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A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Paste

Published:

April 13, 2017

Author:

Karl Seelig, Tim O'Neill

Abstract:

The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.

As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.

The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs....

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Company Information:

AIM Solder

AIM is a leading global manufacturer of tin-lead and lead-free solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer of Assembly Material, Soldering

  • Phone +1-514-494-2000

AIM Solder website

Company Postings:

(44) products in the catalog

(12) technical library articles

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