Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • Electronics manufacturing training materials - IPC, solder
  • PCB X-Ray Inspection
  • PCB Rework Tools
751 SMT / PCB Technical Articles

Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication

Oct 15, 2015 | Dave Sommervold, Chris Parker, Steve Taylor, Garry Wexler

The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the material makeup and printed board format, performance and reliability expectations can be further achieved. The thermal performance and electrical isolation needs are driven by the power requirements, but considerations of temperature range, mechanical durability and format, along with the physical package surrounding the substrate must also be managed. With a variety of material configurations and circuit format capabilities, the choices become a balancing of options to maximize performance and minimizing cost through Design For Manufacturability (DFM) in the circuit board fabrication. These challenges present the IMS printed board fabricator with material selections and fabrication processes unlike those for other printed board or ceramic applications....

Publisher: The Bergquist Company

The Bergquist Company

Bergquist, now a part of Henkel, supplies thermal-management solutions for electronic applications, serving a variety of industries ranging from automotive to consumer and industrial electronics as well as LED lighting.

Chanhassen, Minnesota, USA

Manufacturer of Assembly Material

Preparing for Increased Electrostatic Discharge Device Sensitivity

Oct 08, 2015 | Julian A. Montoya, Intel Corporation Hillsboro, Oregon

With the push for ever improving performance on semiconductor component I/O interfaces, semiconductor components are being driven into a realm which makes them more sensitive to electrostatic discharge, potentially increasing in sensitivity by 50% every 3-5 years. Today, the majority of modern day semiconductor components are being designed to meet 250Volts of charge device model sensitivity, and that could decrease to 125Volts in the next 3-5 years, and could again decrease to 50Volts-70Volts in the following 3-5 years. The entire electronics industry must prepare for this challenge....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer of Components

Printing of Solder Paste - A Quality Assurance Methodology

Oct 01, 2015 | Lars Bruno and Tord Johnson Ericsson AB and MTEK Consulting AB

Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix between large modules and small chip components on large and densely populated printed circuit boards. Having a process for quality assurance of the solder paste print is fast becoming a necessity.

This article describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing. This information should be used as feedback in order to improve the solder paste printing process....

Publisher: Ericsson AB

Ericsson AB

Ericsson AB manufactures and markets radio and television communication equipment. The company was formerly known as Ericsson Radio Systems AB. Ericsson AB (Sweden) operates as a subsidiary of Ericsson.

Stockholm, Sweden

Other

Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices

Sep 23, 2015 | Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad Kurwa

A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. (...) Flip chip bonding of bare die on MID can be employed to fully utilize MID’s advantage in device miniaturization. Compared to the traditional soldering process, thermo-compression bonding with gold stud bumps provides a clear advantage in its fine pitch capability. However, challenges also exist. Few studies have been made on thermocompression bonding on MID substrate, accordingly little information is available on process optimization, material compatibility and bonding reliability. Unlike solder reflow, there is no solder involved and no “self-alignment,” therefore the thermo-compression bonding process is significantly more dependent on the capability of the machine for chip assembly alignment....

Publisher: Flex (Flextronics International)

Flex (Flextronics International)

Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.

Singapore, Singapore

Design, Service Provider

Method for the Manufacture of an Aluminum Substrate PCB and its Advantages

Sep 17, 2015 | Joseph Fjelstad

RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest impacts have been felt by the mandated elimination of lead from electronic solder followed by the demand for the elimination of haloids from flame retardants used in traditional PCB laminates. In the years which have followed the electronics industry has been beset with a host of new challenges in its effort to comply. Failure mechanisms, both new and old, have surfaced which demand solution and the industry suppliers and manufacturing technologists have worked diligently to remedy those vexing faults through the development of a wide range of new materials and equipment for both board manufacture and assembly, along with modifications to the processes used in the manufacture and assembly of printed circuit boards....

Publisher: Verdant Electronics

Verdant Electronics

Pioneers in the area of solderless assembly technology and originators of the OCCAM process. Developing IP for next and future generations of high reliability and better performing electronic products.

Seattle, Washington, USA

Assembly

New High-Performance Organophosphorus Flame Retardant

Sep 10, 2015 | Kimberly M. White, Ph.D., Daniel De Schryver, Ph.D., and Randy Chaya

A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This non-reactive phosphorus-based material satisfies fire safety needs for a broad range of resins including epoxy, polyolefin, and polyamide. The combination of excellent flame retardant efficiency, high thermal stability and exceptional electrical properties is unique to this organophosphorus flame retardant and makes it a breakthrough technology for high speed, high frequency use in fast growing wireless and wired infrastructures. Resin performance data, including formulations with synergists, are presented in this paper....

Publisher: Albemarle Corporation

Albemarle Corporation

Albemarle is a leading specialty chemical company providing innovative chemistry solutions to customers in over 100 countries around the world.

Baton Rouge, Louisiana, USA

Components/Substrates

Embedded Fibers Enhance Nano-Scale Interconnections

Sep 03, 2015 | V. Desmaris, S. Shafiee, A. Saleem, A. Johansson and P. Marcoux

While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease of manufacture and the interconnection reliability are being reduced. This paper will introduce the use of embedded fibers in the interconnections as a means of addressing these issues....

Publisher: Smoltek AB

Smoltek AB

Smoltek offers a proprietary conductive nano-scale carbon technology tailored to support the future needs of the semiconductor industry.

Gothenburg, Sweden

Other

Adhesive Backed Plastic Stencils vs Mini Metal Stencils

Aug 27, 2015 | Bob Wettermann, MIT

Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components....

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, USA

Repair/Rework, Service Provider, Soldering, Training / Education

Challenges for Step Stencils with Design Guidelines for Solder Paste Printing

Aug 25, 2015 | Carmina Läntzsch, Georg Kleemann

The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil.

The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process....

Publisher: LaserJob

LaserJob

Founded in 1992, LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices.

Fürstenfeldbruck, Germany

Manufacturer of Assembly Material, Soldering

SELECT CONFORMAL COAT FORMULATION FOR PCB ENVIRONMENT

Aug 20, 2015 | Wes Noble

Temperature and Humidity on Selective Conformal Coating It is well known that selective conformal coating on printed circuit board (PCB) assemblies provides unparallel protection for PCB’s. Nevertheless, concentrated conditions of humidity, water, and high temperatures can have negative effects on the conformal coating itself causing it to fail and become inapt for its intended purpose. Taking this into consideration, it is prudent to choose the right type of conformal coating that best suits the application and environmental conditions under which an assembly is likely to undergo in use. The proper conformal coating will significantly reduce the likelihood of failure/rejection, saving both valuable time and money for any manufacturing process....

Publisher: ETS - Energy Technology Systems, Inc.

ETS - Energy Technology Systems, Inc.

Manufacturer of Fluid Dispensing Equipment for Selective Conformal Coating, Potting, Encasulation & Underfill including Inspection, Conveying and Curing. Total Solution Fluid Dispensing & Conformal Cocating Process Lines.

Deer Park, Washington, USA

Adhesives/Dispensing, Inspection, Manufacturer of Assembly Equipment, Soldering, Turnkey

ii-feed SMD Intelligent Feeder

 Reflow System