Electronics Manufacturing Technical Articles
Papers and articles related to SMT, PCB & EMS industry.
- Technical Library
876 SMT / PCB Assembly Related Technical Articles
May 21, 2017 | Denise Anderson-Rivas
Reed Switches, or Herkons, are extremely useful for many electronic applications. Reed Switches work by means of magnetism in reed relays and for electrical circuit control. In the presence of a magnetic field the reed will either open or close, depending on it's original positioning and purpose. They are extremely useful as they are hermetically sealed and can operate in almost any environment.
Reed Switch insertion into PCBs have historically been conducted by means of manual labor, by hand. As Auto Insertion mechanisms have advanced, there are new technologies on the market that can accommodate these highly useful switches via automated machines. Through Hole Technologies (THT) have advanced to now offer mechanized equipment to automate an assembly line that requires Reed Switch insertion. The first ever Reed Switch Machine is now available on the market for production assembly and auto insertion uses. This will make electronic products requiring Reed Switches easier to produce, faster, and more affordable for an entire manufacturing production. ...
to provide you with guidance from the AI PCB design(DFM),AI process(NPI) to import equipment installation and auto insertion technology(THT) training, machine trouble shooting/upgrade/overhaul.
May 17, 2017 | Bruno Tolla Ph.D, Denis Jean, Xiang Wei Ph.D
The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.
From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness....
May 11, 2017 | Daniel Arp, Erwin Quiring, Christian Wressnegger and Konrad Rieck
Device tracking is a serious threat to the privacy of users, as it enables spying on their habits and activities. A recent practice embeds ultrasonic beacons in audio and tracks them using the microphone of mobile devices.
In this paper, we explore the capabilities, the current prevalence and technical limitations of this new tracking technique based on three commercial tracking solutions. To this end, we develop detection approaches for ultrasonic beacons and Android applications capable of processing these....
Publisher: Technical University Braunschweig
Development of a Consistent and Reliable Thermal Conductivity Measurement Method, Adapted to Typical Composite Materials Used in the PCB Industry
May 04, 2017 | François Lechleiter; Cimulec, Yves Jannot; Université de Lorraine
Most of today's printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis, especially when a good accuracy is expected. Few base material suppliers' datasheet show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.
After reminding of the fundamentals in thermal science, this paper gives an overview of the state-of the art in terms of thermal conductivity measurement on PCB base materials, and some typical values. It finally proposes an innovative method called transient fin method, and associated test sample, to perform reliable and consistent in plane thermal conductivity measurement on anisotropic PCB base materials....
Apr 28, 2017 | Don Fitchett
A major drawback to Industry 4.0 that few write about is maintenance of an industry 4.0 plant. The maintenance aspect is a much greater and immediate drawback than even the commonly known major concern of security, and the lesser concern of system integration standards. Maintenance of 4.0 systems has, and will continue to result in related huge increases in process downtime. The barriers to overcoming the maintenance/downtime drawbacks of a 4.0 system are almost insurmountable. Has the Smart Manufacturing Leadership Coalition (SMLC) addressed the maintenance paradox? “... model also demands the ability to calculate and manage risk and uncertainty within very different operating structures. ..” Continue reading in pdf or for even more see and share http://bin95.com/Industry40inUSA.htm ...
Publisher: Business Industrial Network
Offers training software and videos. Also on site training and seminars that qualify for CEUs to maintenance, engineering and management professionals.
St. Louis, Missouri, USA
Apr 27, 2017 | Ahne Oosterhof, Eastwood Consulting
Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Understanding the effects of the laser energy to the substrate material properly is essential in order to take advantage of the technology without creating unintended side effects.
This paper presents an in-depth analysis of the various laser system operating parameters that were performed to determine the resulting substrate material temperature changes. A theoretical model was developed and compared to actual measurements. The investigation includes how the temperature increase resulting from laser energy during depaneling affects the properties of the PCB substrate, which varies from no measurable change to a lowering of the surface resistance of the cut wall depending on the cutting parameters....
Publisher: LPKF Laser & Electronics
Apr 24, 2017 | Tuan Tran
The process of taking a design from schematic to actual working prototype is a complex one, however, and proper documentation is the best way to simplify it....
Publisher: Power Design Services
Apr 20, 2017 | Innovative Sensor Technology
IST AG thin film mass flow sensors offer solutions for a wide variety of flow applications. The thin film and membrane technologies incorporate highly accurate temperature sensors and heaters as core elements of the sensors. IST AGs flow sensors are applicable in gas (liquids upon request), have an operating temperature range of -30 °C to +450 °C, and can measure low rate and direction from 0.0001 m/s (microflowSens) to 100 m/s (respectively from 1 mL/min to 10 L/min). In addition to measuring flow rates, our sensors can detect the presence of a liquid, biofilm or bubbles as well as indicate liquid level. Development channels guarantee the best possible adaptation of our sensors, whether in terms of dynamic range, response time, directional detection or ambient conditions. ...
Publisher: Innovative Sensor Technology USA Division
Apr 20, 2017 | Tobias Sponholz, Lars-Eric Pribyl, Frank Brüning, Robin Taylor
The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)
This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability....
Apr 15, 2017 | Tuan Tran
Few things are more exciting to manufacturers than new product ideas. New designs, engineering challenges and the ability to deliver a new user experience are all rewarding hallmarks of innovation. However, the road that separates conceptualization and commercialization is riddled with tight turns and obstacles. Fast, efficient prototyping is one of the best ways to prepare yourself for the journey....
Publisher: Power Design Services