Resource-efficient adhesion and potting technologies in electronics manufacturing
Published: |
August 2, 2022 |
Author: |
Scheugenpflug |
Abstract: |
Saving resources in electronics manufacturing is not an end in itself. It is closely linked with reducing costs and gaining a competitive advantage. However, innovative adhesion and potting technologies in combination with highly functional adhesives and potting media make a significant contribution to the ideal union between economic performance and a reduced ecological footprint.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Scheugenpflug Inc. »
- Mar 20, 2024 - How to optimize dispensing processes
- Feb 06, 2024 - Inline Quality Control and Position Detection in Dispensing Systems
- Jul 27, 2023 - High-precision dispensing technology: Potting technology for medical wearables
- Feb 15, 2023 - Potting-optimized component design
- Sep 29, 2022 - Dispensing Thermally Conductive Materials
- See all SMT / PCB technical articles from Scheugenpflug Inc. »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Resource-efficient adhesion and potting technologies in electronics manufacturing article has been viewed 430 times