Sep 18, 2009 | Steve Stach, Austin American Corporation, Mike Bixenman, Kyzen Corporation
Electronic assembly cleaning processes are becoming increasingly more complex because of global environmental mandates and customer driven product performance requirements. Manufacturing strategies today require process equivalence. That is to say, if a product is made or modified in different locations or processes around the world, the result should be the same. If cleaning is a requirement, will existing electronic assembly cleaning processes meet the challenge? Innovative cleaning fluid and cleaning equipment designs provide improved functionality in both batch and continuous inline cleaning processes. The purpose of this designed experiment is to report optimized cleaning process parameters for removing lead-free flux residues on populated circuit assemblies using innovative cleaning fluid and batch cleaning equipment designs....
Publisher: Austin American Technology
Sep 18, 2009 | Steve Stach, Austin American Technology
The stencil cleaner can be one of the most versatile tools on the manufacturing floor. It can be used to clean electronic modules in various stages of the manufacturing process. In fact, an automated stencil cleaner can clean just about anything you come up against in your PCB assembly process....
Publisher: Austin American Technology
Sep 18, 2009 | Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Sylvain Chamousset, Joachim Becht, Ph.D.; ZESTRON, Steve Stach, Austin American Technology Corp.
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil....
Publisher: ZESTRON Corporation
Sep 16, 2009 | Speedline Technologies, Inc.
The dispensing industry within electronics manufacturing represents a very diverse marketplace indeed; many different materials can be applied in many different ways. One high-growth area in this market is underfill, driven by the explosive demand for hand-held devices (HHDs). This segment is comprised of popular consumer goods, such as cell phones, mp3 players, GPS navigators, PDAs, portable games and ultra-mobile PCs. A new, non-contact dispense technology, known as Streaming, has recently been introduced to specifically address the incumbent needs associated with underfill....
Publisher: Speedline Technologies, Inc.
Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.
Franklin, Massachusetts, USA
Sep 09, 2009 | Mark Whitmore, Jeff Schake.
Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the deposition of adhesive coatings onto the backside of silicon wafers....
Publisher: DEK International
Sep 09, 2009 | Paul Nickelsberg, President and Senior Engineer with Orchid Technologies Engineering and Consulting
Power supply design for avionics has become an area of increased activity over the past few years. New to the market are industrial quality, high current, lithium based battery systems. Available from a wide variety of vendors, these batteries are characterized by their low weight and high- energy availability......
Orchid develops custom electronic products for OEM's.
Maynard, Massachusetts, USA
Sep 02, 2009 | Accuracy Competence Management, Assembléon BV.
The current trend of miniaturization in products and substrates is expected to continue in most advanced electronic products. Telecommunication and computer applications typically need high density connection boards incorporating smaller passive components, finer pitch IC’s and area array packages. The key factor in the technically successful evolution is the development of new interconnection processes, such as the use of conductive adhesive with very fine grained inter-connection materials....
Aug 26, 2009 | David Upton
Automated optical inspection (AOI) and automated X-ray inspection (AXI) have been around for some time in various configurations and both have played a role in improving the quality of circuit boards. While some companies opt for one technology over the other, each form of inspection contributes its own unique benefit to the manufacturing process....
Publisher: Nordson YESTECH
Aug 19, 2009 | Mike Konrad, President, Aqueous Technologies
There are several advantages to using a contract assembler. One of which is maintaining the ability to dictate desired results. Therefore, how those results are achieved becomes someone else's concern. When you combine this with the fact that many contract assemblers are not accustomed to saying "no," you become a witness to the birth of innovation....
Publisher: Aqueous Technologies Corporation
Aug 12, 2009 | Sjef van Gastel
Energy labels are a key part of global attempts to reduce consumption of environmental resources. They inform customers of the future consequence of their purchases. There are now many national and other energy labels covering houses, cars, lamps, washing machines and dryers, air conditioners, etc. The EU Energy using Products (EuP) directive also is working on classifying industrial applications to set rules for future energy reductions. These rules are at least three years away; until then, there are no energy labels for industrial manufacturing equipment....