Technical Articles From Sonoscan, Inc.
Read technical articles about electronics manufacturing added by Sonoscan, Inc.
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1 technical article added by Sonoscan, Inc.
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Method for Automated Nondestructive Analysis of Flip Chip Underfill
Nov 06, 2008 | Steven R. Martell, Ameya Mandlik and Kieren Mercer.
For many years Acoustic Micro Imaging (AMI) techniques have been utilized to evaluate the quality of the underfill used to support the solder bump interconnections of Flip Chip type devices. AMI has been established as one of the few techniques that can provide reliability and quality control data, but little has been done to automate the evaluation process for Flip Chip underfill until now....
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