Electronics Manufacturing Technical Articles

Thermal Management of Hybrid Electronic Devices

Jul 21, 1999 | Barry Ritchie, Jamie Serensen

Thermal management is a growing challenge in the electronics industry. As the overall size of electronic devices grows smaller, the enclosed electronic assemblies operate at higher frequencies and generate more heat....

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Irvine, California, USA

The Effect of Solder Mask And Surface Mount Adhesive Types on a PCB Manufacturing Process.

Jul 21, 1999 | James A. Serenson Jr., Steven Marongelli

A high volume manufacturer of printed circuit boards (PCBs) had attempted for many years to locate an adhesive that was robust enough to meet their manufacturing needs. This proved to be a challenge because they needed the adhesive to accommodate a wide range of different dispensing equipment and board designs. The two key performance criteria required from the adhesive were dispensability and adhesion......

Irvine, California, USA

Reliability Considerations of Electrically Conductive Adhesives.

Jul 21, 1999 | Darryl J. Small

Isotropic conductive adhesives are typically silver filled epoxy resins. Electronics assemblers have evaluated these materials for a variety of unique interconnect applications. The goal is a conductive polymer that exhibits similar reliability and performance to traditional solder while offering the benefits of a polymer structure such as low temperature processing and good thermal stability as well as the ability to bond a variety of substrates....

Irvine, California, USA

Effects of Tg and CTE on Semiconductor Encapsulants

Jul 21, 1999 | Dr. Mark M. Konarski

As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. Although many factors influence component reliability, the biggest determinants of performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. This paper discusses exactly what these properties are, how they are measured, and why they are important to device-reliability....

Irvine, California, USA

Murata Manufacturing Co., Ltd.

Pre-Compliance Testing the Conducted Line Emissions of DC Supplied Circuits

Jul 20, 1999 | Paul Lee, Director of Engineering, Murata Power Solutions

It's quite common for a power supply (PSU) designer to work with a circuit designer to realize a system design compliant with international EMC regulations. PSU designers will be well aware of the requirement of the power supply to provide clean DC voltage and not disturb the AC mains voltage. However, they may not have any idea of the noise that can potentially be introduced to the mains through the PSU by the target circuit. Likewise, the circuit designers (digital or analogue) may not know what attenuation the PSU will provide....

Publisher: Murata Manufacturing Co., Ltd.

Murata is a leading company involved in the manufacturing of ceramic electronic components with an overwhelming share worldwide in ceramic filters, high frequency parts, and sensors.

Kyoto, Japan