SMT, PCB, EMS Technical Articles

How to Select a Heat Sink

Jul 20, 1999 | Seri Lee, Advanced Thermal Engineering, Aavid Thermal Technologies, Inc.

With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors, thermal management bmomes a more and more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment......

Publisher: Aavid Thermalloy, LLC

Aavid Thermalloy, LLC

For nearly 50 years, Aavid has been the world leader in thermal management solutions.

Laconia, New Hampshire, USA

Manufacturer

Circuits Cost Cutting Tips

Jul 20, 1999 | Murrietta Circuits

What affects the price of boards? Number of layers: Limit the number of layers as much as possible. If higher quantities are anticipated, spend the extra time and money in engineering to minimize layer count.......

Publisher: Murrietta Circuits

Murrietta Circuits

A turnkey supplier of Electronic Manufacturing Services with a specialization in pcb design, pcb assembly, pcb manufacturing, pcb prototype.

Anaheim, California, USA

Consultant / Service Provider, Manufacturer

Simple, Effective Process Control in Wave Soldering

Jun 23, 1999 | Chrys Shea

This paper outlines the harmful effects of out-of-control process parameters and describes methods of measuring and tracking them to keep them in control. It addresses all critical variables of wave soldering: flux deposition, preheat application, conveyor speed, solder temperature and solder contact time....

Publisher: Siemens Process Industries and Drives

Siemens Process Industries and Drives

Siemens industrial manufacturing software, process automation, and automation and drives technology increases flexibility, cuts market launch lead time, and significantly reduces energy for manufacturing companies.

Alpharetta, Georgia, USA

Consultant / Service Provider, Manufacturer, Training Provider

Assembly Process Development for Chip-Scale and Chip-Size μBGA™

May 09, 1999 | Vern Solberg.

This paper will review chip-scale and chip-size package variations, solder alloy options, furnish guidelines for solder stencil development and outline the actual processes used to successfully produce SMT assemblies utilizing CSP technology. ...

Publisher: Tessera Technologies

Tessera Technologies

Tessera is focused on miniaturization technologies and has licensed its chip packaging technology to numerous semiconductor manufacturers, including Intel and Samsung Electronics.

San Jose, California, USA

Manufacturer

A Study of Lead-Free Solder Alloys

May 09, 1999 | Karl F. Seelig.

With the ongoing concern regarding environmental pollutants, Iead is being targeted in the electronic assembly arena. This paper highlights lead-free solders and the different combinations of elemental makeups. ...

Publisher: AIM Solder

AIM Solder

AIM is a leading global manufacturer of solder assembly materials for the electronics industry.

Montreal, Quebec, Canada

Manufacturer

Soldering Faster At Lower Temperatures: A Performance Comparison

May 09, 1999 | Doug Wilkerson, Technical Services Manager.

Studies and tests of comparative soldering iron thermal performance at low temperatures - Metcal direct power soldering technology compared to conventional stored energy soldering irons from leading manufacturers. ...

Publisher: Metcal

Metcal

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Manufacturer

Hand Soldering, Electrical Overstress, and Electrostatic Discharge

May 09, 1999 | Ron LaValley, Edwin Oh

This paper will give the reader a general understanding of EOS and ESD phenomena. It specifically addresses hand soldering's role in EOS and ESD and how to protect against and test for potential problems. It discusses how Metcal Systems address EOS and ESD concerns and how they differ from conventional soldering systems....

Publisher: Metcal

Metcal

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Manufacturer

Extending Soldering Iron Tip Life

May 09, 1999 | Metcal

This Technical Note discusses the construction of solder tips, the various failure modes associated with tip plating (cracking, wear, corrosion, and dewetting), how to diagnose those failure modes, and specific practices that can be taken to minimize or eliminate each one....

Publisher: Metcal

Metcal

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Manufacturer

Surface Mount Rework Techniques

May 09, 1999 | Brian Moylan

This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices. ...

Publisher: Metcal

Metcal

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Manufacturer

Managing the transition on a global scale -- changing the cleaning agent means changes to equipment, processes, process control specifications and standards.

May 09, 1999 | William G. Kenyon, Sr. Research Associate

The production of electronics began with hand soldering, followed by manual cleaning, which reached its peak during the NASA program. Each step in the process tended to be considered on a stand alone basis, without thought being given to the preceding and following steps. Since each step had its own set of specifications, this led to a "patchwork" approach to overall quality....

Publisher: DuPont