Feb 04, 2008 The aim of the Summer Conference is to provide a platform for speakers and delegates to exchange information on market conditions and future innovation on interconnection and packaging. Delegates and visitors from throughout Europe will attend this event, offering presenters the opportunity to reach a targeted audience of decision makers and leaders of the international packaging and interconnection industry.
Conference location
The conference organisers will choose a suitable hotel in the city centre of Dresden as venue for the conference. Dresden Airport is situated about nine kilometers north-east of the city centre. If you want to use public transport, there are S-Bahn, bus and tram connections to take you from the airport to the city centre quickly and inexpensively.
Networking event
This will be an evening dinner in a typical German atmosphere which is included in the conference fee for participants. At the end of the first conference day, all conference participants and, if applicable , their partners are invited to join us for an evening tour and a wonderful dinner. We will leave the hotel by coach for a city tour to view the many historical highlights Dresden has to offer. After the sight seeing tour the participants can enjoy exquisite German cuisine and afterwards the coach will take us back to the hotel.
Topics
We invite you to submit a paper for one of the following key topics:
- Global & European PCB market trends
- PCB fabrication success and experience
- Advanced Technology Developments
- Improved performance in high-temperature and high reliability appli
cations
- Technology, Processes and Materials for rigid flexible circuits
- Materials for PCBs
- Material for advanced ML PCBs
- State of halogen free laminate in Europe
- Material for advanced ML PCBs
- Lamination (Standard pressing condition
- Short cycle pressing HDI layers)
- Short cycle pressing HDI layers)
- Multilayer fabrication
- Imaging (conventional and or digital)
- Registration (Inner layer, Outer layer, Solder masking)
- Imaging (conventional and or digital)
- Plating of halogen free laminate
- Chemical processes for environmentally friendly manufacture
- Surface finishes for PCB�s (ENIG, Sn, Ag, HASL, Organic)
- Via hole plugging
- Blind via hole plugging
- Blind via hole plugging
- Any other topic you feel may be of interest
Notes for speakers
The following guidelines are provided regarding the submittal of papers and how they are to be presented at the Summer Conference in Dresden:
- Papers should supply new technical, management or statistical information and not be presented for commercial purposes.
- All presentations should be made in English. If the author has problems with presenting in English, he or she should note this situation on the Abstract Submission Form.
- Presentations should not make direct comparisons with competitors' products.
- When the description of particular equipment is necessary for proper understanding of the process, it shall be confined to technical aspects.
- Text files of the presentation will be required in a universal application like MS Word or in Adobe Acrobat PDF format.
- Illustrations, graphics, tables or pictures (including presenter's photograph) have to be electronically delivered in standard format and in the appropriate resolution (75 dpi for electronic publication and/or 300 dpi for printed material).
- The author or presenter of an oral presentation will be offered a complimentary one day conference registration, valid on the day the author is invited to present.
Abstracts should include the following:
- Title of Presentation
- Author Listing; first/last name, affiliation, mailing address, telephone, fax, e-mail
- Abstract text (max. 200 words)
- Biography: brief background on the principal/presenting author (max. 100 words)
Acceptance Criteria:
Abstracts will be reviewed by the Programme Committee, consisting of experts from within our industry. The official language of the Conference is English, NO simultaneous translations will be provided.
Selections will be based on the following criteria:
- Contribution to the industry.
- The abstract should clearly describe the nature, content, key points, and significance of the proposed paper.
- Presentations are to be strictly non-commercial and must focus on technical merits of described processes.
- Proprietary and/or confidentiality issues as well as approvals should be determined at time of submission.
Instructions:
Instructions will be included in an author's kit that will be mailed to you on acceptance of your proposal. All presentations will be included in the Proceedings of the Winter Conference. Manuscripts will be required for inclusion in the Proceedings.
Deadlines
1 page Abstract February 20, 2008
Notification of Acceptance March 7, 2008
Please use the abstract submission form, which you can get from http://www.eipc.org
Table Top Exhibition and Poster Display Area:
During the EIPC Summer Conference, the EIPC will provide an opportunity for information sharing and discussion in a dedicated area. This will allow for visitors to obtain latest product information and know-how on an informal, or �one-to-one' basis.
A 'Poster Wall' and a table with chairs will be provided during the two days of the Conference.
Kindly note that space for the Table Top Exhibition is limited, so you are asked to book as early as possible.
Costs for the �Table Top and Poster Exhibition' include one person for coffee breaks and lunch. Conference participation and evening party are not included.
About EIPC
The European Institute of Printed Circuits (EIPC), based in The Netherlands, is an international service provider to the European Interconnection and Packaging Industry.
Since 1968, the EIPC is servicing about 130 member companies, including suppliers of machinery and materials to the PCB industry, PCB Manufacturers, contract electronics manufacturers and OEM�s.
