Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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589 SMT / PCB Technical Articles

Comparing Costs and ROI of AOI and AXI

Aug 07, 2013 | Peter Edelstein, Teradyne

PCB architectures have continued their steep trend toward greater complexities and higher component densities. For quality control managers and test technicians, the consequence is significant. Their ability to electrically test these products is compounded with each new generation. Probe access to high density boards loaded with micro BGAs using a conventional in-circuit (bed-of-nails) test system is greatly reduced. The challenges and complexity of creating a comprehensive functional test program have all but assured that functional test will not fill the widening gap. This explains why sales of automated-optical and automated X-ray inspection (AOI and AXI) equipment have dramatically risen......

Publisher: Teradyne

Teradyne

North Reading, Massachusetts, United States

Manufacturer of Components, Manufacturer of Bare PCBs, Manufacturer of Assembled PCBs, Assembly, Design

Teradyne manufactures automatic test equipment that delivers competitive advantage to the world's semiconductor, electronics and network systems companies.

Essentials of SMT - Practical Know How

Aug 07, 2013 | Young Bong Kang

This is a practical technical book written by the author based on 24 years of experience. Almost all SMT books, due partially to a few SMT-related books, put weight on equipment, single process or part technology rather than deal with practical process. The book dealing with practical process know-how is rarely found and this is perhaps the first book in which overall SMT practical processes and standards are presented....

Publisher:

Glenrothes, Scotland

A Review of Corrosion and Environmental Effects on Electronics

Aug 01, 2013 | Rajan Ambat

Electronic industry uses a number of metallic materials in various forms. Also new materials and technology are introduced all the time for increased performance. In recent years, corrosion of electronic systems has been a significant issue. Multiplicity of materials used is one reason limiting the corrosion reliability. However, the reduced spacing between components on a printed circuit board (PCB) due to miniaturization of device is another factor that has made easy for interaction of components in corrosive environments. Presently the knowledge on corrosion issues of electronics is very limited. This paper reviews briefly the materials used in electronic systems, factors influencing corrosion, types of corrosion observed in electronics, and testing methods....

Publisher: Department of Manufacturing and Management Technical University of Denmark

Department of Manufacturing and Management Technical University of Denmark

Lyngby, Denmark

Training / Education

The Technical University of Denmark has an overall mission of developing and creating value using the natural sciences and the technical sciences to benefit society.

Using Automated 3D X-Ray Inspection to Detect BTC Defects

Jul 25, 2013 | Barbara Koczera, An Qi Zhao

Bottom-termination components (BTC), such as QFNs, are becoming more common in PCB assemblies. These components are characterized by hidden solder joints. How are defects on hidden DFN joints detected? Certainly, insufficient solder joints on BTCs cannot be detected by manual visual inspection. Nor can this type of defect be detected by automated optical inspection; the joint is hidden by the component body. Defects such as insufficients are often referred to as "marginal" defects because there is likely enough solder present to make contact between the termination on the bottom-side of the component and the board pad for the component to pass in-circuit and functional test. Should the board be subjected to shock or vibration, however, there is a good chance this solder connection will fracture, leading to an open connection....

Publisher: Flextronics International

Flextronics International

Singapore, Singapore

Manufacturer's Rep

Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.

Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods

Jul 18, 2013 | Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou, Irene NkengforAcha, Zhiyong Gu

Lead-free nanosolders have shown promise in nanowire and nanoelectronics assembly. Among various important parameters, melting is the most fundamental property affecting the assembly process. Here we report that the melting behavior of tin and tin/silver nanowires and nanorods can be significantly affected by the surface oxide of nanosolders....

Publisher: Department of Chemical Engineering, University of Massachusetts

Department of Chemical Engineering, University of Massachusetts

Lowell, Massachusetts, United States

Training / Education

The Chemical Engineering Department boasts an accomplished faculty, a diverse range of programs and degrees and well-established ties to industrial and research institutions.

Effect of BGA Reballing and its Influence on Ball Shear Strength

Jul 11, 2013 | S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute of Technology, Scott Rushia; MARTIN

This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient)....

Publisher: MARTIN (a Finetech company)

MARTIN (a Finetech company)

Manchester, New Hampshire, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Repair/Rework, Soldering

Manufacturer of rework and reballing systems, hand soldering solutions, and micro-dispensing technologies

PCB Guide Design

Jul 11, 2013 | Y. B. Kang

The basic is essential to understand any technology. In SMT, PCB design is an important factor as the technology is fully automated and all the work is performed by machine. Machine is a sensor and it works by sensing the data given to it, so the data should be accurate for quality product. In the attached topic the basics of SMT designing is explained. In the book “Essentials of SMT: Practical Know-How” all the basics of SMT manufacturing is explained in very simple and easy to understand language. ...

Publisher:

Glenrothes, Scotland

Performance of Kapton Stencils vs Stainless Steel Stencils for Prototype Printing Volumes Processes

Jul 03, 2013 | Bob Wettermann, Hung Hoang

It has been demonstrated in numerous pieces of work that stencil printing, one of the most complex PCB assembly processes, is one of the largest contributors to defects (Revelino et el). This complexity extends to prototype builds where a small number of boards need to be assembled quickly and reliably. Stencil printing is becoming increasingly challenging as packages shrink in size, increase in lead count and require closer lead spacing (finer pitch). Prototype SMT assembly can be further divided between industrial and commercial work and the DIYer, hobbyist or researcher groups. This second group is highly price sensitive when it comes to the materials used for the board assembly as their funds are sourced from personal or research monies as opposed to company funds. This has led to development of a lower cost SMT printing stencil made from plastic film as opposed to the more traditional stainless steel stencil used by industrial and commercial users.This study compares the performance of these two traditional materials and their respective impact on solder paste printing including efficiency and print quality....

Publisher: Business Electronics Soldering Technologies (BEST) Inc.

Business Electronics Soldering Technologies (BEST) Inc.

Rolling Meadows, Illinois, United States

Repair/Rework, Soldering, Service Provider, Training / Education

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Justifying AOI and Automated X-Ray

Jul 02, 2013 | Don Miller, YesTech Inc.

AOI and AXI systems can address multiple tasks in various locations of the manufacturing process and have become the leading technologies in the quest to identify defects and improve process yields....

Publisher: Nordson YESTECH

Nordson YESTECH

Carlsbad, California, United States

Inspection

Nordson YESTECH is a leading global provider of automated optical inspection and high-resolution x-ray inspection systems.

System Level ESD Part II: Implementation of Effective ESD Robust Designs

Jun 27, 2013 | Industry Council on ESD Target Levels

While IC level ESD design and the necessary protection levels are well understood, system ESD protection strategy and design efficiency have only been dealt with in an ad hoc manner. This is most obvious when we realize that a consolidated approach to system level ESD design between system manufacturers and chip suppliers has been rare. This White Paper discusses these issues in the open for the first time, and offers new and relevant insight for the development of efficient system level ESD design....

Publisher: Industry Council on ESD Target Levels

Industry Council on ESD Target Levels

Dallas, Texas, United States

Association, Non-Profit

An independent body of ESD experts with the mission to review the ESD robustness requirements of modern IC products for allowing safe handling and mounting

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