Sep 17, 2021 
The Assembly Division of MacDermid Alpha Electronics Solutions will exhibit at the SMTA Empire Expo & Tech Forum on Tuesday, September 28that the RIT Inn & Conference Center in Henrietta, New York.
MacDermid Alpha will promotethe adhesive, edgebond, and underfill capabilities of the ALPHA HiTech polymer solutions portfolio of products. ALPHA HiTech is a full range of electronics assembly polymer products featuring underfills, edgebonds, encapsulants, and low temperature and SMD adhesives for the Automotive, LED, Consumer Goods and Industrial markets.
“The ALPHA HiTech line of materials are designed to provide high performance products specifically designed for a wide range of applications. Everything from component Underfills and Edgebond cornerfills for component robustness enhancement, Encapsulants for waterproofing and protection, along with SMT, Low Temperature and UV Adhesives for component and material attach applications. The ALPHA HiTech family of products provide high performance technologies, at the lowest total cost of ownership to meet today’s challenging applications,” stated Regional Marketing Manager, Scott Lewin.
Additional solutions to be promoted include Alpha and Kester low temperature and high reliability solder pastes.
For additional information about MacDermid Alpha’s industry-leading assembly products and solutions, please visit MacDermidAlpha.com.
Through the innovation of specialty chemicals and materials under our Alpha, Electrolube, Kester, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection. We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time.
