Feb 03, 2010 | OCM Manufacturing
This paper will consider the unique characteristics of the renewable energy and clean-tech sectors and explore how a smartly optimized electronics manufacturing outsourcing model can help OEMs accelerate their timeto- market and support their cost-per-kilowatt reduction goals....
Publisher: OCM Manufacturing
Jan 27, 2010 | Valor Computerized Systems
This paper reviews one of the single most important, but sometimes overlooked or taken for granted, aspects of the electronics industry – The PCB Design Grid System...
Publisher: Valor Computerised Systems Ltd
Valor develops software solutions for electronics product design analysis, simulation and optimisation of PCB assembly, and manufacturing operations management to increase productivity, yield and quality and accelerate product innovation.
Yavne , Israel
Jan 19, 2010 | François Monette, Cogiscan Inc. and Matt Van Bogart, Microscan Systems, Inc.
Learn how Trace, Track and Control (TTC) solutions help manufacturers cut cost, cut waste, automate critical manufacturing processes, and increase yields—all critical elements in today’s economic environment....
Jan 13, 2010 | Bob Wettermann
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations....
Publisher: BEST Inc.
BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.
Rolling Meadows, Illinois, USA
Jan 06, 2010 | Punit Kohli, Martin Sobczak, Jeff Bowin, Michael Matthews - Henkel / Ablestik Laboratories
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader....
Publisher: Henkel Electronic Materials
Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.
Irvine, California, USA
Dec 23, 2009 | APS Novastar
Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct temperature profile, with the narrow process window in lead-free applications, is now more important than ever. In each chamber or zone, air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a cyclone around the board. The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. This technology is ideal for the precise profiles needed for lead free soldering....
Publisher: DDM Novastar
Turnkey SMT assembly solutions, manual & automated stencil printers, manual & automatic pick & place systems with dispensers, wave solder & selective solder machines, lead free solder reflow ovens, component counters, & thru-hole
King of Prussia, Pennsylvania, USA
Dec 22, 2009 | Dr. Harald Wack, Umut Tosun, M.S.Chem.Eng., Dr. Joachim Becht, Dr. Helmut Schweigart
While most cleaning applications in the North American market rely on cleaning with DI-water only, for removing OA fluxes in first place, recent market studies show that water has reached its limitations in cleaning performance while favoring usage of aqueous processes. The term aqueous implies the use of aqueous-based chemistries with active ingredients and are usually diluted with DI-water. The nature of these active ingredients in the aqueous chemistries varies between manufacturer and his R&D knowledge. ...
Publisher: ZESTRON Americas
Dec 14, 2009 | Chris Nash, Indium Corporation
In this article, I will present a basic overview of soldering for those who are new to the world of soldering and for those who could use a refresher. I will discuss the definition of soldering, the basics of metallurgy, how to choose the proper alloy, the purpose of a flux, soldering temperatures, and typical heating sources for soldering operations....
Publisher: Indium Corporation
Dec 14, 2009 | Paul A. Socha, Indium Corporation.
Solder paste is the most recognized form of solder used in electronics assembly today. A surface mount application depends on solder paste to attach the components to the circuit board. However, solder paste may not be the only solution. This is especially true when working with through-hole components or very large devices that require more solder than can be supplied by printed solder paste. In fact, quite often a PCB involves mixed technology that requires more than one form of solder. Solder paste is used for the surface mount components and solder preforms are utilized to attach the leads on through-hole components, avoiding wave or selective soldering....
Publisher: Indium Corporation
Dec 14, 2009 | Liyakathali Koorithodi, Indium Corporation
In the lead-free era, thermal profiling has a critical role in the SMT assembly process. We discuss the profiling, tools, practical issues, and inspection methods of golden boards, and related tools. As the process window narrows, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies....
Publisher: Indium Corporation