Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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1757 SMT / PCB Assembly Related Technical Articles

An Overview of Advanced Failure Analysis Techniques for Pentium® and Pentium® Pro Microprocessors

May 07, 1999 | Yeoh Eng Hong, Lim Seong Leong, Wong Yik Choong, Lock Choon Hou, Mahmud Adnan; Intel Penang Microprocessor Failure Analysis Department, Malaysia

Failure analysis (FA) is one of the key competencies in Intel. It enables very rapid achievement of world class manufacturing standards, resulting in excellent microprocessor time-to-market performance. This paper discusses the evolution of FA techniques from one generation of microprocessors to another....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

EUV Lithography -The Successor to Optical Lithography?

May 07, 1999 | John E. Bjorkholm

This paper discusses the basic concepts and current state of development of EUV lithography (EUVL), a relatively new form of lithography that uses extreme ultraviolet (EUV) radiation with a wavelength in the range of 10 to 14 nanometer (nm) to carry out projection imaging. Currently, and for the last several decades, optical projection lithography has been the lithographic technique used in the high-volume manufacture of integrated circuits. It is widely anticipated that improvements in this technology will allow it to remain the semiconductor industry's workhorse through the 100 nm generation of devices. However, some time around the year 2005, so-called Next-Generation Lithographies will be required. ...

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

MOS Scaling: Transistor Challenges for the 21st Century

May 07, 1999 | Scott Thompson, Paul Packan, Mark Bohr

To enable transistor scaling into the 21st century, new solutions such as high dielectric constaConventional scaling of gate oxide thickness, source/drain extension (SDE), junction depths, and gate lengths have enabled MOS gate dimensions to be reduced from 10mm in the 1970’s to a present day size of 0.1mm. To enable transistor scaling into the 21st century, new solutions such as high dielectric constant materials for gate insulation and shallow, ultra low resistivity junctions need to be developed. In this paper, for the first time, key scaling limits are quantified for MOS transistorsnt materials for gate insulation and shallow, ultra low resistivity junctions need to be developed....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

The Quality and Reliability of Intel's Quarter Micron Process

May 07, 1999 | Krishna Seshan, Timothy J. Maloney, Kenneth J. Wu

This paper describes how the quality and reliability of Intel's products are designed, measured, modeled, and maintained. Four main reliability topics: ESD protection, electromigration, gate oxide wearout, and the modeling and management of mechanical stresses are discussed. Based on an analysis of the reliability implications of device scaling, we show how these four topics are of prime importance to component reliability......

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

Why Wide Fine Pitch Pads?

May 07, 1999 | Rick Lathrop, Heraeus SMT Technical Services

Fine pitch SMT devices, although certainly not new, present more of an assembly processing challenge than 50 mil pitch devices. In fact it seems that the finer the pitch the more difficult or narrower the process window becomes. Besides the pitch of the leads being less on fine pitch devices narrower pad width on the board is typical. With fine pitch designs the board fabrication process is also stressed in that the strip of mask between the pads is designed narrower, the alignment of the mask to copper becomes more critical...

Publisher: Heraeus

Heraeus

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, USA

Manufacturer

Stereolithography and Simultaneous Engineering Speed Products to Market

May 07, 1999 | AMP Incorporated

Stereolithography is a handy tool not only for speeding a design to market but also in giving customers an early edge. By allowing a form-and-fit sample to be quickly made from a computer model, stereolithography coupled with simultaneous engineering allows customers to see product models early in the design cycle. And if a picture is worth a thousand words, what's a tangible sample worth?...

Publisher: TE Connectivity

TE Connectivity

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Schaffhausen, Switzerland

Manufacturer, Standards Setting / Certification, Training Provider

Solder Volumes for Through-Hole Reflow-Compatible Connectors

May 06, 1999 | AMP Incorporated

The success of surface-mount technology has not meant the end of through-hole connectors. For reasons ranging from availability to user concerns over reliability, through-hole connectors remain widely used. ...

Publisher: TE Connectivity

TE Connectivity

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Schaffhausen, Switzerland

Manufacturer, Standards Setting / Certification, Training Provider

Keeping Tin Solderable

May 06, 1999 | AMP Incorporated

Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself......

Publisher: TE Connectivity

TE Connectivity

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Schaffhausen, Switzerland

Manufacturer, Standards Setting / Certification, Training Provider

Specifying Current for the Real World

May 06, 1999 | TE Connectivity

To help the designer set the appropriate current level, AMP has developed a new method of specifying current-carrying capacity. This new method takes into account the various application factors that influence current rating. ...

Publisher: TE Connectivity

TE Connectivity

A technology leader in the world's fastest growing markets, helping connect power, data and signal in everything from automotive and aerospace to broadband communications, consumer, energy and industrial applications.

Schaffhausen, Switzerland

Manufacturer, Standards Setting / Certification, Training Provider

Manufacturing Operations System Design and Analysis

May 06, 1999 | C. Hilton, Manufacturing Strategic Support, Technology and Manufacturing Engineering, Intel Corp.

This paper describes manufacturing operations design and analysis at Intel. The complexities and forces of both the market and the manufacturing process combine to make the development of improved semiconductor fabrication manufacturing strategies (like lot dispatching, micro and macro scheduling policies, labor utilization, layout, etc.) particularly important......

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

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