Jun 21, 2016 | Pete Doyon - VP Product Management, Schleuniger, Inc.
The trends in mobile electronics today are smaller, thinner and lighter. Yet, mobile devices are more powerful than ever. Applications, like wireless internet connections, RFID and Bluetooth, that have become essential in today’s devices, require more complex transmission mechanisms. As a result, manufacturers find themselves faced with the challenge of working with ultra-miniature RF cable assemblies....
Publisher: Schleuniger, Inc.
Jun 16, 2016 | Vern Solberg
Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.
This paper focuses on six basic embedded component structure designs described in IPC-7092....
Publisher: Vern Solberg - Solberg Technical Consulting
Jun 06, 2016 | Margaret Bishop (CAMI Research)
Learn how to choose a cable & harness tester that remains relevant as product design changes in addition to providing fast, reliable, accurate results. See how it can improve productivity even beyond the production floor....
Publisher: CAMI Research Inc.
CableEye® continuity and HiPot pass/fail & diagnostic Cable & Harness Test Systems w simple scripting, labeling, documentation, cataloging & relay control. Dynamically display continuity, Ω, diodes, IR, dielectric breakdown & more
Acton, Massachusetts, USA
Jun 06, 2016 | Rana Kalitha
One of the most important steps in PCB assembly is the need for conformal coating for PCB. The process of choosing a conformal coating spray is a complex one as it involves a number of confusing decisions revolving around selections and compromises. ...
Publisher: Sumitron Exports Pvt. Ltd.
May 30, 2016 | Kim M. Archuleta, Rochelle Piatt
New engineered cleaning and defluxing agents promise great improvement in cleaning and reliability for electronic assemblies. As complexity grows and dimensions shrink in high reliability electronics, the need for materials compatibility and effectiveness in cleaning and rinsing is vital....
Publisher: Sandia National Laboratories
May 30, 2016 | Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D., Anwar Mohammed, Murad Kurwa, AEG, Flextronics, George Tint Ph. D., Saki America.
As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes....
Publisher: Flex (Flextronics International)
May 26, 2016 | J. Servin, P. Gomez, M. Dominguez, A. Aragon
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides, in corrosion studies, the role of salt residues -with Cl ion- on some metals is known as being promoters of oxidation or corrosion. On the other hand, most of corrosion studies with tin metallization are focused mainly on the corrosion resistance of tin alloys, but little has been done respecting to the influence of salts on tin metallization wetting.
In this paper, a series of experiments was carried over to know the influence of specifically NaCl on BGA wetting given Head in Pillow (HiP) as result....
Publisher: Continental Corporation
May 19, 2016 | Erik Olson, Molly Smith, Greg Marszalek, Karl Manske
As consumers become more reliant on their handheld electronic devices and take them into new environments, devices are increasingly exposed to situations that can cause failure. In response, the electronics industry is making these devices more resistant to environmental exposures. Printed circuit board assemblies, handheld devices and wearables can benefit from a protective conformal coating to minimize device failures by providing a barrier to environmental exposure and contamination.
Traditional conformal coatings can be applied very thick and often require thermal or UV curing steps that add extra cost and processing time compared to alternative technologies. These coatings, due to their thickness, commonly require time and effort to mask connectors in order to permit electrical conductivity. Ultra-thin fluorochemical coatings, however, can provide excellent protection, are thin enough to not necessarily require component masking and do not necessarily require curing.
In this work, ultra-thin fluoropolymer coatings were tested by internal and industry approved test methods, such as IEC (ingress protection), IPC (conformal coating qualification), and ASTM (flowers-of-sulfur exposure), to determine whether this level of protection and process ease was possible....
Publisher: 3M Company
May 13, 2016 | Lior Yosef
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems....
Publisher: Mechanical Devices
May 12, 2016 | Yan Ning, Michael H. Azarian, Michael Pecht
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors’ finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue. ...
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