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YINCAE Advanced Materials Wins Global Technology Award at SMTAI 2022 for Adhesives/Underfills/Encapsulants

Nov 08, 2022

YINCAE’s die attach material was recognized as one of the products that made the greatest impact on the electronics industry in the years 2021 and 2022. Due to its unique properties, YINCAE die attach adhesive has a high thermal conductivity and can achieve very thin bonding line thickness- there is no any bleeding and migration issue. It  has excellent bonding strength, a thermal cycling performance, and can withstand extreme temperatures ( -273°C) without any delamination.

About Global Technology Awards

The Global Technology Awards are universally recognized as the most international industry award, attracting entries from Europe, USA and Asia. Each year the Global Technology Awards recognize the latest innovations in production equipment and materials for the EMS industry by a distinguished panel of industry experts.

About YINCAE Advanced Materials, LLC

Founded in 2005, and headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives, and electronics materials used in electronic and optoelectronic devices. YINCAE products provide innovative solutions to support manufacturing processes from wafer level, to package level, to board level, and in final devices.

                                                                 FOR ADDITIONAL INFORMATION CONTACT:

                                                                          YINCAE Advanced Materials, LLC

                                                                          19 Walker Way, Albany, NY  12205

                                                                                 Phone: (518) 452-2880

                                                                                 E-mail: info@yincae.com

                                        The YINCAE brand name and logo are trademarks of YINCAE Advanced Materials, LLC.

Jun 22, 2023 -

YINCAE Launches Snap Cure, Highly filled ,100% No-Clean Flux Residue Compatible Underfill: UF 120HA

Mar 27, 2023 -

YINCAE Launches Breakthrough Thermal Underfill: UF 158A2

Aug 16, 2022 -

YINCAE's Fully Flux Residue Compatible Underfill: UF 158HA

Mar 30, 2022 -

YINCAE's DA158N Die Attach Materials withstanding -273°C

Dec 22, 2021 -

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Feb 24, 2021 -

YINCAE's New SMT 158N Series withstanding -273°C

Jan 21, 2021 -

World's First Commercially Available Diamond Filled Underfill: SMT 158D8

Aug 04, 2020 -

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

Sep 05, 2019 -

YINCAE To Exhibit at IMAPS 2019 Boston 52nd International Symposium Just 1 Month Away! Visit YINCAE at Booth #530

Sep 05, 2019 -

YINCAE To Exhibit at IMAPS 2019 Boston 52nd International Symposium Just 1 Month Away! Visit YINCAE at Booth #530

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