Approaches for additive manufacturing of 3D electronic applications

Published:

September 16, 2020

Author:

Hoerber, J.; Glasschroeder, J.; Pfeffer, M.; Schilp, J.; Zaeh, M.; Franke, J.

Abstract:

Additive manufacturing processes typically used for mechanical parts can be combined with enhanced technologies for electronics production to enable a highly flexible manufacturing of personalized 3D electronic devices. To illustrate different approaches for implementing electrical and electronic functionality, conductive paths and electronic components were embedded in a powder bed printed substrate using an enhanced 3D printer. In addition, a modified Aerosol Jet printing process and assembly technologies adapted from the technology of Molded Interconnect Devices were applied to print circuit patterns and to electrically interconnect components on the surface of the 3D substrates....

  • Download Approaches for additive manufacturing of 3D electronic applications article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

See Company Website »

Company Postings:

(1) technical library article

  • Mar 19, 2024 - What is Underfill | GPD Global
  • Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
  • Browse Technical Library »

Approaches for additive manufacturing of 3D electronic applications article has been viewed 440 times

See Your 2024 IPC Certification Training Schedule for Eptac

SMT Machines china