Technical Articles From Ghent University

High Yield Embedding of 30um Thin Chips in a Flexible PCB using a Photopatternable Polyimide based Ultra-Thin Chip Package (UTCP)

Oct 24, 2023 | T. Sterken, M. Op de Beeck, F. Vermeiren, T. Torfs, L. Wang, S. Priyabadini, K. Dhaenens, D. Cuypers and J. Vanfleteren

A thin chip package for off-the-shelf ICs is developed which enables the embedding of these chips into a flexible circuit board. The package consists of a copper fan-out on a polyimide substrate, in which the thinned IC (30um) is embedded. These packages are subsequently integrated in a standard flexible circuit board (FCB). A microcontroller and a proprietary DSP processor are embedded using this technology. The yield of the Ultra-Thin Chip package (UTCP) was measured before embedding in the circuit board, and reaches up to 87% for the packaged microcontrollers (MSP430 family, known-good dies). The yield on the DSP processor was measured to be 62%. After embedding in the FCB, 95% of the functional UTCP-packaged dies are still functional....