Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Inline SMT Stencil Printers
  • Electronics manufacturing training materials - IPC, solder
  • PCB X-Ray Inspection
  • PCB Rework Tools
773 SMT / PCB Technical Articles

A HDMI Design Guide For Successful High-Speed PCB Design

Mar 25, 2009 | Thomas Kugelstadt, Senior Systems Engineer; Texas Instruments Inc.

This article presents design guidelines for helping users of HDMI mux-repeaters to maximize the device's full performance through careful printed circuit board (PCB) design. We'll explain important concepts of some main aspects of high-speed PCB design with recommendations. This discussion will cover layer stack, differential traces, controlled impedance transmission lines, discontinuities, routing guidelines, reference planes, vias and decoupling capacitors....

Publisher: Texas Instruments

Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers real world signal processing requirements. In addition to Semiconductor, the company includes the Educational & Productivity Solutions business. T

Dallas, Texas, USA

Manufacturer of Components

How Clean Is Clean?

Mar 19, 2009 | Michael Konrad, President; Aqueous Technologies Corporation

Over the past several years, post-reflow defluxing of circuit assemblies has gained in popularity. Microminiaturization of components and boards, combined with higher expected reliability and increased product liability, have contributed to the prominence of defluxing. Lead-free solder paste - with its higher reflow temperatures and negative effects on flux - increase the likelihood of post-reflow defluxing to increase a product's reliability and aesthetic appearance....

Publisher: Aqueous Technologies Corporation

Aqueous Technologies Corporation

Manufacturer of aqueous-based defluxing equipment, cleanliness testing equipment, and stencil cleaning equipment.

Rancho Cucamonga, California, USA

Cleaning

Startling Results From Reliability Testing

Mar 13, 2009 | Lars Wallin, Project Manager Live Production Events at EP shows at the Stockholm Fair IPC European Representative.

Open product reliability testing in Stockholm, Sweden in January as part of a live production event generated some quite startling results. It was apparent that many components simply cannot handle the high reflow temperatures of a lead-free soldering process, and that many surface-mount machine suppliers are battling significant problems with QFN packages and other components that are mounting edgeways (bill boarding). However, some suppliers have achieved good results....

Publisher: Mycronic Technologies AB

Mycronic Technologies AB

Mycronic, formerly MYDATA, is the key manufacturer of assembly machine for electronics. Our product portfolio contains Pick&Place machines, Jet-printing machines and component storage towers.

Täby, STOCKHOLM, Sweden

Assembly, Manufacturer of Assembly Equipment, OEM

When It Comes to Cost Reduction, Variation and Waste are the Enemy

Mar 05, 2009 | Mike Weekes.

In a recent survey of 89 organizations conducted by Whataboutquality.com, respondents were asked what few key characteristics defined quality, in the eyes of their customer, the most popular response was: the product or service met my requirements. The next two most popular responses were: it worked like I expected and it was a good value, worth what I paid for it (...) So how do you continue to exceed customer expectations and simultaneously reduce costs? There are two paths to take. You can find and reduce the variation in your process and you can eliminate as much of the non-value-added waste in your operation....

Publisher: Whataboutquality LLC

Whataboutquality LLC

Whataboutquality provides a full spectrum of business process improvement solutions. We can solve a specific issue, help you map out your organization, it's key processs in order to find opportunities and solutions.

Osprey, Florida, USA

Service Provider

Imbedded Component/Die Technology (IC/DT®)

Feb 26, 2009 | Mark McMeen.

STI has developed a patented1 packaging technology coined Imbedded Component/Die Technology (IC/DT®) to integrate multiple subsystems within an electronics assembly into a single, advanced, high-density assembly. Imbedded Component/Die Technology (IC/DT®) enables the manufacturing and assembly of smaller, lighter, and more technologically advanced high density CCAs through imbedding unpackaged components in a 3-D laminate substrate with integrated thermal management...

Publisher: STI Electronics

STI Electronics

Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry.

Madison, Alabama, USA

Assembly, Contract Manufacturer, Design, Training / Education

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

Feb 13, 2009 | Peter Biocca, Senior Engineer, Technical Manager; Kester ITW,

To meet the market demand for a best-in-class, low-cost leadfree alloy for wave, selective and dip soldering...

Publisher: Kester

Kester

A leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer of Assembly Material, Soldering

Coating Drug-eluting Arterial Stents Using Ultrasonic Spray Nozzles

Feb 04, 2009 | Harvey L. Berger

One proven method used to treat clogged arteries employs tubular, mesh-like metal structures, known as stents, inserted into an affected artery to relieve the blockage. Bare metal stents often cause a condition called restinosis, the buildup of scar tissue around the stent, causing re-blockage. To counter this, polymer coatings containing drugs that are released over time are used to inhibit restinosis. Applying coatings to stents, which have intricate geometries, is challenging. Using ultrasonic atomizing spray nozzles has proven effective in achieving continuous and uniform coatings. This paper describes the unique nozzle designs employed, the methodology used, and the results obtained....

Publisher: SONO-TEK CORPORATION

SONO-TEK CORPORATION

Manufacturer of precision ultrasonic spraying systems for a myriad of applications. Our patented technologies produce micron size uniform droplets, creating ultra thin layers onto any size or shape substrate.

Milton, New York, USA

Manufacturer of Assembly Equipment

Can You Afford Not To Improve in 2009?

Jan 29, 2009 | Michael Weekes.

Times are tough! Sales are down around the globe and it's getting more and more difficult to make a buck in the electronics industry. We all now have our cell phones and our big HD TV Screen at home so little of our materialistic world is unsatisfied. So how do we keep the doors open in 2009, let alone assure our future in the 21st Century?...

Publisher: Whataboutquality LLC

Whataboutquality LLC

Whataboutquality provides a full spectrum of business process improvement solutions. We can solve a specific issue, help you map out your organization, it's key processs in order to find opportunities and solutions.

Osprey, Florida, USA

Service Provider

Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies

Jan 21, 2009 | Dirk Ellis

This paper describes a new approach to drying circuit board assemblies that significantly reduces the cost of ownership of an aqueous cleaning system. Drying performance is increased through a hybrid drying process that reduces energy input, exhaust requirements and sound levels. The combination of high temperature blow-off and convection brings the flexibility to tailor drying performance to fit the product's drying requirements....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Adhesives/Dispensing, Cleaning, Manufacturer of Assembly Equipment, Screen Printing, Soldering

Pushing the barriers of wafer level device integration: High-speed assembly, the case for MicroTape.

Jan 21, 2009 | Gordon Christison

Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology....

Publisher: Siemens Corporation

Siemens Corporation

Siemens Corporation is a U.S. subsidiary of Siemens AG, a global powerhouse in electronics and electrical engineering, operating in the industry, energy, healthcare, and infrastructure & cities sectors.

Washington, District of Columbia, USA

Manufacturer of Assembly Equipment

per page.

SMT Services - STI Electronics