Jun 09, 2011 | Brian J. Leach
QFN Description: A QFN package is a QUAD-FLAT-NO LEAD device. This package is small and lightweight and has no leads (unlike a gull wing or J-leaded device). QFN’s have a thermal pad (paddle) on the bottom side of the part that offers heat dissipation and...
Publisher: AccuSpec Electronics, LLC
Jun 09, 2011 | Craig Leising
Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can pla...
Jun 02, 2011 | Edward Wyrwas, Lloyd Condra, Avshalom Hava
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs, ADCs, and memory. They are susceptible to electrical, mechanical and thermal modes of failure like other components on a printed circuit boa...
Publisher: DfR Solutions
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
College Park, Maryland, USA
May 26, 2011 | Ila Pal
The Semiconductor industry enabling today’s electronics market place is widely disseminated between multiple customer factions such as consumer electronics, telecommunications, automotive, medical devices, military, aerospace, industrial controls, embedde...
Publisher: Ironwood Electronics
May 19, 2011 | Sjef v. Gastel, Manager of Advanced Development, Assembléon
Electronic equipment manufacturers know that rework and scrap cost them money, but rarely know just how much. Calculating it is relatively straightforward knowing the production line’s First Pass Yield (FPY), though....
May 12, 2011 | Don DeGroot; CCNi, Peter Pupalaikis; LeCroy, Brian Shumaker; DVT Solutions, LLC
We clarify the role of signal loss measurements, aka Total Loss, in specifying and qualifying circuit board materials for high-speed electronic design. We then demonstrate the NIST Multiline measurement technique in particular by characterizing test line...
Publisher: Connected Community Networks, Inc.
May 05, 2011 | R. N. Das, K. I. Papathomas J. M. Lauffer, S. Rosser, M. D. Poliks, V. R. Markovich
Passives account for a very large part of today’s electronic assemblies. This is particularly true for digital products such as cellular phones, camcorders, and computers. Market pressures for new products with more features, smaller size and lower cost v...
Publisher: i3 Electronics
A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.
Endicott, New York, USA
Apr 21, 2011 | David Owen, Business Development Manager.
Switching systems, and in particular matrices are a key part of many tests systems, they allow a single core set of test equipment to be connected to the UUT, saving the cost of duplicating test equipment. That places the switching matrix in a very vulner...
Publisher: Pickering Interfaces Ltd.
Apr 14, 2011 | Holy Stone Tech Paper
Multilayer Ceramic Capacitors (MLCC) come in a broad range of sizes, geometries, and values, offering design engineers with many options for designing circuits. In many cases these MLCC’s offer advantages over other types of capacitors including low ESR/E...
Publisher: HolyStone International
Apr 07, 2011 | Derrick Herron, Dr. Yan Liu, and Dr. Ning-Cheng Lee
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size, such as a near die-sized footprint, thin profile, and light weight; (2) easy PCB t...
Publisher: Indium Corporation