Today's Vapor Phase Soldering An Optimized Reflow Technology for Lead Free Soldering
Published: |
March 20, 2014 |
Author: |
Dipl.-Ing. Helmut Leicht; Andreas Thumm - IBL-Löttechnik GmbH. |
Abstract: |
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).... |
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