May 20, 2024 ZESTRON is excited to announce an upcoming webinar titled "Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges." The webinar will occur on May 23, 2024, at 2:00 PM EDT.
During this insightful session, Senior Applications Engineer Ravi Parthasarathy will delve into the intricacies of high bandwidth memory (HBM) wafers, specifically focusing on critical cleaning processes necessary for effective surface treatment. The webinar will highlight the paramount importance of surface preparation in achieving sustained reliability and performance of HBM wafers.
Key topics to be covered include:
- Understanding the complexities of delicate HBM wafer structures
- Chemical compatibility and its impact on cleaning efficacy
- Efficient residue elimination techniques
- Precision process control for optimal results
Ravi will draw on extensive expertise to discuss these challenges comprehensively, providing attendees with actionable insights and recommended best practices for optimizing the surface treatment of HBM wafers.
Registration for the webinar is now open. Interested participants can reserve their spot by visiting here.
ZESTRON is headquartered in Manassas, Virginia, and operates in over 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high-precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information or to tour one of our technical centers, please visit www.zestron.com.
