Room Temperature Fast Flow Reworkable Underfill For LGA


October 3, 2016


Dr. Mary Liu and Dr. Wusheng Yin


With the miniaturization of electronic device, Land Grid Array (LGA) or QFN has been widely used in consumer electronic products. However there is only 20-30 microns gap left between LGA and the substrate, it is very difficult for capillary underfill to flow into the large LGA component at room temperature. Insufficient underfilling will lead to the loss of quality control and the poor reliability issue. In order to resolve these issues, a room temperature fast flow reworkable underfill has been successfully developed with excellent flowability. The underfill can flow into 20 microns gap and complete the flow of 15mm distance for about 30 seconds at room temperature. The curing behavior, storage, thermal cycling performance and reworkability will be discussed in details in this paper....

  • Download Room Temperature Fast Flow Reworkable Underfill For LGA article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

Company Information:

YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

Components/Substrates, Contract Manufacturer, Manufacturer of Assembly Material

  • Phone 5184522880

YINCAE Advanced Materials, LLC. website

Company Postings:

(21) products in the catalog

(13) technical library articles

(28) news releases

(2) job postings

More SMT / PCB technical articles from YINCAE Advanced Materials, LLC.

Nov 17, 2016 -

A High Thermal Conductive Solderable Adhesive

Jan 12, 2016 -

A Low Cost Manufacturing Solution - Low Temperature Super-Fast Cure and Flow Reworkable Underfill

Jan 12, 2016 -

A Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive - Capillary Underfill Replacement

Jan 12, 2016 -

A Low Temperature Solder Joint Encapsulant for Sn/Bi Applications

Jan 12, 2016 -

Solderable Anisotropic Conductive Adhesives for 3D Package Applications

Jan 12, 2016 -

An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates

Jan 12, 2016 -

Solder Joint Encapsulant Adhesive - LGA High Reliability And Low Cost Assembly Solution

Jan 08, 2016 -

The Future of Solder Joint Encapsulant

Jun 02, 2014 -

Solder Joint Encapsulant Adhesive Pop TMV High Reliability And Low Cost Assembly Solution

May 12, 2014 -

Solder Joint Encapsulant Adhesive POP Assembly Solution

Room Temperature Fast Flow Reworkable Underfill For LGA article has been viewed 700 times


Metcal soldering rework