Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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695 SMT / PCB Technical Articles

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

Aug 02, 2007 | Moody Dreiza, Lee Smith - Amkor Technology, Gene Dunn - Panasonic Factory Solutions, Niranjan Vijayaragavan, Jeremy Werner - Spansion.

This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR) (...) The scope of this paper is to cover the already popular 14 x 14mm PoP package size that provides a 152 pin stacked interface which supports a high level of flexibility in the memory architecture for multimedia requirements....

Publisher: Amkor Technology, Inc.

Amkor Technology, Inc.

Amkor Technology is the world's largest independent supplier of outsourced packaging and test semiconductor interconnect services; with more than 33 years of continuous improvement, growth and innovation. http://www.amkor.com

Chandler, Arizona, United States

Two-Photon Polymerization: A New Approach to Micromachining

Jul 24, 2007 | Andreas Ostendorf, Boris N. Chichkov, Laser Zentrum Hannover eV.

The rapid technical development of ultrashort laser systems is creating exciting possibilities for very precise localization of laser energy in time and space. These achievements have triggered novel laser applications based on nonlinear interaction processes. A promising three-dimensional microfabrication method that has recently attracted considerable attention is based on two-photon polymerization with ultrashort laser pulses....

Publisher: Aerotech, Inc.

Aerotech, Inc.

Since 1970, Aerotech has designed and manufactured the highest performance motion control, positioning tables/stages, and positioning systems for our customers in industry, government, science, and research institutions worldwide.

Pittsburgh, Pennsylvania, United States

Manufacturer of Assembly Equipment, Assembly, Component Packaging, Inspection, Pick and Place

Reduced Oxide Soldering Activation (ROSA)

Jul 19, 2007 | Sam Pepe, Chemist, American Competitiveness Institute / EMPF

ROSA is a surface restoration technique that removes hard to reduce species like metal oxides or sulfides. At the time of its development, the focus was on solderability and compliance to environmental regulations. Industry trends and regulatory changes as a result of the Montreal Protocol were the driver for much of the concern over environmental compliance. The result was an increase in the development of no-clean and water soluble fluxes and the removal of halogenated cleaning chemistries....

Publisher: Electronics Manufacturing Productivity Facility (EMPF)

Electronics Manufacturing Productivity Facility (EMPF)

The EMPF serves as a corporate residence of expertise in electronics manufacturing.

Philadelphia, Pennsylvania, United States

Other

Implementing Lead Free Soldering - European Consortium Research

Jul 12, 2007 | Dr. M. Warwick.

Over the last ten years, there have been a large number of publications describing work into lead free electronics soldering. They have come from all regions of the world and from academic organisations, individual companies and consortia. Although a number of these studies have culminated in "production trials", these have invariably been on a limited scale and they were essentially a demonstration, rather than the first step to implementation....

Publisher: Multicore Solders

Multicore Solders

Manufacturer of soldering materials, paste solder

Richardson, United Kingdom

Distributor

Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies

Jun 27, 2007 | Jason Higgins - Universal Instruments Corporation, Robert Hemann - Medtronic Microelectronics Center.

Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement....

Publisher: Universal Instruments Corporation

Universal Instruments Corporation

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry.

Conklin, New York, United States

Manufacturer of Assembly Equipment, Pick and Place

Selective Solder Paste Deposition Reliability Test Results.

Jun 21, 2007 | Bob Wettermann.

The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture (...) While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs....

Publisher: Business Electronics Soldering Technologies (BEST) Inc.

Business Electronics Soldering Technologies (BEST) Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, United States

Repair/Rework, Soldering, Service Provider, Training / Education

Large Thin Organic PTFE Substrates for Multichip Applications

Jun 13, 2007 | Ron Nowak, Paul Hart, Dave Alcoe.

Very high performance computer applications have created a demand for large organic substrates capable of interconnecting one or a few ASIC semiconductor devices with packaged memory devices. The electrical advantages offered by the use of a thin PTFE composite substrate were coupled with intrinsic mechanical advantages to create very high performance applications. The application development required interactions of design, fabrication, and new manufacturing technology to obtain rapid prototype production and allow a successful ensuing manufacturing ramp....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, United States

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Proof is in the PTH - Assuring Via Reliability from Chip Carriers to Thick Printed Wiring Boards

Jun 06, 2007 | Kevin T. Knadle, Virendra R. Jadhav.

Though today's microvias and high aspect plated through holes (PTH's) look nothing like the earliest through holes of 40 years ago, the PTH in its various forms remains the “weak link” and most critical element of printed wiring boards and laminate chip carriers (...) The paper outlines an approach to evaluating PTH reliability and quality that involves characterizing PTH life across a range of temperatures to reveal intricacies not seen by testing at a single delta-T, and certainly difficult to predict by modeling alone....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, United States

Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Component Packaging, Contract Manufacturer

Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs

May 31, 2007 | Michael Meilunas, Muffadal Mukadam, Peter Borgesen, Hari Srihari

This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder....

Publisher: Universal Instruments Corporation

Universal Instruments Corporation

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry.

Conklin, New York, United States

Manufacturer of Assembly Equipment, Pick and Place

Phase Convection™: The Lead-Free Solution

May 30, 2007 | Jean-Jack Boumendil, Pascal Preti.

Transition to lead-free is accelerating and when considering constraints related to lead-free and conventional solder pastes, one concern is rising: flexibility. It would be dangerous to commit to lead-free only while the technology is not yet stabilized. Manufacturers need to consider all of the issues related to lead-free and need to find flexible equipment which are able to adapt to both conventional and lead-free constraints....

Publisher: Vi TECHNOLOGY

Vi TECHNOLOGY

Vi TECHNOLOGY is a worldwide global supplier of a wide range of innovative Automated Inspection AOI, 3D-SPI equipment and software solutions that provide real time data collection and correlation across the SMT line.

Richardson, Texas, United States

Manufacturer of Assembly Equipment

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