SMT, PCB Electronics Industry News

Highly Dense Electronic Hardware at IEMT-EMAP 2016

Sep 15, 2016

KYZEN Sdn Bhd’s Technical Sales Manager,TC Loy.

KYZEN Sdn Bhd’s Technical Sales Manager,TC Loy.

KYZEN is pleased to announce plans to exhibit and present during the conferences at IEMT-EMAP 2016, scheduled to take place Sept. 20-22, at the G-Hotel in Penang, Malaysia. KYZEN Sdn Bhd’s Technical Sales Manager, TC Loy, will present the paper authored by Mike Bixenman, MBA, DBA and Jason Chan, entitled, “Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation.”

The miniaturization of modern electronics decreases conductor widths, which can create higher risk to insulation failure. As distances between conductors are reduced, electronic hardware is more vulnerable to insulation failure, higher voltage gradients and easier to form a corrosion cell. Inter-conductor spacing influences the migration rate and is inversely related with conductor width. Acceleration factors create multiple stresses due to activation energy, temperature, humidity and voltage.

Removal of process residues is needed to reduce electrochemical migration. Cleaning electronic hardware is well-known. The challenges with cleaning highly dense hardware are many. Low standoff gaps prevent flux outgassing and can underfill the bottom termination with active flux residue. Mixed metals can react with alkaline cleaning agents, which can result in galvanic corrosion. The time and energy needed to reach the residue and remove contamination under the component requires high pressure spray impingement and increased wash time.

The purpose of this research is to present cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Mr. Loy will present the material compatibility on mixed metals, cleaning performance and Surface Insulation Resistance of the residue under the bottom termination.


KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.

Jun 10, 2024 -

KYZEN to Focus on AQUANOX A4618 and ANALYST2 at SMTA Oregon

Jun 10, 2024 -

KYZEN to Highlight 3D Printing Process Resin Cleaners at RAPID + TCT

May 27, 2024 -

KYZEN Puts Focus on Understencil and PCB Cleaners at SMTA Querétaro

May 27, 2024 -

KYZEN to Focus on Two AQUANOX Chemistries at SMTA Upper Midwest Expo & Tech Forum

May 20, 2024 -

KYZEN to Showcase Advanced Packaging Solutions at PCIM Europe 2024

May 13, 2024 -

KYZEN's Adam Klett to Keynote at SMTA Electronics in Harsh Environments Conference

May 06, 2024 -

KYZEN to Highlight AQUANOX A4618 and ANALYST2 at SMTA Rocky Mountain Expo and Tech Forum

Apr 29, 2024 -

KYZEN Announces Exclusive Partnership with Manufacturers' Representative Restronics Florida

Apr 29, 2024 -

KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Ciudad Jaurez Expo & Tech Forum

Apr 29, 2024 -

KYZEN to Focus on AQUANOX A4618 at SMTA Wisconsin Expo & Tech Forum

601 more news from KYZEN Corporation »

Jun 11, 2024 -

Shaping the Future: Prototyping Solutions for Industry Pioneers

Jun 10, 2024 -

KYZEN to Focus on AQUANOX A4618 and ANALYST2 at SMTA Oregon

Jun 10, 2024 -

Heraeus Successfully Defends Patent for Metal Sintering

Jun 10, 2024 -

SHENMAO Develops Thermal Fatigue-Resistant Solder Paste PF918-P250 for High-Reliability Requirements

Jun 10, 2024 -

KYZEN to Highlight 3D Printing Process Resin Cleaners at RAPID + TCT

Jun 10, 2024 -

StenTech BluPrint™ PVD Surface Treatment showcased at SMTA Querétaro Expo & Tech Forum

Jun 10, 2024 -

MicroCare Introduces Cutting-Edge Tergo™ Cleaning Fluids to Precision Cleaning Fluid Line

Jun 10, 2024 -

Odyssey Electronics Enhances PCB Assembly Quality with Acquisition of MIRTEC MV-6 AOI Machine from The Murray Percival Company

Jun 10, 2024 -

Essemtec is exhibiting at SMTconnect booth 4.209.

Jun 10, 2024 -

James Will to Lead USPAE as New Executive Director

See electronics manufacturing industry news »

Highly Dense Electronic Hardware at IEMT-EMAP 2016 news release has been viewed 956 times

Reflow Oven

Global manufacturing solutions provider