PCB Quality Metrics that Drive Reliability
Published: |
January 23, 2023 |
Author: |
Bhanu Sood, Ph.D. |
Abstract: |
PDC Outline Section 0: Intro Section 1: What is reliability and root cause? Section 2: Overview of failure mechanisms Section 3: Failure analysis techniques – Non-destructive analysis techniques – Destructive analysis – Materials characterization Section 4: Summary and closure... |
You must be a registered user to talk back to us. |
Company Information:
More articles from NASA Office Of Safety And Mission Assurance »
- Apr 22, 2024 - Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation
- Sep 18, 2023 - Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability
- Aug 14, 2023 - HALT/HASS and Thermal Cycling to Assess COTS Boards, GoPro Camera and Advanced PBGA/CCGA Virtex-5Electronic Packages
- Sep 25, 2022 - Cracking Problems in Low-Voltage Chip Ceramic Capacitors
- Dec 21, 2021 - Reliability of PWB Microvias for High Density Package Assembly
- See all SMT / PCB technical articles from NASA Office Of Safety And Mission Assurance »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
PCB Quality Metrics that Drive Reliability article has been viewed 423 times