Package-on-Package (PoP) for Advanced PCB Manufacturing Process
Published: |
December 16, 2021 |
Author: |
Joseph Y. Lee, Jinyong Ahn, JeGwang Yoo, and Shuichi Okabe |
Abstract: |
In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Samsung Electro-Mechanics »
- Dec 13, 2012 - Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
- See all SMT / PCB technical articles from Samsung Electro-Mechanics »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Package-on-Package (PoP) for Advanced PCB Manufacturing Process article has been viewed 436 times
