Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1753 SMT / PCB Assembly Related Technical Articles

Reliability Testing For Microvias In Printed Wire Boards

Jan 21, 2021 | Bill Birch

Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) these structures are proving less reliable, when compared to their single or double level counterparts. Recently false positive results have been recorded on products tested with traditional thermal shock testing methodology (cycling between -40°C and 125°C, or 145°C). A number of companies are incurring product failures resulting in increased costs associated with replacing the circuit boards, components and added labour....

Publisher: PWB Interconnect Solutions Inc.

PWB Interconnect Solutions Inc.

PWB designs and manufactures test equipment and provides services to test the reliability of Printed Circuit Boards.

Nepean, Ontario, Canada

Manufacturer

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

Jan 13, 2021 | Yu-An Shen, Shiqi Zhou, Jiahui Li, Chih-han Yang, Sijie Huang, Shih-kang Lin, Hiroshi Nishikawa

Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ......

Publisher: Osaka University

Osaka University

Osaka University, or Handai, is a public research university located in Osaka Prefecture, Japan. It was one of Imperial Universities in Japan, one of the Designated National University and selected as a Top Type university ...

Osaka, Japan

Research Institute / Laboratory / School

Design and Experiment of a Moving Magnet Actuator Based Jetting Dispenser

Jan 13, 2021 | Minh-Sang Tran and Sheng-Jye Hwang

Developing actuators to drive high-frequency jetting dispensers in the dispensing technology for electronic assembly applications has become a concern in recent years. This study proposed a new jetting dispenser without a displacement amplification mechanism directly actuated by a moving magnet actuator (MMA) to jet small fluid droplets. In this article, the main geometric dimensions of ......

Publisher: National Cheng Kung University

National Cheng Kung University

National Cheng Kung University is a public research university located in Tainan, Taiwan. NCKU is one of the best comprehensive universities in Taiwan and a leader in promoting industry-academia cooperation. ...

Tainan City, Taiwan

Research Institute / Laboratory / School

Challenges of Manufacturing with Printed Circuit Board Cavities

Jan 06, 2021 | William O. Alger, Pedro J. Martinez, Weston C. Roth

Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufacturing process varies by the individual PCB...

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Jan 03, 2021 | Ning-Cheng Lee

Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate....

Publisher: SMTnet

SMTnet

Helping businesses find each other.

Portland, Maine, USA

Consultant / Service Provider, Marketing Agency, Media / Publisher / Online Resource, Other

Fill the Void V - Mitigation of Voiding for Bottom Terminated Components

Dec 29, 2020 | Tony Lentz, FCT Assembly & Greg Smith, BlueRing Stencils

Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs)....

Publisher: FCT ASSEMBLY, INC.

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer

Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles

Dec 24, 2020 | englong Li , John Tudor, Russel Torah, and Steve Beeby, Senior Member, IEEE

A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm....

Publisher: University of Southampton

University of Southampton

The University of Southampton is a research university in Southampton, England. The university's origins date back to the founding of the Hartley Institution in 1862. In 1902, the Institution developed into the Hartley University

Highfield, Southampton, United Kingdom

Research Institute / Laboratory / School

Investigating the Metric 0201 Assembly Process

Dec 24, 2020 | Clive Ashmore

The advance in technology and its relentless development is delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst reducing the overall product size, the next generation of chip package is being readied upon the surface mount community. The Metric 0201 will have dimensions in the order of 0.25mm x 0.125mm, as a result the entire assembly process will be questioned as to its ability to deliver high volume/quality product....

Publisher: ASM Assembly Systems (DEK)

ASM Assembly Systems (DEK)

The ASM SMT Solutions segment is made up of SMT Printing Solutions (DEK) and SMT Placement Solutions (SIPLACE). Under the DEK brand, it sells best-in-class printing solutions for the electronics and solar industries.

Suwanee, Georgia, USA

Manufacturer

Making Sense of Laminate Dielectric Properties

Dec 16, 2020 | Michael J. Gay and Richard Pangier

System operating speeds continue to increase as a function of the consumer demand for such technologies as faster Internet connectivity, video on demand, and mobile communications technology. As a result, new high performance PCB substrates have emerged to address signal integrity issues at higher operating frequencies. These are commonly called low Dk and/or low loss (Df) materials. The published "typical" values found on a product data sheet provide limited information, usually a single construction and resin content, and are derived from a wide range of test methods and test sample configurations. A printed circuit board designer or front end application engineer must be aware that making a design decision based on the limited information found on a product data sheet can lead to errors which can delay a product launch or increase the assembled PCB cost. The purpose of this paper is to highlight critical selection factors that go beyond a typical product data sheet and explain how these factors must be considered when selecting materials for high speed applications...

Publisher: Isola Group

Isola Group

Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.

Chandler, Arizona, USA

Manufacturer

Moisture Effect on Properties of Out-of-Autoclave Laminates with Different Void Content

Dec 16, 2020 | Afshin Bayatpour, Mehdi Hojjati

Fabrication of large structures using out-of-autoclave prepreg materials will lead to a great amount of savings in manufacturing costs. In the out-of-autoclave processing method, the presence of voids inside the laminate has been an issue due to the lack of high pressure during manufacturing. This study aims primarily to observe the moisture absorption response of composite samples containing different levels of void. By changing the vacuum level inside the bag during the manufacturing process, three different unidirectional laminates at three levels of void have been manufactured. After immersing the samples in warm water at 60°C for about one year, the moisture absorption level was monitored and then diffusion coefficients were calculated using Fick's law. Results show that the moisture absorption coefficient changes by %8 within the experimental range of void contents. The mechanical behaviour of these laminates has been studied at four different moisture levels by performing dynamic mechanical analysis (DMA) and short beam shear tests. Empirical results indicate that, in general, interlaminar shear strength and glass transition temperature decrease by moisture build-up inside the samples. DiBenedetto equation is proposed to make a correlation between the moisture content and glass transition temperature....

Publisher: Concordia University

Concordia University

As a next-generation university, Concordia sets its sights further and more broadly than others. We align the quality of learning opportunities to larger trends and substantial challenges facing society. We pursue technology ...

Montreal, Quebec, Canada

Research Institute / Laboratory / School

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