Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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614 SMT / PCB Technical Articles

The Basics of Soldering

Dec 14, 2009 | Chris Nash, Indium Corporation

In this article, I will present a basic overview of soldering for those who are new to the world of soldering and for those who could use a refresher. I will discuss the definition of soldering, the basics of metallurgy, how to choose the proper alloy, the purpose of a flux, soldering temperatures, and typical heating sources for soldering operations....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, United States

Manufacturer of Assembly Material, Soldering

Solder Preform Basics

Dec 14, 2009 | Paul A. Socha, Indium Corporation.

Solder paste is the most recognized form of solder used in electronics assembly today. A surface mount application depends on solder paste to attach the components to the circuit board. However, solder paste may not be the only solution. This is especially true when working with through-hole components or very large devices that require more solder than can be supplied by printed solder paste. In fact, quite often a PCB involves mixed technology that requires more than one form of solder. Solder paste is used for the surface mount components and solder preforms are utilized to attach the leads on through-hole components, avoiding wave or selective soldering....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, United States

Manufacturer of Assembly Material, Soldering

Thermal Profiling: A Practical Approach to Reflow Profiling

Dec 14, 2009 | Liyakathali Koorithodi, Indium Corporation

In the lead-free era, thermal profiling has a critical role in the SMT assembly process. We discuss the profiling, tools, practical issues, and inspection methods of golden boards, and related tools. As the process window narrows, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, United States

Manufacturer of Assembly Material, Soldering

Recommendations for Installing Flash LEDs on Flex Circuits

Dec 09, 2009 | Shereen Lim

For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assembly can be twisted or bent per the application needs. Flex circuits offer the same advantages as conventional printed circuit boards: quality, reliability, and high density....

Publisher: Avago Technologies

Avago Technologies

Leading designer, developer and global supplier of a broad range of analog semiconductor devices.

San Jose, California, United States

Manufacturer of Components

Considerations for High Speed PCB Track Design in 10Gb/s Serial Data Transmission

Dec 09, 2009 | Steve Bowers and Dr Herbert Lage Applications Engineering Avago Technologies Fiber Optic Products Division

A fundamental evaluation of a variety of approaches for designing a high-speed (10 Gb/s) serial differential electrical channel is examined. The application of the electrical interface has been simulated using HSpice software. It demonstrated how the signal quality could be affected by the use of microstrip versus stripline traces and their associated advantages and disadvantages is discussed. Example XFI channels were assembled from the simulation results to demonstrate viability of the application....

Publisher: Avago Technologies

Avago Technologies

Leading designer, developer and global supplier of a broad range of analog semiconductor devices.

San Jose, California, United States

Manufacturer of Components

BGA Package Component Reliability After Long-Term Storage

Dec 03, 2009 | R. Key, B. Lange, R. Madsen

This paper provides additional data in support of shelf life extension for BGA and Die Size BGA (DSBGA) Packages....

Publisher: Texas Instruments

Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers real world signal processing requirements. In addition to Semiconductor, the company includes the Educational & Productivity Solutions business. T

Dallas, Texas, United States

Manufacturer of Components

Component Reliability After Long Term Storage

Dec 03, 2009 | R. R. Madsen

Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension....

Publisher: Texas Instruments

Texas Instruments

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers real world signal processing requirements. In addition to Semiconductor, the company includes the Educational & Productivity Solutions business. T

Dallas, Texas, United States

Manufacturer of Components

Sustaining a Robust Fine Feature Printing Process

Nov 24, 2009 | George Babka; Assembléon, David Sbiroli, Chris Anglin; Indium Corporation, Richard Brooks, Christopher Associates

With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology to the limits of its potential. Miniaturization is driving the electronics industry to implement the smallest and tightest pitch components in order to meet their customer demands. But how much miniaturization is possible before there is a paradigm shift in the technology? At what point is solder paste no longer viable? How small of a feature can be printed with solder paste, and can this process be implemented into a production environment?...

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer of Assembly Equipment

SMT Placement for ICs, Connectors and Odd-Shaped Components

Nov 18, 2009 | Gerry Padnos Director of Technology, Juki Automation Systems.

Accurate component placement is a basic requirement for any pick and place machine. The first step towards accurate placement is accurate centering, or measurement of the component’s position on the placement head. One of the most widely used centering methods for ICs, connectors, and odd‐shaped components are a camera based system that measures the component position relative to a known point. Camera based centering systems include three main elements: lighting, camera, and software. Each of these elements are critical to obtaining an accurate measurement of the component and ultimately for accurate component placement on the PCB. As the old adage goes, the system is only as strong as its weakest link....

Publisher: Juki Automation Systems

Juki Automation Systems

Juki is one of the worlds leading SMT placement companies with over 25000 machines installed worldwide and is the pioneer of the modular automated assembly line.

Morrisville , North Carolina, United States

Manufacturer of Assembly Equipment

Economics, Technology Drive Industry To Non-Intrusive Board Test.

Nov 11, 2009 | Alan Sguigna Vice President Sales and Marketing ASSET InterTech, Inc.

Non-intrusive board test (NBT) has become an increasingly critical facet of contemporary board test strategies. Recent developments in basic electronic technology as well as the evolving economics of electronic test have combined to make NBT and the test technologies that comprise it, such as boundary-scan test, processor-controlled test (PCT) and built-in self test (BIST), a necessity....

Publisher: ASSET InterTech, Inc.

ASSET InterTech, Inc.

ASSET InterTech is the leading supplier of open tools for embedded instrumentation to engineers doing design validation, test and debug.

Richardson, Texas, United States

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