Technical Articles From GPD Global
Read technical articles about electronics manufacturing added by GPD Global
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11 technical articles added by GPD Global
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What is Underfill
Mar 19, 2024 | GPD Global
Underfill is a composite material usually made of an epoxy polymer that fills gaps between a chip and its carrier or a finished package and the PCB substrate to connect the chip to the board....
Conductive Adhesive Dispensing for Electronic Manufacturing
Sep 07, 2023 | GPD Global, Inc.
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds....
Small Volume Solder Paste Dispensing for Aerospace and Defense
Sep 07, 2023 | GPD Global, Inc.
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required....
Staking/Epoxy Adhesive Dispensing for Aerospace
Aug 16, 2023 | GPD Global, Inc.
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"...
Masking and Underfill Dispensing for Medical Device
Aug 16, 2023 | GPD Global, Inc.
In one of our medical applications projects, the customer wanted to dispense a mask to protect gold leads and an underfill on a silicon substrate with a clear test die. The substrates were Dymax X-499-91-C for Masking and Epoxibond-106M-1 for Underfill Dispensing...
Thermal Interface Material (TIM) Dispensing For Consumer Products
Aug 16, 2023 | GPD Global, Inc.
In one of our Consumer Electronics projects, a leader of networking technologies requested to test dispensing performance of a thermally conductive material, Fujipoly Sarcon SPG-50A. This material improves heat dissipation for higher frequency applications and reduces the negative effects of thermal resistance under heat, cold, humid, and thermal shock conditions. The customer's goal was to dispense a 1mm diameter dot with acceptable speed and consistency....
Underfill Dispensing For Aerospace Military And Defense
Aug 16, 2023 | GPD Global, Inc.
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate....
Solder Paste Dispensing For Aerospace and Defense
Aug 16, 2023 | GPD Global, Inc.
A global aerospace and defense leader requested a capability test of small volume solder paste dispensing on FR4 circuit boards....
LED Encapsulation for Consumer Products
Aug 16, 2023 | GPD Global, Inc.
In one of our Consumer Electronics projects, a smart lighting company wished to dispense silicone-based LED encapsulation material for two different product sizes. The larger product had a 9mm circular dam which required silicone dispensing flush with the top of the dam. The smaller product had a 1mm LED die that required only the top to be encapsulated. The material consisted of two parts which were mixed by weight in a 1:1 ratio. A phosphor powder was added totaling 10% of the overall weight. The phosphor required agitation to remain suspended....
Solder Mask Dispensing For Electronics and Aerostructures
Aug 16, 2023 | GPD Global, Inc.
One of our customers involved with Electronics and Aerostructures requested a test to dispense Techspray Wondermask 2204 solder mask. The dispensing locations include large and small screw holes, single through-hole vias, and connector locations consisting of multiple through-hole vias. The process needed to run quickly and reliably....
Dam and Fill Dispensing for Medical
Aug 16, 2023 | GPD Global, Inc.
One of our customers in the medical industry requested dam and fill application testing on a Kapton substrate. The material needed to be non-conductive for dispensing around electrical components, acting as structural support. Ultimately the product will be folded, therefore the footprint had to be small....
