Technical Articles From Teradyne
Read technical articles about electronics manufacturing added by Teradyne
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5 technical articles added by Teradyne
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Comparing Costs and ROI of AOI and AXI
Aug 07, 2013 | Peter Edelstein, Teradyne
PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen......
Principles of Analog In-Circuit Testing
Dec 26, 2012 | Anthony J. Suto, Teradyne
Passive components including resistors, capacitors, inductors, and circuit-protection devices compose the highest percentage of all devices that are populated on today’s PCB assemblies. However, the successful isolation and testing of these components during ICT is perhaps the most challenging and the least understood of all modern-day validation practices....
Issues and Challenges of Testing Modern Low Voltage Devices with Conventional In-Circuit Testers
Dec 14, 2012 | Alan J. Albee
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products, smaller packaging, and longer battery life. By shrinking the size of the features they etch into semiconductor dice, IC manufacturers achieve lower costs, while improving speed and building in more functionality. However, this move toward smaller features has lead to lower breakdown voltages and increased opportunities for component overstress and false failures during in-circuit test....
Designing PCBs for Test and Inspection
Dec 14, 2012 | Michael J. Smith, Teradyne
This article provides practical and affordable Design-for- Test (DFT) and Design-for-Inspection (DFI) methods that will have a positive impact on product costs, yield, reliability, and time-to-market. The properties of testability (including controllability and observability) will be analysed as they relate to analogue and digital design rules and their cause/effect, as well as the electrical and physical characteristics of proper PCB design....
Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies
May 03, 2012 | Anthony J. Suto
First published in the 2012 IPC APEX EXPO technical conference proceedings. Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled, un-powered, vec...
