Identification and Prevention of "Black Pad"
Published: |
January 17, 2013 |
Author: |
Kong Hui Lee |
Abstract: |
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Jabil Circuit, Inc. »
- Apr 17, 2023 - Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBA
- Mar 13, 2023 - An Introduction To The Process Of Printed Electronics
- Oct 18, 2018 - Analysis of the Design Variables of Thermoforming Process on the Performance of Printed Electronic Traces
- May 13, 2006 - Wave Solder Parameter Chart
- See all SMT / PCB technical articles from Jabil Circuit, Inc. »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Identification and Prevention of "Black Pad" article has been viewed 931 times
