Electronics Manufacturing Technical Articles

A Novel Solution for No-Clean Flux not Fully Dried under Component Terminations

Aug 17, 2017 | Dr. Ning-Cheng Lee & Fen Chen

At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process.

Examples including:

• Large low stand-off components such as QFN, LGA
• Components covered under electromagnetic shield which has either no or few venting holes
• Components assembled within cavity of board
• Any other devices with small open space around solder joints

Publisher: Indium Corporation

A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP

Aug 17, 2017 | Ming Hu, Lee Kresge, and Ning-Cheng Lee

A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies....

Publisher: Indium Corporation

Why is Customer Feedback So Important for PCB Assembly?

Aug 12, 2017 | Tuan Tran

PCB Assembly is Collaborative Manufacturing...

Publisher: Power Design Services

Generate Faster PCB Assembly Turnarounds

Aug 12, 2017 | Tuan Tran

The Case of Night Shifts vs. Additional Production Lines for PCB Assembly Efficiency...

Publisher: Power Design Services

High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass Interposers

Aug 10, 2017 | Sukhadha Viswanathan, Tomonori Ogawa, Kaya Demir, Timothy B. Huang, P. Markondeya Raj, Fuhan Liu, Venky Sundaram, Rao Tummala

This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules....

Publisher: Georgia Institute of Technology

Lean Six Sigma Approach to New Product Development

Aug 02, 2017 | Rita Mohanty

In this rapidly moving electronics market, fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little revealed that "New-Product Development (NPD) productivity in atop performing company is five times what it is in the average company. The top performer gets five times as much new product output for the same investment." What do they know that the rest of us do not? One winning factor is the use of the Robert Cooper process. (...)

This paper will present a Lean Six Sigma approach to "right sizing" the Stage Gate process to be efficient, practical, and easy to manage. Various tools of Stage Gate, along with proven best practice, will be covered. In addition, a reduced Stage Gate model will be discussed for simple, low risk projects....

Publisher: MacDermid Inc.

Strategic Material Management Generates Value

Aug 02, 2017 | Tuan Tran

When designing innovative products, material concerns often take a backseat to user experience goals. This is natural – after all, good products that offer value to end-users are essentially guaranteed a place on the modern tech marketplace. However, material management concerns take priority when considering the cost and turnaround time of product manufacture....

Publisher: Power Design Services

Electrochemical Methods to Measure the Corrosion Potential of Flux Residues

Jul 27, 2017 | Mike Bixenman, DBA, David Lober, Anna Ailworth - Kyzen Corporation, Bruno Tolla, Ph.D., Jennifer Allen, Denis Jean, Kyle Loomis - Kester Corporation

Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components....

Publisher: KYZEN Corporation

How to Produce the Best Circuit Boards – Fast!

Jul 24, 2017 | Tuan Tran

Professionally assembling circuit boards used to be slow. Many circuit board manufacturers still take up to two weeks or longer to produce circuit boards according to customer design specifications. ...

Publisher: Power Design Services

Strategic Material Management Generates Value

Jul 24, 2017 | Tuan Tran

When designing innovative products, material concerns often take a backseat to user experience goals. This is natural – after all, good products that offer value to end-users are essentially guaranteed a place on the modern tech marketplace. However, material management concerns take priority when considering the cost and turnaround time of product manufacture....

Publisher: Power Design Services