Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • PCB X-ray inspection
  • Aegis Industrial Software
  • PCB X-Ray Inspection
  • PCB Rework Tools
  • high speed SMT pick and place - Mirae Mx400
695 SMT / PCB Technical Articles

Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing

Feb 12, 2015 | Sabuj Mallik, Ahmed Z El Mehdawi

Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures.

The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150°C for up to 1000 hours. Upon ageing at 150°C the Sn-3.5Ag solder alloy initially age-softened for up to 200 hours. This behaviour was linked to the coarsening of grains. When aged beyond 200 hours the shear strength was found to increase up to 400 hours. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. The fractured surfaces of the broken solder balls were also investigated under a Scanning Electron Microscope. The shear failures were generally due to ductile fractures in bulk solders irrespective of the ageing time....

Publisher: School of Engineering, University of Greenwich

School of Engineering, University of Greenwich

Engineering has been a cornerstone of teaching at Greenwich since 1890. Our programmes cover the whole spectrum of information-age engineering and are specially designed to meet business and industry.

London, United Kingdom

Training / Education

Rework Stations: Meeting the Challenges of Lead-Free Solders

Feb 12, 2015 | Nigel Charig

Market forces, particularly legislation against the use of lead in electronics, have driven electronics manufacturers towards lead-free solders for PCB assembly and rework. This approach creates challenges because of the relatively high temperatures needed for lead-free soldering. Additionally, lead-free solder alloys typically do not wet or wick as easily as Sn63Pb37 leaded types. As PCBs often include both BGAs and simpler discrete devices, a lead-free rework capability should include a suitable soldering station and a BGA rework station. This article shows how such equipment can be adapted to overcome the lead-free issues and provide a successful reworking facility....

Publisher: Cupio Yestech Europe

Cupio Yestech Europe

Cupio provides and supports equipment for some of the world's top suppliers of test and inspection equipment aimed at production inspection and repair test.

Winchester, Hampshire, United Kingdom

Distributor

Basics of Ball Grid Arrays (BGAs)

Feb 05, 2015 | Advanced Assembly

Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today's high pin count, high frequency integrated circuits. However, that same pin density and unique interface create a challenge unique unto themselves. These challenges need to be faced head on since the ball grid array (BGA) is prevalent in modern PCBs. While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs....

Publisher: Advanced Assembly, LLC.

Advanced Assembly, LLC.

Advanced Assembly provides quality PCB assembly services for prototypes and low-quantity orders 87% faster than other shops.

Aurora, Colorado, United States

Manufacturer of Assembled PCBs, Assembly, Contract Manufacturer, Service Provider

An Alternative Solvent with Low Global Warming Potential

Feb 05, 2015 | R. Basu and R. Hulse

In the past 20 yrs the solvent industry has gone through a great deal of change. In the early 1990s, CFC-113 and 1,1,1-trichloroethane were the workhorses of the industry. The Montreal Protocol to phase-out substances that deplete the Earth's protective Ozone Layer was implemented in the mid 1990s. After phase-out of the CFC solvents, the solvent industry fragmented to a variety of cleaning solutions.

The electronics industry was a large user of CFC solvents and many of these applications changed to aqueous based cleaners (...) But those alternatives are now facing various problems: e.g. aqueous based cleaners use a lot of energy, require long drying times, use equipment that requires frequent maintenance, and require a large footprint; no-clean fluxes leave flux residues; and trichloroethylene and n-propyl bromide have toxicity issues. In response to these serious issues newer solvents and blends are being introduced in the marketplace...

Publisher: Honeywell International

Honeywell International

Honeywell is a Fortune 100 company that invents and manufactures technologies to address tough challenges linked to global macrotrends such as safety, security, and energy.

Morristown, New Jersey, United States

Manufacturer of Components

BVA: Molded Cu Wire Contact Solution for Very High Density Package-on- Package (PoP) Applications

Jan 28, 2015 | Vern Solberg, Ilyas Mohammed

Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a single package has compromised test efficiency and overall package assembly yield. Separation and packaging the semiconductor functions into sections, on the other hand, has proved to be more efficient and, even though two interposers are required, more economical. The separated logic and memory sections are configured with the same uniform outline for vertical stacking (package-on-package). The most common configuration places the logic section as the base with second tier memory section soldered to a mating contact pattern.

This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology....

Publisher: Invensas Corporation

Invensas Corporation

Invensas is focused on the development of cutting-edge enabling technologies in advanced semiconductor packaging for advanced mobility and storage products.

San Jose, California, United States

OEM

Radar Control Terminal (RCT) units

Jan 26, 2015 | Ensil

In 2005 Raytheon Technical Services Company, now Raytheon Information, Intelligence and Services (Raytheon IIS), approached Ensil regarding the repair of their manufactured Radar Control Terminal (RCT) units. The RCT TRS P/N 13563090-2, a key component in the AN/MPQ-64 Sentinel System, consisted of outdated parts which caused minor to major unit failures. Ensil repaired the RCT's at every turn, correcting any component with the parts still in circulation (mother boards, displays, power supplies) to provide the client with the best available technology. These repairs were completed to military standards and kept the RCT effective, allowing for the Sentinel radar to remain operational. However, the supply of outdated parts was eventually no longer available. Ensil offered the best possible solution, utilizing the skills of their knowledgeable engineering staff, they would reverse engineer a new computer to replace the obsolete RCT while maintaining the same form, fit and function....

Publisher: Ensil

Ensil

For over 30 years, Ensil provides printed circuit boards repair, diagnostic and reverse engineering services for a diverse range of military, industrial and medical equipment.

Markham, Ontario, Canada

Manufacturer of Assembled PCBs, Design, Repair/Rework, Test Services, Contract Manufacturer

High Temperature Ceramic Capacitors for Deep Well Applications

Jan 22, 2015 | R. Phillips, J. Bultitude, A. Gurav, K. Park, S. Murillo, P. Flores, M. Laps.

Temperature requirements for ceramic capacitors have increased significantly with recent advances in deep-well drilling technology. Increasing demand for oil and natural gas has driven the technology to deeper and deeper deposits resulting in extreme temperature environments up to 200°C and above. A novel capacitor solution utilizing temperature-stable base-metal electrode capacitors in a molded and leaded package addresses the growing market high temperature demands of (1) capacitance stability, (2) long service life, and (3) mechanical durability. A range of high temperature C0G capacitors capable of meeting this 200°C and above high temperature environment has been developed.

This paper will review the electrical, reliability, and mechanical performance of this new capacitor solution...

Publisher: KEMET Electronics Corporation

KEMET Electronics Corporation

KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.

Simpsonville, South Carolina, United States

Manufacturer of Assembly Equipment

Automotive Safety Systems Driving Growth in Automotive Sensor Cable Assemblies

Jan 12, 2015 | Pete Doyon, VP, Product Management, Schleuniger Inc.

V2V is a collision avoidance technology that transmits data between vehicles to help warn drivers of potential crashes. This technology would improve safety by allowing vehicles to communicate with each other and exchange basic safety data, such as position and speed and warn the driver of potentially dangerous situations....

Publisher: Schleuniger, Inc.

Schleuniger, Inc.

Schleuniger, Inc. is a leading manufacturer of wire processing equipment. Our innovative automatic and semi-automatic machines are designed to cut, strip, crimp and mark all types of wire and cable.

Manchester, New Hampshire, United States

Manufacturer of Assembly Equipment

The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies

Jan 08, 2015 | Richard Coyle, Richard Popowich, Debra Fleming, Peter Read - Alcatel Lucent, Raiyo Aspandiar, Vasu Vasudevan, Steve Tisdale - Intel Corporation, Iulia Muntele - Sanmina Corporation.

Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption.

Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern...

Publisher: Sanmina-SCI

Sanmina-SCI

Sanmina-SCI is a tier 1 provider of EMS and PWB along with vertically integrated capabilities from design through qualification.

San Jose, California, United States

The Last Will And Testament of the BGA Void

Jan 05, 2015 | Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins, Dr. David Bernard, John Travis, Dr. Evstatin Krastev, Vineeth Bastin - Nordson Dage.

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products.

This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis....

Publisher: Rockwell Collins

Rockwell Collins

Rockwell Collins (NYSE: COL) is a pioneer in the development and deployment of innovative communication and aviation electronic solutions for both commercial and government applications.

Cedar Rapids, Iowa, United States

Manufacturer of Assembled PCBs, Other

per page.

SP700avi inline stencil printer

High Speed SMT Pick and Place