Investigating the Metric 0201 Assembly Process
Published: |
December 24, 2020 |
Author: |
Clive Ashmore |
Abstract: |
The advance in technology and its relentless development is delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst reducing the overall product size, the next generation of chip package is being readied upon the surface mount community. The Metric 0201 will have dimensions in the order of 0.25mm x 0.125mm, as a result the entire assembly process will be questioned as to its ability to deliver high volume/quality product.... |
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