Technical Articles From In-Circuit Design Pty Ltd
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2 technical articles added by In-Circuit Design Pty Ltd
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Ground Pours - To Pour Or Not To Pour?
Feb 17, 2011 | Barry Olney
Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas < 2.5.mm square are deleted automatically by t...
Multilayer PCB Stackup Planning
Dec 02, 2010 | Barry Olney
Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate ca effectively reduce electromagnetic emissions, crosstalk and also make the...