Wafer-Level Packaging (WLP) and Its Applications
Published: |
October 23, 2023 |
Author: |
Maxim Integrated Circuits |
Abstract: |
This application note discusses the Maxim Integrated's wafer-level packaging (WLP) and provides the PCB design and surface-mount technology (SMT) guidelines for the WLP... |
You must be a registered user to talk back to us. |
Company Information:
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Wafer-Level Packaging (WLP) and Its Applications article has been viewed 176 times