Aug 03, 2016 The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road,
Laurel, MD 20723, on Tuesday, August 30th.
During this year’s expo, the Capital Chapter will host technical presentations by re:3D, Kyzen Corporation, Nokia, and MET Stencil. Specific topics include “How 3D Printing Hardware and New Materials are Changing the Face of Manufacturing,” “Video Analysis of Solder Paste Release From Stencils,” “Implementation of a Collaborative Industrial Consortia Program to Characterize the Thermal Fatigue Reliability of 3rd Generation Pb-Free Solder Alloys,” and “An Investigation into the Use of Nano Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios.”
Registration includes a complimentary lunch on the show floor as well as the opportunity to win numerous door prizes. Registration opens at 8:00 AM and the first technical presentation will start at 9:00 AM. Exhibits are open from 9:00 AM until 3:00 PM.
Please join us for this great networking and educational event. To register online to attend or exhibit, please visit http://www.smta.org/expos/#capital.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to join, please visit www.smta.org.
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