Feb 01, 2001 Yervant Zorian, Chief Technology Advisor of LogicVision Inc., will present a course entitled, "Test Strategies for High Density Packages" in the EvaluTech Conference at EtroniX 2001. This six hour in-depth presentation will take place on Monday, February 26, 2001 from 9:00am to 4:00pm.
The advances in packaging technologies were considerable during the last few years. Miniaturization and performance requirements have resulted in creating a number of novel packaging technologies to meet such demands. These high-density packaging technologies consist of Direct Chip Attach, Chip Scale Packaging (CSP), Ball Grid Arrays (BGA) and Multi-Chip Modules (MCM). Due to their density, these packages have very limited physical access capabilities the complexity and cost associated with their test and diagnosis are considered major issues facing their affordability and use. This course intends to provide a comprehensive knowledge of test strategies used for such advanced packages.
EtroniX 2001 is produced and managed by the Electronics Group of Reed Exhibition Companies (REC). EtroniX will be held February 25 - March 1, 2001 at the Anaheim Convention Center in Anaheim, California.
For more information or to register by phone, contact customer service at 1-800-467-5656 or 1-203-840-5656. Or visit the EtroniX web site at http://www.etronixexpo.com.
