Jun 11, 2009 | Ranjit S Pandher, Brian G Lewis, Raghasudha Vangaveti, Bawa Singh
The shock reliability of solder joints has become a major issue for the electronic industry partly because of the ever increasing popularity of portable electronics and partly due the transition to lead free solders....
Publisher: Cookson Electronics
Jun 11, 2009 | Cree, Inc.
XLamp LEDs lead the solid-state lighting industry in brightness while providing a reflow-solderable design that is optimized for ease of use and thermal management. Lighting applications featuring XLamp LEDs maximize light output and increase design flexibility, while minimizing environmental impact. This application note serves as a guide to understanding thermal management of XLamp LEDs and minimizing the effects of elevated junction temperatures....
Publisher: Cree, Inc.
Jun 02, 2009 | Matti Niskala, Product Manager; Evox Rifa Group Oyj, a KEMET Company.
Today the lead free soldering process is a must in commercial electronics and it is also coming more and more important in automative and industrial electronics sectors in the near future. The most common choices for lead free solders are different Tin-Solder-Copper (SAC) alloys. Processes using SAC solders cause extra stress, because of increased process temperatures, especially to the plastic materials....
Publisher: KEMET Corporation
May 28, 2009 | Stuart Erickson, President; Ultrasonic Systems, Inc.
Considerable effort is ongoing to improve the efficiency and to move towards high-volume manufacturing of photovoltaic cells. Much attention has been focused on developing in-line processes to replace the current batch processes. A critical process to improve the performance of solar wafers is the application of Dopants. The basic requirement for this process is an automated method for applying a very thin, uniform film of Dopant to the silicon wafer as part of an in-line manufacturing process....
Publisher: Ultrasonic Systems, Inc.
May 21, 2009 | John Prymak, Corey Antoniades, Peter Blais, Allen Hill, Ken Lai, Mark Laps, Kevin Lynn, Reggie Phillips, Corey Riedl, Axel Schmidt, Bill Sloka, Paul Staubli; KEMET Corporation.
Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination....
Publisher: KEMET Corporation
May 14, 2009 | MYDATA automation
Is screen printing technology able to keep pace with rising quality demands and increasingly complex board layouts? Or, is new jet printing technology ready to fill the gap? A comparison study between the two methods reveals some interesting differences. Screen printers offer some possibilities for optimizing solder paste deposits, but optimization is far easier and quicker with the jet printer. At the same time, the ability to print individualized deposits on every single pcb pad may be the ultimate answer to the growing quality challenge....
May 07, 2009 | Crina Rauta, Dr. Abhijit Dasgupta and Dr. Craig Hillman, DfR Solutions.
Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growth are studied and measurement methods are discussed, including the preparation of the eutectic solder sample for phase size measurement. Three categories of models used to predict grain growth in polycrystalline materials are presented. Finally, phase growth in solder during high temperature aging and temperature cycling and its use as a damage correlation factor are discussed....
Publisher: DfR Solutions
College Park, Maryland, United States
DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.
Apr 30, 2009 | Protean Marketing Inc.
A brand is the most important strategic asset your business will ever possess. Yet ask even the most experienced marketer and they will struggle to communicate the concept in a single sentence. Furthermore, if you were to approach the majority of today's business-to-business organisations, they would probably tell you that branding finds little application in a market allegedly filled with dispassionate decision makers. However, an increasingly competitive market landscape is eroding this reality - if, indeed, it ever existed. B2B marketing must follow the example of its consumer-focused counterpart and embrace the notion that a strong brand has the power to differentiate, build and protect those it represents in the face of incessant commoditization....
Publisher: Protean Marketing Inc
Austin, Texas, United States
Protean Marketing is a specialist communications agency with offices in the USA and Europe. We help companies define, plan and execute marketing communications strategies that generate increased sales, revenue and market share.
Apr 30, 2009 | Kevin Knadle.
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored....
Publisher: Endicott Interconnect Technologies
Endicott, New York, United States
Providing customers with solutions in Information Technology, Communications, Instrumentation, Simulation, Medical, Aerospace/Defense and Automotive industries
Apr 23, 2009 | Zach Shook, Marketing Director; Count On Tools, Inc.
No SMT equipment can place accurately and run efficiently without quality nozzles and feeders. These two factors are the core of the pick and place process. If the machine is either unable to pick parts consistently or hold on to the components during the transport from feeder to PCB, defects will result. ...
Publisher: Count On Tools, Inc.
Gainesville, Georgia, United States
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.