SMT, PCB Electronics Industry News

Boundless Files for Chapter 11 Protection

Mar 14, 2003

This news was first published on http://www.pcb007.com.

US-based Boundless Corporation announced March 13 that it has filed voluntary petitions for reorganization under Chapter 11 of the U.S. Bankruptcy Code. The action is part of its continuing efforts to serve its many loyal customers, the company said.

Boundless also said that it is working with a DIP financier to support its need for operating capital as it reorganizes. Once Boundless has secured its DIP financing, the company anticipates that many customers will experience an improvement in service and delivery during the bankruptcy, according to the company's statement.

Boundless Corporation describes itself as a global technology company, composed of two subsidiaries: Boundless Technologies, Inc., a desktop display products company, and Boundless Manufacturing Services, Inc., an emerging EMS company providing build-to-order (BTO) systems manufacturing, printed circuit board assembly, and complete end-to-end solutions from design through product end-of-life to its customers.

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