAO America, Inc. is pleased to announce that it received a 2021 Mexico Technology Award in the category of Solder Paste for its new PF606-P245X Lead-Free Solder Paste. The award was announced at a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
SHENMAO to Exhibit New Solder Pastes with NeVo at productronica
Oct 11, 2021 | SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao's PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.
Soldering and Joint Encapsulation with One Step Reflow from SHENMAO
Aug 26, 2021 | SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
New Thermal Fatigue Resistant Lead-free Solder Paste
Jun 08, 2021 | SHENMAO America, Inc. is pleased to introduce its PF918-P250Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.
SHENMAO Establishes Testing Laboratory in Taiwan – Cheetah Inspection, Inc.
Apr 01, 2021 | SHENMAO is pleased to announce that it has established an independent testing laboratory in Taiwan called Cheetah Inspection Inc. The ISO/IEC 17025 approved testing laboratory is located in Hsinchu, and builds upon SHENMAO's 48 years of packaging and assembly experience.
SHENMAO Introduces Thermal Fatigue Resistant Solder Alloy
Mar 04, 2021 | SHENMAO America, Inc. has introduced its PF719-P250 thermal fatigue resistant solder alloy for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.
New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO
Mar 02, 2021 | SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
SHENMAO Introduces New Joint-Enhanced Solder Paste Series
Dec 01, 2020 | SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.
SHENMAO Develops New Joint-Enhanced Flux
Nov 09, 2020 | SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.
SHENMAO Awarded for Lead & Halogen-Free Solder Wire
Oct 27, 2020 | SHENMAO America, Inc. received a 2020 Mexico Technology Awardin the category of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire.The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.
SHENMAO Receives Two GLOBAL Technology Awards for New Solder Wire & Solder Paste
Oct 04, 2020 | SHENMAO America, Inc. received two 2020 GLOBAL Technology Awards in the categories of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire, and Solder Paste for its PF606-RT35 Room Temperature Solder (RTS). The awards were announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.
SHENMAO Receives TwoGLOBAL Technology Awards for New Solder Wire & Solder Paste
Oct 03, 2020 | SHENMAO America, Inc. received two 2020 GLOBAL Technology Awards in the categories of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire, and Solder Paste for its PF606-RT35 Room Temperature Solder (RTS).The awards were announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.
SHENMAO's New Room Temperature Solder Paste Offers Stability for a Range of Temperature Conditions
May 30, 2020 | SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.
SHENMAO Introduces New Solder Wire for Automatic Soldering
May 25, 2020 | SHENMAO America, Inc. is pleased to introduce its new PF606-F13 lead-free and halogen-free solder wire designed for automatic soldering equipment. The new solder wire enhances high-precision soldering, soldering efficiency and offers stable soldering quality.
Advanced Liquid Flux and Low Temp Solder from SHENMAO at SMTA Silicon Valley Expo
Nov 25, 2019 | SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.
SHENMAO Awarded for New Low Temperature Solder at productronica
Nov 13, 2019 | SHENMAO America, Inc. announces that it was awarded a 2019 Global Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.
SHENMAO Picks up Award for New Low Temperature Solder at SMTA Guadalajara
Oct 24, 2019 | SHENMAO America, Inc. announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
SHENMAO Showcasing Liquid Flux and Low Temp Solder at SMTA Guadalajara
Oct 08, 2019 | SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.
Visit SHENMAO at the SMTA Long Island Conference & Exhibition
Oct 08, 2019 | SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place Thursday, October 17, 2019 at the Melville Marriott in Melville, NY. The company will showcase its PF735-PQ10 low temperature solder (LTS) and SM-862 Liquid Flux.
SHENMAO to Present at the 31st Annual Electronics Packaging Symposium
Aug 12, 2019 | SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”
SHENMAO to Exhibit Low-Temperature Solder Pastes at SMTA Ohio Expo
Jul 09, 2019 | SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.
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