A Novel Material for High Layer Count and High Reliability Printed Circuit Boards
Published: |
September 27, 2012 |
Author: |
Jie Wan, Junqi Tang, Xianping Zeng |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of withstanding Pb-free soldering processes used in the assembl... |
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davef
October 3, 2012
Hello Jie Wan. In Figure 9: '24 layers 1.0 mm BGA, Thermal shock 288? 3 times wicking,' you show 'wicking.' What is 'wicking?' Is wicking delamination? What's happening there? Is that a through hole wall where the wicking is occurring?