Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
Published: |
August 16, 2012 |
Author: |
David M. Lee, Lesly A. Piñol, PhD |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu... |
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Effects of Tin and Copper Nanotexturization on Tin Whisker Formation article has been viewed 748 times
davef
August 17, 2012
David ... Thanks for your paper. Why do you suppose that matte polycrystalline tin on polycrystalline copper did form whiskers (Figure 8), while matte tin on nanocrystalline copper did not form whiskers (Figure 3a), in disagreement with your previous work [1]?