Technical Articles From Juki Automation Systems
Read technical articles about electronics manufacturing added by Juki Automation Systems
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3 technical articles added by Juki Automation Systems
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SMT Placement for ICs, Connectors and Odd-Shaped Components
Nov 18, 2009 | Gerry Padnos Director of Technology, Juki Automation Systems.
Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement is accurate centering, or measurement of the component’s position on the placement head. One of the most widely used centering methods for ICs, connectors, and odd‐shaped components are a camera based system that measures the component position relative to a known point. Camera based centering systems include three main elements: lighting, camera, and software. Each of these elements are critical to obtaining an accurate measurement of the component and ultimately for accurate component placement on the PCB. As the old adage goes, the system is only as strong as its weakest link....
Integrated Offset Placement in Electronics Assembly Equipment - The Answer for Solder Paste Misalignment
Oct 29, 2008 | Juki Corp.
Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand....
High-Speed Stamp Soldering
Oct 09, 2008 | Todd O’Neil.
This article examines stamp soldering, a solution that provides consistent high quality by repeatedly applying accurate amounts of molten solder onto a printed circuit board using static volumetric solder stamps guaranteeing total flatness during the through-hole soldering process....
