Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Electronics manufacturing training materials - IPC, solder
  • PCB Rework Tools

904 SMT / PCB Assembly Related Technical Articles

Voiding Control for QFN Assembly

Apr 07, 2011 | Derrick Herron, Dr. Yan Liu, and Dr. Ning-Cheng Lee

Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t...

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes.

Mar 30, 2011 | Kenneth Lee, Mustafa Özkök, Stefan Schmitz

The expression "multifunctional PCB", as a synonym for a PCB which is applicable with a variety of assembly techniques, is already established on the market. That means the PCB can be used for multiple reflow soldering and multiple assembly techniques lik...

Publisher: Atotech


One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer of Assembly Material, Manufacturer of Components, Components/Substrates

A Two-Layer Board Intellectual Property to Reduce Electromagnetic Radiation

Mar 24, 2011 | Nansen Chen, Hongchin Lin

In this paper, a PCB layout technique is proposed to maintain ideal return paths for high-speed traces routing. Our goal is to implement and verify the digital LCD-TV in 2-layer PCB including the high-speed memory interfaces with less electromagnetic radi...

Publisher: MediaTek Inc.

MediaTek Inc.

MediaTek is a market leader and pioneer in cutting-edge SOC system solutions for wireless communications, high-definition digital TV, optical storage, and high-definition DVD products.

Hsinchu City, Taiwan


Method of Modeling Differential Vias

Mar 17, 2011 | Lambert Simonovich, Dr. Eric Bogatin, Dr. Yazi Cao,

Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high bandwidth, scalable first approximation circuit model using simple transmission lines o...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada


Backplane Architecture High-Level Design

Mar 16, 2011 | Lambert Simonovich

The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane ...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada


Practical Fiber Weave Effect Modeling

Mar 16, 2011 | Lambert Simonovich

Fiber weave effect is becoming more of an issue as bit rates continue to sore upwards to 5GB/s and beyond. Due to the non-homogenous nature of printed circuit board laminates, the fiberglass weave pattern causes signals to propagate at different speeds wi...

Publisher: Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Stittsville, Ontario, Canada


Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

Mar 10, 2011 | Neil Poole, Ph.D. and Brian Toleno, Ph.D.

History shows that the electronics assembly industry is always up for a good challenge. This was proven with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of lead...

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

Manufacturer of Assembly Material

A New (Better) Approach to Tin Whisker Mitigation

Mar 03, 2011 | Craig Hillman, Gregg Kittlesen, and Randy Schueller

Most of the electronics industry by now knows about tin whiskers. They know whiskers are slim metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors. And they know that these shorts can cause some really bad failures (see nepp.nasa.gov/whisker/ for a list longer than you need). But, with all of this knowledge, the industry is still struggling on how to predict and prevent these "Nefarious Needles of Pain"....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

Dross and the Selective Soldering Process

Feb 24, 2011 | Alan Cable

In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction with the presence of Oxygen in two different areas of the process, and by separate means. Each must ...

Publisher: ACE Production Technologies

ACE Production Technologies

Manufacturer of Selective Soldering Machines, Lead Tinning Machines and related products.

Spokane Valley, Washington, USA

Soldering, Selective Soldering

Ground Pours - To Pour Or Not To Pour?

Feb 17, 2011 | Barry Olney

Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas < 2.5.mm square are deleted automatically by t...

Publisher: In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd

In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Bundall, Australia

Service Provider

Small Parts Tips

x-ray inspection system