Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1757 SMT / PCB Assembly Related Technical Articles

The Effects of Long-Term Storage on Solderability of Semiconductor Components

Mar 02, 2022 | Rochester Electronics LLC

In today's consumer-driven electronic marketplace many products have a limited useful life and component suppliers are moving to shorter product lifecycles. However, there are several industries that require semiconductor components to have a much longer lifecycle. In many cases application lifecycles within the Industrial, Automotive, Medical, Aerospace and Defense sectors may extend up to 30 years or more. As a result, an ongoing component supply becomes critical to sustaining these applications throughout their useful lifecycle. For this reason, it is often a requirement that semiconductor components be stored for extended periods of time after production ends....

Publisher: Rochester Electronics LLC

Rochester Electronics LLC

Rochester Electronics is the world's largest continuous source of semiconductors–100% Authorized by over 70 leading semiconductor manufacturers. As an original manufacturer stocking distributor, Rochester has over 15 billion ...

Newburyport, Massachusetts, USA

Other

Effects Of Storage Environments On The Solderability Of Nickel Palladium- Gold Finish With Pb-Based And Pb- Free Solders

Mar 02, 2022 | Edwin Lopez, Paul Vianco, Samuel Lucero, and Carly George

The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH)....

Publisher: Sandia National Laboratories

Sandia National Laboratories

For more than 60 years, Sandia has delivered essential science and technology to resolve the nation's most challenging security issues.

Albuquerque, New Mexico, USA

Other

Solderability after Long-Term Storage

Mar 02, 2022 | Joelle Arnold, Cheryl Tulkoff and Greg Caswell

The effect of long-term storage on manufacturability and reliability is an area of major concern for companies that attempt to proactively manage component availability and obsolescence. A number of issues can arise depending on the technology and storage environment. Mechanisms of concern can include solderability, stress driven diffusive voiding, kirkendahl voiding, and tin whiskering. Of all of these, solderability / wettability remains the number one challenge in longterm storage....

Publisher: DfR Solutions (acquired by ANSYS Inc)

DfR Solutions (acquired by ANSYS Inc)

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting

College Park,

Consultant / Service Provider

Considerations for Minimizing Radiation Doses to Components during X-ray Inspection

Feb 21, 2022 | David Bernard, Richard C. Blish, II

The ability to undertake non-destructive testing on semiconductor devices, during both their manufacture and their subsequent use in printed circuit boards (PCBs), has become ever more important for checking product quality without compromising productivity. The use of x-ray inspection not only provides a potentially non-destructive test but also allows investigation within optically hidden areas, such as the wire bonding within packages and the quality of post solder reflow of area array devices (e.g. BGAs, CSPs and flip chips)....

Publisher: Nordson DAGE

Nordson DAGE

The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Aylesbury. Buckinghamshire,

Consultant / Service Provider, Manufacturer

Cleaning PCBs in Electronics: Understanding Today's Needs

Feb 16, 2022 | P.J.Duchi, Anne-Marie Laügt, Marie Verdier, G.Abidh

Because of the phase-out of CFCs and HCFCs, standard solder pastes and fluxes evolved from RA and RMA fluxes to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices...

Publisher: Inventec Performance Chemicals

Inventec Performance Chemicals

Innovative Soldering, Cleaning & Coating materials for high-tech industries. Matching performance with sustainability.

Bry-sur-Marne, France

Manufacturer

Additively Manufactured mm-Wave Multichip Modules With Fully Printed "Smart" Encapsulation Structures

Feb 09, 2022 | Xuanke He, Bijan K. Tehrani, Ryan Bahr, Wenjing Su, and Manos M. Tentzeris

This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process....

Publisher: Georgia Institute of Technology

Georgia Institute of Technology

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

Research Institute / Laboratory / School

Open Radio Unit White Box 5G

Jan 28, 2022 | Whizz Systems

This white paper provides an overview of the design and development process for the various hardware components that make up the 5G ORU white box. Whizz Systems is responsible for the electrical, thermal, mechanical engineering, and manufacturing aspects, as well as system validation and bring up of the turn key white box ORU solution....

Publisher: Whizz Systems

Whizz Systems

Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.

Santa Clara, California, USA

Consultant / Service Provider, Manufacturer

An Experimental Investigation of Fracture Toughness and Volume Resistivity of Symmetric Laminated Epoxy/ Glass Fiber/CNT multiscale composites

Jan 26, 2022 | Mahadevan Lakshmanan Karingamanna Jayanarayanan, Joyal Joesph

In this work an attempt is made to improve the fracture toughness and electrical conductivity of epoxy/glass fiber based laminates by the inclusion of carbon nanotube (CNT) fillers. The fiber orientation of the epoxy/ glass fiber (GF) fabric laminates was optimized based on estimation of mechanical properties. The carboxylic acid functionalized CNTs were incorporated into epoxy matrix by ultra-sonication method. The nano filled epoxy resin was used to prepare laminates with 30/45 GF fabric orientation. The CNT content was varied and its effect on the tensile properties was determined. The fracture toughness of multiphase composites was estimated using single edge notch bend (SENB) test. The presence of CNTs improved the fracture toughness by a crack bridging mechanism. The volume resistivity of multiphase composites was found to be superior to the conventional epoxy/CNT composite. The presence of glass fabric reduces the number of inter-tube contacts contributing to the reduction in volume resistivity....

Publisher: Amrita University

Amrita University

Amrita Vishwa Vidyapeetham is a multi-campus, multi-disciplinary research academia that is accredited 'A++' by NAAC and is ranked as one of the best research institutions in India.

Tamil Nadu, India

Research Institute / Laboratory / School

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

Jan 26, 2022 | Kenny Mahan, Yong Sun, Bongtae Han1, Sungwon Han, Mike Osterman

Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented experimentally: adhesion strength and puncture strength. A modified blister test using a predefined blister area is employed to assess the adhesion strength and a puncture test is employed to evaluate the puncture strength of the coating. After measuring the properties at time zero, the coatings are subjected to accelerated testing conditions (high temperature/humidity storage and temperature cycling) and the degradations of the coating properties are documented....

Publisher: CALCE Center for Advanced Life Cycle Engineering

CALCE Center for Advanced Life Cycle Engineering

The largest electronic products research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.

College Park, Maryland, USA

Consultant / Service Provider, Training Provider

An Electrochemical Sensor for Determination of Sulfite (SO32-) in Water Based on Molybdenum Disulfide Flakes/Nafion Modified Electrode

Jan 19, 2022 | Jie Yang, Xiangyu Xu, Xuyan Mao, Liang Jiang, Xueliang Wang

The assay for monitoring the content of sulfite ions (SO32−) is essentially important because sulfite has some seriously toxic effects on both environment and human health. For this, a SO32- electrochemical sensor was fabricated utilizing molybdenum disulfide (MoS2) and Nafion. The cyclic voltammetry (CV) and differential pulse voltammetry (DPV) showed that MoS2 had excellently catalytical activity for the redox of SO32-....

Publisher: Jining Medical University

Jining Medical University

Jining Medical University, is a public institution of higher learning in Jining and Rizhao, Shandong province, China

Jining City, Shandong Province, China

Research Institute / Laboratory / School

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