Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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624 SMT / PCB Technical Articles

Reworking QFN's Newly Developed Cost Effective Approach

Feb 18, 2010 | Best Inc

This paper describes a new rework process for leadless devices where the devices can be manually placed without relying on capital equipment....

Publisher: Business Electronics Soldering Technologies (BEST) Inc.

Business Electronics Soldering Technologies (BEST) Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, United States

Repair/Rework, Soldering, Service Provider, Training / Education

Developing An Effective, Fast-Curing, Environmentally Sound Conformal Coating

Feb 10, 2010 | Phil Kinner; HumiSeal Europe

The electronics industry has recently undertaken the transition to lead-free processing as a direct consequence of the RoHS directive, which came into force in July 2006. However, this is unlikely to be the last transition required since the European Solvent Emissions Directive, 1999 is starting to be implemented and enforced by national governments. This is resulting in pressure on larger manufacturers, currently emitting more than 5 tonnes of solvent vapour per annum to take steps to limit and reduce their emissions....

Publisher: HumiSeal


The original creator and innovator in conformal coatings, HumiSeal® has led the way for over 50 years and today stands out as a uniquely experienced and dynamic company.

Blawnox, Pennsylvania, United States


Optimizing the Clean-Tech Manufacturing Mix

Feb 03, 2010 | OCM Manufacturing

This paper will consider the unique characteristics of the renewable energy and clean-tech sectors and explore how a smartly optimized electronics manufacturing outsourcing model can help OEMs accelerate their timeto- market and support their cost-per-kilowatt reduction goals....

Publisher: OCM Manufacturing

OCM Manufacturing

We provide a high-quality, one-stop resource, from electronics prototyping to design for manufacturing, test design, assembly, supply chain management, managed offshoring, and after-market support.

Ottawa, Ontario, Canada

Contract Manufacturer

The Universal PCB Design Grid System

Jan 27, 2010 | Valor Computerized Systems

This paper reviews one of the single most important, but sometimes overlooked or taken for granted, aspects of the electronics industry – The PCB Design Grid System...

Publisher: Valor Computerised Systems Ltd

Valor Computerised Systems Ltd

Valor develops software solutions for electronics product design analysis, simulation and optimisation of PCB assembly, and manufacturing operations management to increase productivity, yield and quality and accelerate product innovation.

Yavne , Israel

Software Manufacturer

Trace, Track and Control: High Production Output at Low Costs

Jan 19, 2010 | François Monette, Cogiscan Inc. and Matt Van Bogart, Microscan Systems, Inc.

Learn how Trace, Track and Control (TTC) solutions help manufacturers cut cost, cut waste, automate critical manufacturing processes, and increase yields—all critical elements in today’s economic environment....

Publisher: Microscan Systems Inc

Microscan Systems Inc

Microscan focuses on technologies of automatic identification, machine vision, and illumination with application solutions ranging from basic barcode reading up to complex machine vision inspection, gauging, and measurement.

Renton, Washington, United States

Other, Inspection

Micro-Sectioning of PCBs for Failure Analysis

Jan 13, 2010 | Bob Wettermann

Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations....

Publisher: Business Electronics Soldering Technologies (BEST) Inc.

Business Electronics Soldering Technologies (BEST) Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, United States

Repair/Rework, Soldering, Service Provider, Training / Education

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Jan 06, 2010 | Punit Kohli, Martin Sobczak, Jeff Bowin, Michael Matthews - Henkel / Ablestik Laboratories

Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader....

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, United States

Manufacturer of Assembly Material

Horizontal Convection Reflow Technology Defined

Dec 23, 2009 | APS Novastar

Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct temperature profile, with the narrow process window in lead-free applications, is now more important than ever. In each chamber or “zone”, air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a “cyclone” around the board. The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. This technology is ideal for the precise profiles needed for lead free soldering....

Publisher: DDM Novastar

DDM Novastar

Turnkey SMT assembly solutions, manual & automated stencil printers, manual & automatic pick & place systems with dispensers, wave solder & selective solder machines, lead free solder reflow ovens, component counters, & thru-hole

King of Prussia, Pennsylvania, United States

Manufacturer of Assembly Equipment, Pick and Place, Screen Printing, Soldering, Turnkey

Why Switch From Pure DI-Water to Chemistry

Dec 22, 2009 | Dr. Harald Wack, Umut Tosun, M.S.Chem.Eng., Dr. Joachim Becht, Dr. Helmut Schweigart

While most cleaning applications in the North American market rely on cleaning with DI-water only, for removing OA fluxes in first place, recent market studies show that water has reached its limitations in cleaning performance while favoring usage of aqueous processes. The term aqueous implies the use of aqueous-based chemistries with active ingredients and are usually diluted with DI-water. The nature of these active ingredients in the aqueous chemistries varies between manufacturer and his R&D knowledge. ...

Publisher: ZESTRON Corporation

ZESTRON Corporation

Manufacturer of high precision cleaning products and services for all required applications in the electronics manufacturing industry.

Manassas, Virginia, United States

Cleaning, Test Services

Defect Coverage for Non-Intrusive Board Tests

Dec 17, 2009 | Adam W. Ley

Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies to restore test coverage lost due to diminishing physical (probe) access to printed circuit boards (...

Publisher: ASSET InterTech, Inc.

ASSET InterTech, Inc.

ASSET InterTech is the leading supplier of open tools for embedded instrumentation to engineers doing design validation, test and debug.

Richardson, Texas, United States


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