Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


  • Europlacer SMT Pick & Place Machines
  • Precision, fluid dispensing systems for low volume, high mix, R&D, and high volume 24x7 production
620 SMT / PCB Technical Articles

Trace, Track and Control: High Production Output at Low Costs

Jan 19, 2010 | François Monette, Cogiscan Inc. and Matt Van Bogart, Microscan Systems, Inc.

Learn how Trace, Track and Control (TTC) solutions help manufacturers cut cost, cut waste, automate critical manufacturing processes, and increase yields—all critical elements in today’s economic environment....

Publisher: Microscan Systems Inc

Microscan Systems Inc

Microscan focuses on technologies of automatic identification, machine vision, and illumination with application solutions ranging from basic barcode reading up to complex machine vision inspection, gauging, and measurement.

Renton, Washington, United States

Other, Inspection

Micro-Sectioning of PCBs for Failure Analysis

Jan 13, 2010 | Bob Wettermann

Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations....

Publisher: Business Electronics Soldering Technologies (BEST) Inc.

Business Electronics Soldering Technologies (BEST) Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our experienced instructors teach professional soldering classes as we are an IPC certified training center.

Rolling Meadows, Illinois, United States

Repair/Rework, Soldering, Service Provider, Training / Education

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

Jan 06, 2010 | Punit Kohli, Martin Sobczak, Jeff Bowin, Michael Matthews - Henkel / Ablestik Laboratories

Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader....

Publisher: Henkel Electronic Materials

Henkel Electronic Materials

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, United States

Manufacturer of Assembly Material

Horizontal Convection Reflow Technology Defined

Dec 23, 2009 | APS Novastar

Leading up to the development of lead-free soldering alloys, Horizontal Convection* was developed for the reflow process. Getting the correct temperature profile, with the narrow process window in lead-free applications, is now more important than ever. In each chamber or “zone”, air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a “cyclone” around the board. The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. This technology is ideal for the precise profiles needed for lead free soldering....

Publisher: DDM Novastar

DDM Novastar

Turnkey SMT assembly solutions, manual & automated stencil printers, manual & automatic pick & place systems with dispensers, wave solder & selective solder machines, lead free solder reflow ovens, component counters, & thru-hole

King of Prussia, Pennsylvania, United States

Manufacturer of Assembly Equipment, Pick and Place, Screen Printing, Soldering, Turnkey

Why Switch From Pure DI-Water to Chemistry

Dec 22, 2009 | Dr. Harald Wack, Umut Tosun, M.S.Chem.Eng., Dr. Joachim Becht, Dr. Helmut Schweigart

While most cleaning applications in the North American market rely on cleaning with DI-water only, for removing OA fluxes in first place, recent market studies show that water has reached its limitations in cleaning performance while favoring usage of aqueous processes. The term aqueous implies the use of aqueous-based chemistries with active ingredients and are usually diluted with DI-water. The nature of these active ingredients in the aqueous chemistries varies between manufacturer and his R&D knowledge. ...

Publisher: ZESTRON Corporation

ZESTRON Corporation

Manufacturer of high precision cleaning products and services for all required applications in the electronics manufacturing industry.

Manassas, Virginia, United States

Cleaning, Test Services

Defect Coverage for Non-Intrusive Board Tests

Dec 17, 2009 | Adam W. Ley

Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies to restore test coverage lost due to diminishing physical (probe) access to printed circuit boards (...

Publisher: ASSET InterTech, Inc.

ASSET InterTech, Inc.

ASSET InterTech is the leading supplier of open tools for embedded instrumentation to engineers doing design validation, test and debug.

Richardson, Texas, United States

Inspection

The Basics of Soldering

Dec 14, 2009 | Chris Nash, Indium Corporation

In this article, I will present a basic overview of soldering for those who are new to the world of soldering and for those who could use a refresher. I will discuss the definition of soldering, the basics of metallurgy, how to choose the proper alloy, the purpose of a flux, soldering temperatures, and typical heating sources for soldering operations....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, United States

Manufacturer of Assembly Material, Soldering

Solder Preform Basics

Dec 14, 2009 | Paul A. Socha, Indium Corporation.

Solder paste is the most recognized form of solder used in electronics assembly today. A surface mount application depends on solder paste to attach the components to the circuit board. However, solder paste may not be the only solution. This is especially true when working with through-hole components or very large devices that require more solder than can be supplied by printed solder paste. In fact, quite often a PCB involves mixed technology that requires more than one form of solder. Solder paste is used for the surface mount components and solder preforms are utilized to attach the leads on through-hole components, avoiding wave or selective soldering....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, United States

Manufacturer of Assembly Material, Soldering

Thermal Profiling: A Practical Approach to Reflow Profiling

Dec 14, 2009 | Liyakathali Koorithodi, Indium Corporation

In the lead-free era, thermal profiling has a critical role in the SMT assembly process. We discuss the profiling, tools, practical issues, and inspection methods of golden boards, and related tools. As the process window narrows, profiling equipment and/or thermocouple (TC) errors must be taken into consideration. In addition, the accuracy and attachment method of the thermocouple will significantly impact critical assemblies....

Publisher: Indium Corporation

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, United States

Manufacturer of Assembly Material, Soldering

Recommendations for Installing Flash LEDs on Flex Circuits

Dec 09, 2009 | Shereen Lim

For the mobile market some PCB assemblies have been converted to flex circuit assemblies, in part because flex circuit assembly can be twisted or bent per the application needs. Flex circuits offer the same advantages as conventional printed circuit boards: quality, reliability, and high density....

Publisher: Avago Technologies

Avago Technologies

Leading designer, developer and global supplier of a broad range of analog semiconductor devices.

San Jose, California, United States

Manufacturer of Components

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