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Material Effects of Laser Energy When Processing Circuit Board Substrates during Depaneling

Published:

April 27, 2017

Author:

Ahne Oosterhof, Eastwood Consulting

Abstract:

Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Understanding the effects of the laser energy to the substrate material properly is essential in order to take advantage of the technology without creating unintended side effects.

This paper presents an in-depth analysis of the various laser system operating parameters that were performed to determine the resulting substrate material temperature changes. A theoretical model was developed and compared to actual measurements. The investigation includes how the temperature increase resulting from laser energy during depaneling affects the properties of the PCB substrate, which varies from no measurable change to a lowering of the surface resistance of the cut wall depending on the cutting parameters....

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Company Information:

LPKF Laser & Electronics

With its broad product range LPKF is one of the world market leaders in the "in-house rapid PCB prototyping" and "StencilLaser" services

Tualatin, Oregon, USA

Drilling/Routing, Manufacturer of Assembly Equipment

  • Phone 503-454-4200
  • Fax 503-682-7151

LPKF Laser & Electronics website

Company Postings:

(10) products in the catalog

(2) technical library articles

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