Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Article posted by XYZTEC bv


Mechanical stress test for component solder joints and bonding wires

Published:

August 24, 2016

Author:

MINIMOTOR Benelux

Abstract:

From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device....

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Company Information:

XYZTEC bv

XYZTEC is the market and technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester, providing leading customers with fully automated shear, push and pull testing.

Panningen, Netherlands

Adhesives/Dispensing, Inspection, Manufacturer of Test Equipment

  • Phone +31-77-3060920
  • Fax +31-77-3060919

XYZTEC bv website

Company Postings:

(5) products in the catalog

(1) upcoming event

(2) technical library articles

(9) news releases

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