Electronics Manufacturing Technical Articles
Technical Articles posted by SPIE - International Society for Optical Engineering
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SPIE - International Society for Optical Engineering Technical Articles
SPIE - International Society for Optical Engineering has 2 articles posted.
Conductive adhesives increase microchip packaging density
Published: |
Jun 24, 2010 |
Author: |
Jakob Gakkestad, Per Dalsjo, Helge Kristiansen, Rolf Johannessen, MaaikeM.V. Taklo |
Abstract: |
Interconnecting microelectromechanical systems directly to printed circuit boards can improve reliability and reduce costs of mediumcaliber fuzes.... |
Next-Generation Test Equipment For High-Volume Wafer Production
Published: |
Jun 23, 2010 |
Author: |
Kay Gastinger, Odd Løvhaugen |
Abstract: |
Quality control is one of the main bottlenecks in the production of micro-opto-electromechanical systems/microelectromechanical systems (MOEMS/MEMS) because each structure on a wafer is serially inspected and scanned stepwise over the entire wafer area. ... |
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