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Saki Demonstrates High Speed, High Resolution 2D and 3D AOI Systems at NEPCON China, Stand 1J25

Apr 20, 2016

Saki Corporation, an innovator in the field of automated optical inspection equipment, will present its 2D and new 3rd generation 3D automated optical inspection (AOI) systems at NEPCON China 2016, held from April 26-28, at the Shanghai World Expo & Exhibition Center, in stand 1J25. Technical experts will be at the booth to discuss the factors to consider to determine the correct AOI system for specific inspection and measurement needs.

On display will be Saki's:

BF-10BT Offline AOI System - Saki's BF-10BT is the ultimate machine for double-sided PCB inspection. Its robust and highly repeatable hardware is built for 24/7 continuous operation. The system inspects both sides of the PCB in one process with 10μm resolution. It inspects 01005 (0402) components and detects solder balls down to 150μm with high speed and superior data handling capabilities. It's perfect for final inspection, through-hole inspection after wave or selective soldering, or manual inspection.

BF-10D 2D Inline Dual Lane High Resolution, High-Speed AOI - Saki's BF-10D handles dual-lane high speed production lines using only one head. Whether the two lanes have the same or different board configurations, they can be inspected simultaneously in one pass, making inspection very fast. When the same items are run in both lanes, the inspection programming data can be shared. The system uses a telecentric lens optical system to achieve 10μm resolution. Multiple data handling capabilities, such as programming data changes by barcode reading and data output to the customers' data servers, are available.

BF-3Di-L1 3D AOI System - This newly introduced system provides measurement of components with a height range from 0-20mm, achieving 1-micron height resolution. The new positioning system is 50% faster than Saki's previous 3D machine for an increased throughput of 15%. The camera and lighting systems capture extremely clear, detailed images with no shadowing for inspection of the most difficult defects, such as lifted leads, tombstones, reversed polarity, and height variations. The system is available for XXL sizes, in dual-lane configurations, or with optional side angle cameras.

For more information contact Saki Shanghai Co., Ltd. at +86-21-6282-2266, email all.cn@sakicorp.com, or visit our website at www.sakicorp.com.
Since its inception in 1994, Saki has led the way in the development of automatic recognition through robotic vision technology, applying ground-breaking image processing tools to solve inspection problems associated with printed circuit board assembly. Saki Corporation has headquarters in Tokyo, Japan with offices and sales and support centers around the world. Saki has Quality Management System JIS Q 9001:2008 and ISO 9001:2008 certifications.

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