Technical Articles From Würth Elektronik GmbH & Co. KG
Read technical articles about electronics manufacturing added by Würth Elektronik GmbH & Co. KG
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4 technical articles added by Würth Elektronik GmbH & Co. KG
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MOISTURE PHYSICS AND PROCESS OF DRYING OF PRINTED CIRCUIT BOARDS
Jan 08, 2024 | Würth Elektronik GmbH & Co. KG
The aim of this collection and interpretation is to develop an understanding of moisture in materials, especially in printed circuit boards, to know the effects on further processing and to be able to derive targeted corrective actions when moisture-related problems occur. In principle, the considerations are valid for all types of PCBs. Although these basic principles are of particular importance when working with flexible and rigid-flexible printed circuit boards; observing them can mean the difference between success or failure....
MEMS SENSOR PCB DESIGN AND SOLDERING GUIDELINES - ANM001
Oct 09, 2023 | Würth Elektronik
This technical document provides necessary information and general guidelines for soldering and PCB design for the Würth Elektronik eiSos MEMS sensor products with an LGA surface-mount package...
HDI Microvia Technology – Cost Aspects
Dec 21, 2021 | Stefan Keller
Points of discussion in "HDI Microvia Technology – Cost Aspects" are: - Reasons for the use of HDI technology - Printed circuit board (PCB) size - Number of layers - Stack-up and complexity - Other important cost influences -–Design rules -–Drilling costs -–Microvia filling...
Via Filling Applications in Practice
Jul 15, 2020 | Stefan Keller
Via Filling • Through Hole Vias - IPC-4761 – Plugging – Filling – Filled & Capped • MicroviaFilling and Stacked Vias...
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