Hesse and Knips Bondjet 815

Model:	Hesse and Knips Bondjet 815
Category:	Semiconductor & Solar
Model Year:	2012
Condition:	used
Location:	Netherlands
Offered by:	Fix Trade BV
	Contact Supplier

Wire Bonder by Hesse and Knips, in good condition.
 
Hesse and Knips Bondjet 815 product information.

Working area
300 mm x 180 mm (12.3’’ x 7’’)
Solid piezo bondheads
45° standard deep
Deep access
60° optional
Wear free PIEZO technique
Fully mechatronical solution
Process advantages
Extremely short to extremely long loops:
75 µm - over 20 mm
Fine Pitch: 40 µm
Constant wire length function or constant loop height
programmable
Height of working area
960 mm according to SMEMA
Above working table 125 mm +/- 1 mm
Ribbon (Deep Access bondhead)
6 µm x 35 µm up to 25 µm x 250 µm with Deep Access
bondhead easy conversion from wire to ribbon
Lighting
Programmable in 256 brightness levels
LED-ringlight and vertical light sources
Camera
Mini-CCD-camera
CCIR-Norm
Wire
Aluminum, gold 17.5 µm - 60 µm
Positioning accuracy
Repeated positioning 3 µm at 3 σ
Power supply
2.2 kW
230 V, 50 - 60 kHz, + 8 %, - 10 %
Compressed air
5 bar, clean and dry
Dewpoint - 35 ° C
Filtered < 10 µm
Machine Dimensions
1820 mm x 920 mm x 1400 mm (H x W x D)
Weight
1100 kg