Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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589 SMT / PCB Technical Articles

Surface Mount Rework Techniques

May 09, 1999 | Brian Moylan

This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices. ...

Publisher: Metcal

Metcal

Garden Grove, California, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Repair/Rework, Soldering

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Managing the transition on a global scale -- changing the cleaning agent means changes to equipment, processes, process control specifications and standards.

May 09, 1999 | William G. Kenyon, Sr. Research Associate

The production of electronics began with hand soldering, followed by manual cleaning, which reached its peak during the NASA program. Each step in the process tended to be considered on a stand alone basis, without thought being given to the preceding and following steps. Since each step had its own set of specifications, this led to a "patchwork" approach to overall quality....

Publisher: DuPont

DuPont

Wilmington, Delaware, United States

Manufacturer of Assembly Material, Components/Substrates, Laminates

World's most dynamic science company, creating sustainable solutions for a better, safer and healthier life.

Manufacturing Considerations When Implementing Voc-Free Flux Technology

May 07, 1999 | David Scheiner, Senior Technical Service Engineer Kester

In 1990 the United States Environmental Protection Agency Issued the Clean Air Act. The Clean Air Act and subsequent amendments are designed to limit the use of chemicals that contain volatile organic compounds (VOCs). The document goes into great detail setting limits for allowable VOC emissions for different industries....

Publisher: Kester

Kester

Itasca, Illinois, United States

Manufacturer of Assembly Material, Soldering

A leading global supplier of solder and related materials and services to the electronic assembly and micro-packaging marketplaces.

SMT Process Recommendations Defect Minimization Methods for a No-Clean SMT Process

May 07, 1999 | Kurt Rajewski

Key competitive advantages can be obtained through the minimization of process defects and disruptions. In today's electronic manufacturing processes there are many variables to optimize. By gaining an understanding of what the defects are, and where they come from, is a key step in the process towards defect free/six sigma manufacturing. In the last decade, Surface Mount Technology processes have been slowly converting towards the No-Clean philosophy. This new trend has spawned new processing issues which need to be addressed. This paper will investigate solutions to current problems in the processing of No-Clean SMT processes....

Publisher: Kester

Kester

Itasca, Illinois, United States

Manufacturer of Assembly Material, Soldering

A leading global supplier of solder and related materials and services to the electronic assembly and micro-packaging marketplaces.

Soldering to Gold Over Nickel Surfaces

May 07, 1999 | Dennis Bernier

There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold....

Publisher: Kester

Kester

Itasca, Illinois, United States

Manufacturer of Assembly Material, Soldering

A leading global supplier of solder and related materials and services to the electronic assembly and micro-packaging marketplaces.

Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing

May 07, 1999 | Merlin Kister, Kester Solder

Many manufacturers have now completed the conversion to no clean solder paste. Many factors governed this initial conversion, among those being cosmetics, solder ability, and process ability. In circuit testing or probing through no clean solder paste residues has topically not been a major factor in the conversion decision for several reasons. Due to board design, solder paste was only used on one side of the board and not subjected to testing......

Publisher: Kester

Kester

Itasca, Illinois, United States

Manufacturer of Assembly Material, Soldering

A leading global supplier of solder and related materials and services to the electronic assembly and micro-packaging marketplaces.

The Nature of White Residue on Printed Circuit Assemblies

May 07, 1999 | Dennis F. Bernier, Vice President, Research & Development, Kester Solder

White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence....

Publisher: Kester

Kester

Itasca, Illinois, United States

Manufacturer of Assembly Material, Soldering

A leading global supplier of solder and related materials and services to the electronic assembly and micro-packaging marketplaces.

The Effect Of Metallic Impurities On The Wetting Properties Of Solder

May 07, 1999 | Dennis Bernier, Kester Solder Company

This paper is a report of a study made to determine the maximum allowable impurities in solder used for wave soldering applications. This report concludes with a list of impurities compiled from actual analyses of solder which caused production problems. A list of recommended maximum allowable impurities will assist in establishing reliable quality controls on the purity level of the solder in a wave soldering machine....

Publisher: Kester

Kester

Itasca, Illinois, United States

Manufacturer of Assembly Material, Soldering

A leading global supplier of solder and related materials and services to the electronic assembly and micro-packaging marketplaces.

Implementation of a High-Quality Dolby* Digital Decoder Using MMX™ Technology

May 07, 1999 | James C. Abel, Michael A. Julier

Software decoding of Dolby Digital allows it to become a baseline capability on the PC, with greater flexibility than a hardware approach. Intel's MMX™ technology provides instructions that can significantly speed up the execution of the Dolby Digital decoder, freeing up the processor to perform other tasks such as video decoding and/or audio enhancement. Intel has worked closely with Dolby Laboratories to define an implementation of Dolby Digital based on MMX technology that has achieved Dolby's certification of quality....

Publisher: Intel Corporation

Intel Corporation

Santa Clara, California, United States

Manufacturer of Components

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

MMX™ Microarchitecture of Pentium® Processors With MMX Technology and Pentium® II Microprocessors

May 07, 1999 | Michael Kagan, Simcha Gochman, Doron Orenstien, Derrick Lin

The MMX™ technology is an extension to the Intel Architecture (IA) aimed at boosting the performance of multimedia applications. This technology is the most significant IA extension since the introduction of the Intel386™ microprocessor. The challenge in implementing this technology came from retrofitting the new functionality into existing Pentium® and Pentium® Pro processor designs....

Publisher: Intel Corporation

Intel Corporation

Santa Clara, California, United States

Manufacturer of Components

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

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