SUPPLIER: INSPECTION TECH
PARMI ZEUS-L
Model: |
PARMI ZEUS-L |
Category: |
|
Model Year: |
2020 |
Condition: |
|
Location: |
South Korea |
Offered by: |
|
|
|
| Contact INSPECTION TECH |
3D Wafer Bump &
Wire Bonding AOI Inspection system
- Highest quality 3D Wire-Inspection.
- With high-resolution, complete inspection is possible even for Foot-shape.
- Inspect Mirror-surface without Reflection problem.
- As for PEMTRON'S unique optical technology, Coaxial lighting was applied to 3D installation.
- All Packages including SIP / FCBGA / FOWLP / FOPLP / WLCSP can be dealt.
- AOI + SPI Multi-Hybrid System.
- With high resolution quality, inspection of small and dense parts such as Bump, Mini LED, parts lower than 009004, etc. are optimized.
Company Information:
.gif)
