Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

  • Europlacer SMT Pick & Place Machines
  • Reflow Ovens
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
  • PCB X-ray inspection
  • Solder Assembly Materials for the Electronics Industry
648 SMT / PCB Technical Articles

Power Supply Control from PCB to Chip Core

Jun 30, 2010 | Nur Devnani, Eileen Murray

As silicon technology advances to enable higher density ASICs, the core logic voltage decreases. The lower voltage, in combination with higher current requirements, requires tighter tolerances on the power supplies. The control of the power supplies from the PCB to the die is the subject of this study. A frequency sweep simulation using typical bypass values shows that a discrete package capacitor is not a significant factor in reducing the chip core power supply fluctuation. A small voltage boost at the PCB supply can provide a more economical solution to managing the device supplies....

Publisher: Avago Technologies

Avago Technologies

Leading designer, developer and global supplier of a broad range of analog semiconductor devices.

San Jose, California, United States

Manufacturer of Components

Conductive Adhesives Increase Microchip Packaging Density

Jun 24, 2010 | Jakob Gakkestad, Per Dalsjo, Helge Kristiansen, Rolf Johannessen, and Maaike M.V. Taklo

Cost-effective assembly of custom-designed microelectromechanical systems (MEMS) for medium-caliber fuzes is challenging. In particular, the environment must have a setback acceleration exceeding 60,000g and centripetal acceleration of 9000g/mm out of center in a 30mm173 projectile. In addition, the space available is very limited. The traditional approach is to mount the MEMS chip in a package that is then soldered to the printed circuit board (PCB). However, by mounting the MEMS chip directly to the PCB using conductive adhesive, we can increase the packaging density while reducing manufacturing cost....

Publisher: SPIE - International Society for Optical Engineering

SPIE - International Society for Optical Engineering

An international society advancing an interdisciplinary approach to the science and application of light.

Bellingham, Washington, United States

Association, Non-Profit

Next-Generation Test Equipment For High-Volume Wafer Production

Jun 23, 2010 | Kay Gastinger, Odd Løvhaugen

Quality control is one of the main bottlenecks in the production of micro-opto-electromechanical systems/microelectromechanical systems (MOEMS/MEMS) because each structure on a wafer is serially inspected and scanned stepwise over the entire wafer area. ...

Publisher: SPIE - International Society for Optical Engineering

SPIE - International Society for Optical Engineering

An international society advancing an interdisciplinary approach to the science and application of light.

Bellingham, Washington, United States

Association, Non-Profit

Effect Of Squeegee Blade On Solder Paste Print Quality

Jun 17, 2010 | Rita Mohanty, Bill Claiborne; Speedline Technologies | Frank Andres; Cookson Electronics

The solder paste deposition process is viewed by many in the industry as the leading contributor of defects in the Surface Mount Technology (SMT) assembly process. As with all manufacturing processes, solder paste printing is subject to both special and common cause variation. Just like using graduated cylinders from distinctly different manufacturing processes to measure a volume of liquid, using different blades types can contribute significant special cause variation to a process. Understanding the significant differences in print performance between blade types is an important first step to establishing a standard blade for an SMT process....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, United States

Manufacturer of Assembly Equipment, Adhesives/Dispensing, Cleaning, Screen Printing, Soldering

Validity of the IPC R.O.S.E. Method 2.3.25 Researched

Jun 10, 2010 | Mike Bixenman, Steve Stach

This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies....

Publisher: Kyzen Corporation

Kyzen Corporation

A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Nashville, Tennessee, United States


Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures

Jun 03, 2010 | Thomas McCarthy, Sean Reynolds, Jon Skelly

Strategies for successful design and manufacture of microwave multilayer printed circuit boards. All aspects from pad registration, dimensional stability, impedance fluctuation, fusion bonding, thermal ageing, z-axis expansion, reliability, to Young's mod...

Publisher: Taconic


Provider of solution for RF, microvave, and high-speed, digital circuitry design.

Petersburgh, New York, United States


The Reliability Challenges of QFN Packaging

May 27, 2010 | Randy Kong, Cheryl Tulkoff, Craig Hillman (presented at: SMTA China East Conference 2010)

The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages of QFNs are well documented, concerns arise with its reliability and manufacturability. Acceptance of this package, especially in long-life, severe-environment, high-reliability applications, is currently limited. One of the most common drivers for reliability failures is inappropriate adoption of new technologies, such as the case with QFN. In this presentation, we will review and discuss QFN related reliability concerns and challenges, and propose Physics-of-Failure (PoF) based approaches to allow the confident introduction of QFN components into electronics products....

Publisher: DfR Solutions

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, United States

Service Provider

FlyScan: Wenn eins plus eins mehr als zwei ist

May 24, 2010 | Bernd Hauptmann – Sales Manager Seica Deutschland GmbH

Die echte Integration zwischen ATE Flying Prober und Boundary Scan Tester, vorgestellt von Seica, kombiniert das Beste von beiden Testtechniken und multipliziert die Vorteile für den Anwender....

Publisher: SEICA SpA


SEICA offers innovative ATE solutions which range from Bare Board Test, Flying Probe Systems, In-Circuit and Combi Test to Functional Test.

Strambino, Italy

Manufacturer of Assembly Equipment, Test Services

Testing Digital Designs – The Boundary-scan Balance

May 20, 2010 | James Stanbridge, Steve Lees

As several industry pundits have expressed in recent years: "the era of 'one test method fits all' seems well behind us." For most test managers with even a modest mix of products, trying to formulate a test policy/philosophy has become a tricky balancing act at the best of times. James Stanbridge, Sales Manager UK for JTAG Technologies, and Steve Lees Managing Director of ATE Solutions look at the options....

Publisher: JTAG Technologies B. V.

JTAG Technologies B. V.

Market leader and technology innovator of boundary scan software and hardware products and services.

Eindhoven , Netherlands

Test Services, Software Manufacturer

Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

May 12, 2010 | Ronald C. Lasky, Ph.D., PE; Indium Corporation of America Daryl Santos, Ph.D., Aniket A. Bhave; Binghamton University

Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented. This paper is about such a procedure....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, United States

Manufacturer of Assembly Material, Soldering

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SP700avi inline stencil printer

No clean PCB solder paste