Oct 23, 2007 
- Low Voiding at Via-In-Pad
- Excellent Printability
- Excellent Wetting
- Robust Reflow Profile Window
Via-in-pad technology for BGA components has reduced PCB real estate requirements, but this can also lead to significantly increased voiding. Indium5.1AT delivers voiding in the 5% range over many different profiles when soldering BGAs with via-in-pad technology. Longer soak-type reflow profiles can help reduce via-in-pad voiding, but that can contribute to poor wetting, solder balling, and shorts. Indium5.1AT offers a very robust processing window that can minimize these potential defects as well as accommodate various board sizes, board densities, and throughput requirements.
Manufacturers need a solder paste that delivers consistent print volume on every circuit board, regardless of downtime or other interruptions. As CSP technology is becoming more mainstream, PCB assemblers are challenged with getting good print definition in order to achieve reliable finished goods. Indiumt5.1AT was specifically formulated to minimize the impact of downtime on printed deposit volumes, ensuring a consistently high reliability on board assembly, specifically for CSP components.
Decreased defects = higher yields/throughput. The overall result for customers is increased cost savings and finished goods reliability.
Indium will be exhibiting at Hall A4, Stand 163
For more information about Indium5.1AT Pb-Free Solder Paste visit: http://www.indium.com/indium51AT_ or email: abrown@indium.com
