Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.


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1757 SMT / PCB Assembly Related Technical Articles

Manufacturing Considerations When Implementing Voc-Free Flux Technology

May 07, 1999 | David Scheiner, Senior Technical Service Engineer Kester

In 1990 the United States Environmental Protection Agency Issued the Clean Air Act. The Clean Air Act and subsequent amendments are designed to limit the use of chemicals that contain volatile organic compounds (VOCs). The document goes into great detail setting limits for allowable VOC emissions for different industries....

Publisher: Kester

Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer

SMT Process Recommendations Defect Minimization Methods for a No-Clean SMT Process

May 07, 1999 | Kurt Rajewski

Key competitive advantages can be obtained through the minimization of process defects and disruptions. In today's electronic manufacturing processes there are many variables to optimize. By gaining an understanding of what the defects are, and where they come from, is a key step in the process towards defect free/six sigma manufacturing. In the last decade, Surface Mount Technology processes have been slowly converting towards the No-Clean philosophy. This new trend has spawned new processing issues which need to be addressed. This paper will investigate solutions to current problems in the processing of No-Clean SMT processes....

Publisher: Kester

Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer

Soldering to Gold Over Nickel Surfaces

May 07, 1999 | Dennis Bernier

There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold....

Publisher: Kester

Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer

Characterization of No Clean Solderpaste Residues: The Relationship to In-Circuit Testing

May 07, 1999 | Merlin Kister, Kester Solder

Many manufacturers have now completed the conversion to no clean solder paste. Many factors governed this initial conversion, among those being cosmetics, solder ability, and process ability. In circuit testing or probing through no clean solder paste residues has topically not been a major factor in the conversion decision for several reasons. Due to board design, solder paste was only used on one side of the board and not subjected to testing......

Publisher: Kester

Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer

The Nature of White Residue on Printed Circuit Assemblies

May 07, 1999 | Dennis F. Bernier, Vice President, Research & Development, Kester Solder

White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence....

Publisher: Kester

Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer

The Effect Of Metallic Impurities On The Wetting Properties Of Solder

May 07, 1999 | Dennis Bernier, Kester Solder Company

This paper is a report of a study made to determine the maximum allowable impurities in solder used for wave soldering applications. This report concludes with a list of impurities compiled from actual analyses of solder which caused production problems. A list of recommended maximum allowable impurities will assist in establishing reliable quality controls on the purity level of the solder in a wave soldering machine....

Publisher: Kester

Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer

Implementation of a High-Quality Dolby* Digital Decoder Using MMX™ Technology

May 07, 1999 | James C. Abel, Michael A. Julier

Software decoding of Dolby Digital allows it to become a baseline capability on the PC, with greater flexibility than a hardware approach. Intel's MMX™ technology provides instructions that can significantly speed up the execution of the Dolby Digital decoder, freeing up the processor to perform other tasks such as video decoding and/or audio enhancement. Intel has worked closely with Dolby Laboratories to define an implementation of Dolby Digital based on MMX technology that has achieved Dolby's certification of quality....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

MMX™ Microarchitecture of Pentium® Processors With MMX Technology and Pentium® II Microprocessors

May 07, 1999 | Michael Kagan, Simcha Gochman, Doron Orenstien, Derrick Lin

The MMX™ technology is an extension to the Intel Architecture (IA) aimed at boosting the performance of multimedia applications. This technology is the most significant IA extension since the introduction of the Intel386™ microprocessor. The challenge in implementing this technology came from retrofitting the new functionality into existing Pentium® and Pentium® Pro processor designs....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

MMX™ Technology Architecture Overview

May 07, 1999 | Millind Mittal, Alex Peleg, Uri Weiser

Media (video, audio, graphics, communication) applications present a unique opportunity for performance boost via use of Single Instruction Multiple Data (SIMD) techniques. While several of the computeintensive parts of media applications benefit from SIMD techniques, a significant portion of the code still is best suited for general purpose instruction set architectures. MMX™ technology extends the Intel Architecture (IA), the industry's leading general purpose processor architecture, to provide the benefits of SIMD for media applications....

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

A PROM Element Based on Salicide Agglomeration of Poly Fuses in a CMOS Logic Process

May 07, 1999 | Intel Corp.

A novel programmable element has been developed and evaluated for state of the art CMOS processes. This element is based on agglomeration of tVarious aspects of these programmable devices including characterization and optimization of physical and electrical aspects of the element, programming yield, and reliability have been studied. Development ofhe Ti-silicide layer on top of poly fuses. ...

Publisher: Intel Corporation

Intel Corporation

Intel designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Santa Clara, California, USA

Manufacturer

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