New Approaches to Develop a Scalable 3D IC Assembly Method
Published: |
August 11, 2016 |
Author: |
Charles G. Woychik Ph.D. Sangil Lee, Ph.D., Scott McGrath, Eric Tosaya and Sitaram Arkalgud Ph.D. |
Abstract: |
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Invensas Corporation »
- Jan 28, 2015 - BVA: Molded Cu Wire Contact Solution for Very High Density Package-on- Package (PoP) Applications
- Sep 15, 2011 - Near Term Solutions For 3D Packaging Of High Performance DRAM
- See all SMT / PCB technical articles from Invensas Corporation »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
New Approaches to Develop a Scalable 3D IC Assembly Method article has been viewed 712 times