The Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity.
Published: |
April 29, 2008 |
Author: |
David Hillman, Matt Wells, Kim Cho |
Abstract: |
The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfree implementation insures a transition period in which Pbfree and tin/lead solder finishes will be present on printed wiring assemblies... |
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