SMT, PCB Electronics Industry News

ZESTRON's Highlight at NEPCON Shenzhen 2011

Aug 08, 2011

ZESTRON, the leading supplier of cleaning agents and services for the SMT and Semicon Backend industries, will exhibit ATRON® AC 207 during the upcoming NEPCON Shenzhen 2011 (booth #1C40).

ATRON® AC 207 is a FAST® Technology-based surfactant defluxing agent, specifically designed to provide a superior level of material compatibility with sensitive metals. With a bath life that is 3 to 10 times longer than that of conventional surfactants, ATRON® AC 207 offers excellent cleaning results in high and medium pressure inline as well as batch cleaning systems at low concentrations and temperatures.  It removes a wide variety of the latest lead-free and eutectic flux residues as well as unsoldered solder pastes.

FAST® Technology- Fast Acting Surfactant Technology - is an innovative surfactant-based cleaning technology developed and introduced by ZESTRON in 2007. FAST® Technology-based cleaning agents are a proprietary mix of newly developed surfactants, which allows for a quicker removal of a wide variety of the latest lead-free and leaded flux residues.

For more information about ATRON® AC 207 or the FAST® Technology, please visit our booth (#1C40) at NEPCON Shenzhen.

May 20, 2024 -

ZESTRON Announces Upcoming Webinar on Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment

May 13, 2024 -

ZESTRON Offers Free Webinar on Advancements in Solder Paste Printing

May 06, 2024 -

ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series

Apr 29, 2024 -

ZESTRON Academy Introduces Cutting-Edge SMT Webinar Series for 2024

Apr 22, 2024 -

ZESTRON Welcomes Whitlock Associates as new Addition to their Existing Rep Team in Florida

Apr 22, 2024 -

ZESTRON Welcomes Angela Marquez as Head of Business Unit, Latin America

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 18, 2024 -

ZESTRON and Indium Corporation to Present Advancements in Solder Paste Printing at IPC APEX EXPO 2024

Mar 11, 2024 -

ZESTRON to Showcase Cutting-Edge Cleaning Solutions at IPC APEX EXPO 2024

Mar 04, 2024 -

ZESTRON to Present at Upcoming iMAPS Device Packaging Conference

471 more news from ZESTRON Americas »

Jun 05, 2024 -

Mencom Bolsters National Presence through a New Partnership

Jun 05, 2024 -

Unleashing the Versatility: Exploring Silicone Rubber Applications

Jun 04, 2024 -

Guide to Metal Fabrications: Tailored Process to Production

Jun 03, 2024 -

PVA to Co-Exhibit with TKT Technology at EV Asia 2024

Jun 03, 2024 -

Accu-Assembly Inc. Expands Component Storage Management with AccuLiFT™ and AccuCart™ Products

Jun 03, 2024 -

TAGARNO Expands U.S. Operations with Enhanced Customer Support

Jun 03, 2024 -

North American EMS Industry Down 2.1 Percent in April

Jun 03, 2024 -

North American PCB Industry Sales Up 9.4 Percent in April

Jun 03, 2024 -

Altus and Fuji Bring 'Factory of the Future' Vision to Life With Technology Event

Jun 03, 2024 -

Clarity in Innovation: Pioneering Functional Optical Solutions

See electronics manufacturing industry news »

ZESTRON's Highlight at NEPCON Shenzhen 2011 news release has been viewed 923 times

Jade Series Selective Soldering Machines

Conductive Adhesive & Non-Conductive Adhesive Dispensing