News Releases from Association Connecting Electronics Industries (IPC)
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1492 news releases added by Association Connecting Electronics Industries (IPC)
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IPC Committee Focuses ON the Box
Sep 12, 2011 | For the past year, engineers from companies like Honeywell Aerospace and Rockwell Collins have been meeting to lay the groundwork for IPC-A-630, Requirements and Acceptance for Enclosures, better known as “the box build standard.” These volunteers have come largely from the OEMs that specify the cabinetry they will use.
IPC Quarterly Report Reveals Industry-wide Slowdown in Sales Growth
Sep 12, 2011 | IPC released the summer 2011 edition of its quarterly business report, Electronics Industries Market Data Update, showing slower growth in most national economies as well as in the worldwide electronics industry.
IPC RELEASES PCB INDUSTRY RESULTS FOR JULY 2011
Sep 06, 2011 | IPC announced the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC INVITES INDUSTRY LEADERS TO SUBMIT POSTER ABSTRACTS FOR IPC APEX EXPO 2012 IN SAN DIEGO
Sep 06, 2011 | IPC invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO™, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, February 28-March 1, 2012, at the San Diego Convention Center, San Diego, Calif. Poster presentations offer exposure to key engineers, managers and executives attending the show.
IPC Invited to Participate in Pilot Evaluation of OECD Conflict Minerals Due Diligence Guide
Sep 06, 2011 | IPC and six IPC-member companies have agreed to participate in a pilot evaluation program to review and refine the Organization for Economic Cooperation and Development (OECD) due diligence guidance for conflict minerals.
The Heat Is On for IPC Midwest Hand Soldering Competition
Sep 01, 2011 | Bragging rights are on the line as the First Annual IPC Midwest Soldering Competition takes place, September 21-22, in Schaumburg, Ill., to determine the Best Hand-Soldering Technician in the Midwest for 2011.
IPC Conference on Reliability Highlights New Findings in All Areas of Electronics Assembly
Aug 24, 2011 | The IPC Conference on Reliability: Assembly Process for a Reliable Product will be held November 1-2, 2011, in Irvine, Calif. The conference will address reliability issues that arise at the assembly level, dedicating half-day programs on new developments in each of three key areas: materials, processes, and test and inspection.
IPC RELEASES STUDY OF QUALITY BENCHMARKS FOR EMS INDUSTRY
Aug 24, 2011 | In response to member requests for benchmarking data, IPC released IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2010. This report is designed to provide information to EMS companies interested in comparing their key 2010 operating variables to those of other EMS providers by net sales and type of product.
IPC WORLD PCB PRODUCTION REPORT SHOWS 19 PERCENT GROWTH IN 2010
Aug 24, 2011 | Worldwide production of printed circuit boards (PCBs) grew by 19 percent over 2009 to nearly $55 billion, according to the World PCB Production Report for the Year 2010, recently released by IPC. Published annually, the report offers consensus estimates of PCB production value by country and by product category, and analysis on global and regional PCB industry trends. This year’s report includes special sections on trends in the HDI/microvia and metal-core PCB markets.
Alberi EcoTech and PTC Lead IPC Committee Responsible for Supplier Declaration Standards
Aug 22, 2011 | In an era of intense scrutiny over “what” materials are used in electronic products and “from where” those materials originate, Krista Crotty, founder of Alberi EcoTech, and Jørgen Vos, product management director at PTC, have accepted the co-leadership roles of IPC’s 2-18 Supplier Declaration Subcommittee.
IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS
Aug 18, 2011 | For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
IPC MIDWEST TECHNICAL CONFERENCE BRINGS EXPERTISE IN MANUFACTURING DEFECT-FREE, RELIABLE ELECTRONICS
Aug 18, 2011 | For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Denny McGuirk Resigns as President of IPC, Takes Position with SEMI
Aug 15, 2011 | After 12 years as the president and CEO of IPC - Association Connecting Electronics Industries®, Dennis “Denny” P. McGuirk has resigned to accept a new position as president and CEO of SEMI, a global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries.
When Field Failure is Not an Option — IPC Midwest Opening Session Reveals the Means to the End
Aug 10, 2011 | Kicking off an intense, two-day focus on the latest technologies, processes and best practices in electronics manufacturing, Jim Springer, vice president of quality at Phoenix International, will deliver the free opening session at IPC Midwest Conference & Exhibition in Schaumburg, Ill. His presentation, “Clearly Understanding Field Failures Leads to Interesting New Knowledge (CUFFLINK) - A Case Study,” will take place on September 21 at 8:00 am.
IPC to Develop Data Exchange Standard for Conflict Minerals Regulation
Aug 08, 2011 | IPC will begin development of a data exchange standard to help the electronics manufacturing industry comply with forthcoming U.S. Securities and Exchange Commission (SEC) regulations on conflict minerals at a kickoff meeting on September 22, 2011, held in conjunction with IPC Midwest Conference & Exhibition, Schaumburg, IL.
Succeeding in a Disruptive Environment the Focus of IPC Executive Summit
Jul 27, 2011 | IPC will host the IPC Executive Summit, “Succeeding in a Disruptive Environment: From Earthquakes to Nanoparticles,” on October 4-5, 2011, in San Jose, Calif.
IPC Releases PCB Industry Results For June 2011
Jul 27, 2011 | IPC announced today the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Cleaning Up the No-Clean Myth - IPC Releases New Update of Guidelines for Cleaning of Printed Boards & Assemblies
Jul 26, 2011 | It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.
It's Official! Revised EU RoHS Directive Published
Jul 06, 2011 | The revised European Union (EU) Restriction of Hazardous Substances (RoHS) Directive was published today in the EU Official Journal. The Directive is expected to go into effect on July 21, 2011, twenty days after publication. Member States will have 18 months to transpose the Directive into national law. Member States’ regulations are expected to take force no later than January 2, 2013.
IPC Midwest Announces First Annual Hand Soldering Competition
Jun 29, 2011 | IPC announces the first annual IPC Midwest Hand Soldering Competition, September 21–22, 2011, at the Renaissance Schaumburg Hotel and Convention Center, Schaumburg, Ill. Held in conjunction with IPC Midwest Conference & Exhibition, the contest will pit competitors against each other to build a functional electronics assembly within a 30-minute time limit to ultimately determine who the best-of-the-best is in the Midwest.
IPC Releases PCB Industry Results For May 2011
Jun 29, 2011 | IPC announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC Legal Counsel Outlines SEC Authority to Phase-In Conflict Minerals Regulations Requirements
Jun 29, 2011 | IPC recently submitted comments to the U.S. Securities and Exchange Commission (SEC) regarding the legal basis for a phase-in of the conflict minerals regulatory requirements.
Resources and Solutions to Address Challenges in Printed Boards and Electronics Manufacturing Focus of IPC Midwest
Jun 20, 2011 | IPC Midwest Conference & Exhibition will be held September 21–22, 2011, at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, Ill. After being a co-located event in Rosemont in 2010, IPC Midwest will be produced solely by IPC in 2011 and will bring focused, targeted and relevant information for the electronics manufacturing and printed boards industries.
IPC Surface Mount Equipment Manufacturers Association Council Issues Advisory on Counterfeit and Inferior Parts and Unlicensed Software
Jun 16, 2011 | Counterfeit products are reported to have grown to a $600 billion business worldwide. The electronics assembly industry has been impacted, with reports of counterfeit feeders, spare parts and software causing equipment breakdowns and production delays. To assist IPC member companies in keeping their equipment and lines running, the Surface Mount Equipment Manufacturers Association (SMEMA) Council of IPC – Association Connecting Electronics Industries® is creating an “anti-counterfeit tool kit.”
IPC Announces 2012 Schedule for EMS Program Manager Training and Certification
Jun 13, 2011 | IPC has announced the EMS Program Manager Training and Certification dates for 2012. A four-part curriculum that culminates with a certification exam, IPC’s EMS Program Manager Training and Certification is designed to provide preparation for and insight into the varied business, operations and management issues specific to an EMS organization.
IPC announces Summer Webinars for June, July and August 2011
Jun 09, 2011 | Focused on critical, practical and social issues facing the electronics manufacturing industry, these sessions are based on award-winning technical papers from IPC APEX EXPO 2011. The one-hour webinars offer organizations cost-effective opportunities to bring important new information directly to their conference rooms.
IPC Releases PCB Industry Results for April 2011
Jun 01, 2011 | IPC announced the April findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Troubling IEEE Standards on Environmentally Preferable Imaging Equipment and TVs Go to Ballot in One Month
May 27, 2011 | Two IEEE standards on setting criteria for environmentally preferable electronic equipment will soon be balloted. Although technically voluntary, these standards, under the Environmentally Preferable Electronics Assessment Tool (EPEAT) umbrella of standards, become de facto regulations due to President Obama’s Executive Order 13514 Federal Leadership in Environmental, Energy, and Economic Performance that requires all government procurement to be certified to EPEAT.
Issues Impeding U.S. Electronics Manufacturers’ Competitiveness Given Platform for Change at IPC Summit and Capitol Hill Day
May 27, 2011 | Government over-regulation, export controls and maintaining the military and aerospace sectors’ use of U.S. electronic interconnect manufacturing capacity are just some of the key issues that will be addressed at the IPC Summit on American Competitiveness and Capitol Hill Day, June 15-16, 2011, in Washington, D.C.
Conflict Metals: Good Intentions Gone Tragically Bad
May 23, 2011 | It's a script straight out of the movies. Just replace "blood diamonds" with "blood metals" and begin with a scene that demonstrates the tens of millions of dollars in profit flowing into rebel mines in the Democratic Republic of the Congo (DRC), funding criminal networks and perpetrating horrific war crimes. In the movie, the U.S. government comes to the rescue by implementing a law that withholds resources from these groups, breaks the rebel mines and ends the atrocities.
One-third of Printed Boards for U.S. Military Electronics are Made Outside North America
May 12, 2011 | A market analysis prepared for the U.S. Air Force by IPC — Association Connecting Electronics Industries® shows an estimated one-third of all printed circuit boards (PCBs) for U.S. defense or military systems are produced outside North America.
IPC Issues Call for Participation for 2012 IPC APEX EXPO™
May 03, 2011 | IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2012 IPC APEX EXPO™ at the San Diego Convention Center in San Diego, Calif. The technical conference will be held February 28–March 1, 2012, and the professional development courses will be February 26–27 and March 1, 2012.
Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC
May 03, 2011 | Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
IPC Apex Expo 2011 Honors Best Industry Posters And Academic Poster Competition Winners
Apr 29, 2011 | Celebrating the best of electronic interconnection research being conducted by both industry leaders and academia, IPC announced the 2011 Best Industry Posters and the winners of the IPC Academic Poster Competition at IPC APEX EXPO, held April 12–14, 2011 in Las Vegas.
IPC APEX EXPO Attendees Raise Record Donation to Support Japanese Red Cross
Apr 29, 2011 | Betting on the generosity of the electronics industry gathered at IPC APEX EXPO recently in Las Vegas, IPC – Association Connecting Electronics Industries® held a raffle to raise funds for the Japan relief fund of the Red Cross. A total of $4,195 was raised from the raffle with 100 percent of the proceeds going to the Japanese Red Cross.
IPC Releases PCB Industry Results for March 2011
Apr 27, 2011 | IPC announced today the March findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC APEX EXPO 2011 Deals a Full House in Vegas
Apr 22, 2011 | IPC has released verified attendance figures from IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas, indicating an eight percent increase over last year with 7,208 total participants.
Electronics Industry Volunteers Honored for Contributions to Industry and IPC
Apr 20, 2011 | IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.
Don Dupriest Inducted Into IPC Hall Of Fame
Apr 20, 2011 | In recognition of extraordinary contributions to IPC and the electronic interconnect industry, countless hours of volunteer service on IPC standards development committees and exceptional lifetime achievement, Don Dupriest, Lockheed Martin, was awarded the 2010 IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO™ in Las Vegas, the Hall of Fame Award represents IPC’s highest level of member recognition.
IPC Honors TTM Technologies and Celestica with 2011 Corporate Recognition Awards
Apr 20, 2011 | IPC — Association Connecting Electronics Industries® bestowed its highest corporate honors to TTM Technologies and Celestica. During the IPC Annual Meeting Luncheon held in conjunction with IPC APEX EXPO™, IPC awarded the Stan Plzak Corporate Recognition Award to Celestica and the Peter Sarmanian Corporate Recognition Award to TTM Technologies.
IPC Honors Best Technical Papers At IPC Apex Expo 2011
Apr 20, 2011 | IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 12–14, 2011, in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
IPC Elects New Members To Board Of Directors
Apr 20, 2011 | The Nominating and Governance Committee of the IPC Board of Directors presented one Board candidate for re-election and three new Board candidates for election at the IPC Annual Meeting, on Tuesday, April 12, 2011, in conjunction with IPC APEX EXPO™ in Las Vegas.
IPC APEX EXPO Raising Funds for Academic Scholarships and Japanese Red Cross
Apr 07, 2011 | After its successful launch in 2010, the IPC Foundation Silent Auction will return to IPC APEX EXPO™, April 12–14, 2011, in Las Vegas. Proceeds of the Silent Auction directly fund IPC Foundation initiatives, such as the All-Academic Poster Competition and technical conference scholarships.
Call For Presentations: IPC Conference on Assembly Reliability
Apr 01, 2011 | IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Conference on Reliability: Assembly Process for a Reliable Product, November 1–2, 2011 in Irvine, Calif. Focused on reliability issues arising at the assembly level, the conference will highlight new developments in materials, process and test.
IPC Releases PCB Industry Results for February 2011
Mar 31, 2011 | IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
IPC APEX EXPO™ 2011 to Feature More than 250 New Products
Mar 31, 2011 | The electronics manufacturing industry is rapidly moving forward with innovative technologies and improved processes. The best of these advances will be on display when more than 250 new products and services debut at IPC APEX EXPO™, April 12–14, 2011, at the Mandalay Bay Resort & Convention Center in Las Vegas.
New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering
Mar 31, 2011 | Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Key Electronics Companies Set to Speak at IPC Flex Conference
Mar 31, 2011 | According to 2009-2010 IPC Industry Analysis and Forecast for Flexible Circuits in North America, the sales of flexible circuits is forecasted to grow to $50.8 billion globally by 2012. In order to provide the industry with the latest information on this important market segment, IPC — Association Connecting Electronics Industries® will hold the IPC International Conference on Flexible Circuits, June 21-23, 2011, in Minneapolis, Minn.
IPC APEX EXPO™ Highlights the Most Exciting Eleven New Products in the Show’s Innovative Technology Center
Mar 28, 2011 | Eleven products have been selected for inclusion in the Innovative Technology Center at IPC APEX EXPO™, April 12–14, 2011, in Las Vegas, according to show organizer IPC – Association Connecting Electronics Industries. Assessed by a review board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
IPC Summit to Address American Competitiveness
Mar 21, 2011 | The IPC Summit on American Competitiveness will be held June 15-16, 2011, in Washington, D.C. at the Hyatt Regency on Capitol Hill. This unique IPC event combines conference presentations with legislative and regulatory briefings as well as key lobbying visits with members of Congress to discuss critical issues that directly impact the U.S. electronics industry’s ability to compete globally. As a part of the two-day Summit, exclusive events with members of the National Association of Manufacturers will offer opportunities to hear from and network with members of Congress and senior-level Administration officials.
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